International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Work programme (5)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 60191-1 ED3

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

47D/842/CD 2013-09 CDM
  • CDM
  • CD to be discussed at meeting

2014-08

ACDV
  • ACDV
  • Preparation of CDV

2016-02

WG 1 M. Ahr 2018-02
IEC 60191-2:1966/FRAG70 ED1

Proposed new package outline - P-ZMP-P165

47D/863/CDV 2013-09 AFDIS
  • AFDIS
  • Approved for FDIS

2016-05

TFDIS
  • TFDIS
  • Translation of FDIS

2016-12

WG 1 M. Ahr 2017-05
IEC 60191-2:1966/FRAG71 ED1

Proposed new package outline - P-ZMP-P89

47D/864/CDV 2013-09 AFDIS
  • AFDIS
  • Approved for FDIS

2016-05

TFDIS
  • TFDIS
  • Translation of FDIS

2016-12

WG 1 M. Ahr 2017-05
IEC 60191-2:1966/FRAG72 ED1

Proposed new package outline - P-UMP-Ax

47D/870/CD 2015-06 ACDV
  • ACDV
  • Approved for CDV

2016-05

TCDV
  • TCDV
  • Translation of CDV

2016-12

WG 1 M. Ahr 2018-04
IEC 60191-4/AMD1 ED3

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

47D/882/CD 2016-08 ACDV
  • ACDV
  • Approved for CDV

2016-11

TCDV
  • TCDV
  • Translation of CDV

2017-04

WG 2 2018-12