International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
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SC 47D Work programme (7)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47D-894

Future IEC 60191-7: Mechanical standardization of semiconductor devices – Part 7: Requirements to design electronics devices using thermal characteristics of semiconductor packages

47D/894/NP PNW
  • PNW
  • New Work Item Proposal

2017-07

PRVN
  • PRVN
  • Preparation of RVN document

2017-09

WG 2 Yutaka Kumano 2020-12
PNW 47D-895

Future IEC 60191-8: Mechanical standardization of semiconductor devices – Part 8: Requirements to Semiconductor Devices Packaging Materials from the Environment point of View - Low Cl and Br Molding Compound

47D/895/NP PNW
  • PNW
  • New Work Item Proposal

2017-07

PRVN
  • PRVN
  • Preparation of RVN document

2017-09

WG 2 Shuji Miyashita 2020-12
IEC 60191-1 ED3

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

47D/886/CDV PRVC
  • PRVC
  • Preparation of RVC

2017-03

APUB
  • APUB
  • Approved for publication

2017-12

WG 2 M. Ahr 2017-12
IEC 60191-2/FRAG70 ED1

Proposed new package outline - P-ZMP-P165

47D/863/CDV 2013-09 AFDIS
  • AFDIS
  • Approved for FDIS

2016-05

TFDIS
  • TFDIS
  • Translation of FDIS

2016-12

WG 1 M. Ahr 2018-01
IEC 60191-2/FRAG71 ED1

Proposed new package outline - P-ZMP-P89

47D/864/CDV 2013-09 AFDIS
  • AFDIS
  • Approved for FDIS

2016-05

TFDIS
  • TFDIS
  • Translation of FDIS

2016-12

WG 1 M. Ahr 2018-01
IEC 60191-2/FRAG72 ED1

Proposed new package outline - P-UMP-Ax

47D/870/CD 2015-06 ACDV
  • ACDV
  • Approved for CDV

2016-05

TCDV
  • TCDV
  • Translation of CDV

2016-12

WG 1 M. Ahr 2018-04
IEC 60191-4/AMD1 ED3

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

47D/882/CD 2016-08 ACDV
  • ACDV
  • Approved for CDV

2016-11

TCDV
  • TCDV
  • Translation of CDV

2017-04

WG 2 Shuji Miyashita 2018-12