International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Work programme (6)

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Fcst. Publ.

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IEC 60191-1 Ed. 3.0  

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices
47D/842/CD2013-09CDM
  • CDM
  • Committee Draft to be discussed at Meeting

2014-08

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

01M. Ahr2016-01
IEC 60191-2 f70 Ed. 1.0  

Proposed new package outline - P-ZMP-P165
47D/844/CD2013-09CDM
  • CDM
  • Committee Draft to be discussed at Meeting

2014-08

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

01M. Ahr2016-01
IEC 60191-2 f71 Ed. 1.0  

Proposed new package outline - P-ZMP-P89
47D/845/CD2013-09CDM
  • CDM
  • Committee Draft to be discussed at Meeting

2014-08

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

01M. Ahr2016-01
IEC 60191-2 f72 Ed. 1.0  

Proposed new package outline - P-UMP-Ax
47D/861/RR2015-06AMW
  • AMW
  • Approved Maintenance Work

2015-06

1CD
  • 1CD
  • 1st Committee Draft

2015-07

WG 1M. Ahr2017-12
IEC 60191-6-13 Ed. 2.0  

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)
47D/850A/CDV2013-05ADIS
  • ADIS
  • Approved for FDIS circulation

2014-08

DEC
  • DEC
  • Draft at Editing Check

2015-02

02J. Ohno2016-01
PNW 47D-860 Ed. 1.0  

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool
47D/860/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-11

WG 2C. H. Lee