International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
export to xls file

SC 47A Work programme (7)

sort up

Project

Reference

Document

Reference

Init.

Date

sort upsort down

Current

Stage

sort upsort down

Next

Stage

Working

Group

sort upsort down

Project

Leader

sort upsort down

Fcst. Publ.

Date

IEC 62132-1 Ed. 2.0  

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions
47A/923/CDV2010-11DEC
  • DEC
  • Draft at Editing Check

2015-05

 

09Osami Wada2015-12
IEC 62228-2 Ed. 1.0  

Integrated circuits - EMC evaluation of LIN transceivers
47A/960/CD2014-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

09F. Klotz2016-12
IEC 62433-2 Ed. 2.0  

EMC IC Modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)
47A/959/CD2015-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

02A. Ramanujan2016-12
IEC 62433-3 Ed. 1.0  

EMC IC modelling - Part 3: Models of Integrated Circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)
47A/957/CD2014-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

02A.Ramanujan2016-12
IEC 62433-4 Ed. 1.0  

EMC IC modelling - Part 4: Models of Integrated Circuits for RF Immunity behavioural simulation - Conducted Immunity modelling (ICIM-CI)
47A/956/CDV2014-06CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-02

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-08

02C. Marot2016-04
IEC/TR 61967-1-1 Ed. 2.0  

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format
47A/953/DTR2014-02APUB
  • APUB
  • Draft approved for publication

2015-04

DEC
  • DEC
  • Draft at Editing Check

2015-06

09J. Shepherd2015-11
PNW 47A-961 Ed. 1.0  

Semiconductor devices - Advanced hybrid integrated circuits - Alignment of stacked dies having fine pitch interconnect
47A/961/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-07

07K. W. Kwon