International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47D |
Semiconductor devices packaging |
SC 47D Work programme
 Project Reference |  Stage | Document Reference | Init. Date | Current Stage | Next Stage | Mod | Fcst. Publ. Date |
|---|---|---|---|---|---|---|---|
IEC 60191-4 Ed. 3.0 Mechanical Standardization of Semiconductor Devices - Part 4:
Coding system and classification into forms of package outlines for semiconductor device packages
| RDIS
| 47D/813/RVC | 2010-01 | 2013-05 | 2013-08 | no | 2013-11 |
IEC 60191-6-13 Ed. 2.0 Semiconductor packaging - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA) | 1CD
| 47D/834/CD | 2013-05 | 2013-05 | 2013-09 | no | 2014-12 |
IEC 60191-6-16 Ed. 2.0 Semiconductor Packaging - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA | 1CD
| 47D/835/CD | 2013-05 | 2013-05 | 2013-09 | no | 2014-12 |
IEC 60191-6-5 Ed. 2.0 Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
| NCD
| 47D/830/RVD | 2009-08 | 2012-12 | 2013-06 | no | 2013-01 |
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