International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Circuits intégrés

 
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SC 47A Programme de Travail (7)

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IEC 62132-1 Ed. 2.0  

Circuits intégrés - Mesure de l'immunité électromagnétique - Partie 1: Conditions générales et définitions
47A/923/CDV2010-11DEC
  • DEC
  • Draft at Editing Check

2015-05

 

09Osami Wada2015-12
IEC 62228-2 Ed. 1.0  

Integrated circuits - EMC evaluation of LIN transceivers
47A/960/CD2014-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

09F. Klotz2016-12
IEC 62433-2 Ed. 2.0  

EMC IC Modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
47A/959/CD2015-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

02A. Ramanujan2016-12
IEC 62433-3 Ed. 1.0  

EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
47A/957/CD2014-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

02A.Ramanujan2016-12
IEC 62433-4 Ed. 1.0  

Modèles de circuits intégrés pour la CEM - Partie 4: Modèles de circuits intégrés pour la simulation du comportement d'immunité aux radiofréquences - Modélisation de l'immunité conduite (ICIM-CI)
47A/956/CDV2014-06CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-02

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-08

02C. Marot2016-04
IEC/TR 61967-1-1 Ed. 2.0  

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
47A/953/DTR2014-02APUB
  • APUB
  • Draft approved for publication

2015-04

DEC
  • DEC
  • Draft at Editing Check

2015-06

09J. Shepherd2015-11
PNW 47A-961 Ed. 1.0  

Semiconductor devices - Advanced hybrid integrated circuits - Alignment of stacked dies having fine pitch interconnect
47A/961/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-07

07K. W. Kwon