International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
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SC 47A Work programme (9)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

IEC 61967-1 ED2

Integrated circuits - Measurement of electromagnetic emissions - Part 1: General conditions and definitions

47A/1022/CD 2017-01 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2018-01

WG 9 Ryosuke Inagaki 2020-01
IEC 62132-4 ED2

Integrated circuits - Measurement of electoromagnatic immuity - Part 4: Direct RF power injection method

47A/981/RR 2015-12 ACD
  • ACD
  • Approved for CD

2015-12

CD
  • CD
  • Draft circulated as CD

2016-12

WG 9 F. Klotz 2018-12
IEC 62228-1 ED1

Integrated circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

47A/1018/CDV 2015-10 CCDV
  • CCDV
  • Draft circulated as CDV

2017-07

PRVC
  • PRVC
  • Preparation of RVC

2017-09

WG 9 F. Klotz 2018-07
IEC 62228-3 ED1

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

47A/1023/CD 2015-12 PCC
  • PCC
  • Preparation of CC

2017-09

2017-09

WG 9 F. Klotz 2018-12
IEC 62433-1 ED1

Integrated circuits – EMC IC modelling - Part 1: General modelling framework

47A/1011/CD 2016-12 ACDV
  • ACDV
  • Approved for CDV

2017-09

TCDV
  • TCDV
  • Translation of CDV

2018-01

WG 2 Abhishek Ramanujan 2018-12
IEC 62433-6 ED1

EMC IC modelling – Part 6: Models of integrated circuits for Pulse immunity behavioural simulation - Conducted Pulse Immunity (ICIM-CPI)

47A/1019/CD 2017-05 ACD
  • ACD
  • Approved for CD

2017-09

2CD
  • 2CD

2018-01

WG 2 Christian Marot 2019-12
IEC 63011-1 ED1

Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions

47A/996/CD 2016-02 CDM
  • CDM
  • CD to be discussed at meeting

2017-04

2017-06

WG 7 K. W. Kwon 2019-02
IEC 63011-2 ED1

Integrated circuits - Three dimensional integrated circuits - Part 2: Alignment of stacked dies having fine pitch interconnect

47A/1021/CD 2015-06 PCC
  • PCC
  • Preparation of CC

2017-09

2017-09

WG 7 K. W. Kwon 2018-06
IEC 63011-3 ED1

Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of Through Silicon Via

47A/1025/CDV 2016-05 CCDV
  • CCDV
  • Draft circulated as CDV

2017-08

PRVC
  • PRVC
  • Preparation of RVC

2017-11

WG 7 M. Takahashi 2018-10