International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Programme de Travail (22)

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IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

WG 3Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

Essais d'environnement - Partie 3-13: Documentation d'accompagnement et guide sur les essais T: Brasage
91/1241/CDV2009-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-03

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-09

WG 3Walter Huck2016-05
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1215/CD2014-09ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 10T. Suzuki2017-01
IEC 61189-3-719 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et les autres structures et assemblages d'interconnexion - Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours des cycles thermiques
91/1189/CDV2012-11ADIS
  • ADIS
  • Approved for FDIS circulation

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-03

WG 10Udo Welzel2015-12
IEC 61189-3-913 Ed. 1.0  

Méthodes d essai pour les matériaux électriques, les cartes imprimées et autres structures d interconnexion et ensembles - Partie 3 -913: Méthodes d'essais pour la conductivité thermique des circuits imprimés pour les LED à forte luminosité
91/1214/CDV2010-10ADIS
  • ADIS
  • Approved for FDIS circulation

2015-05

DEC
  • DEC
  • Draft at Editing Check

2015-08

WG 10Kunio Takahara2016-01
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-06

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 3Graham Naisbitt2016-10
IEC 61189-5-5 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2015-05

WG 3Graham Naisbitt2016-01
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1255/CDV2014-12CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-11

WG 2K. Tsuruta2016-07
IEC 61191-1 Ed. 3.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
91/1276/CD2015-061CD
  • 1CD
  • 1st Committee Draft

2015-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-09

WG 2R. Taube2017-06
IEC 61191-2 Ed. 3.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
91/1268/RR2015-06AMW
  • AMW
  • Approved Maintenance Work

2015-06

1CD
  • 1CD
  • 1st Committee Draft

2015-06

WG 2R. Taube2017-06
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

WG 2R. Taube2016-01
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

WG 2R. Taube2016-01
IEC 61249-2-43 Ed. 1.0  

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

WG 4Douglas Sober2016-01
IEC 61249-2-44 Ed. 1.0  

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

WG 4Douglas Sober2016-01
IEC 62090 Ed. 2.0  

Product package labels for electronic components using bar code and two-dimensional symbologies
91/1271/RR2015-06AMW
  • AMW
  • Approved Maintenance Work

2015-06

1CD
  • 1CD
  • 1st Committee Draft

2016-01

WG 1H. Takai2018-01
IEC 62326-20 Ed. 1.0  

Cartes imprimees - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité
91/1219/CDV2010-10ADIS
  • ADIS
  • Approved for FDIS circulation

2015-05

DEC
  • DEC
  • Draft at Editing Check

2015-08

WG 4Kunio Takahara2016-01
IEC 62699 Ed. 1.0  

Règles de mise en correspondance et méthodes d'échange pour bibliothèques de composants hétérogènes
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 14Mitsuru Takahashi, Jaeho Lee2016-01
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1221/CD2014-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

WG 3Hiroshi Nishikawa2016-09
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1220/DTR2010-08APUB
  • APUB
  • Draft approved for publication

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-08

WG 6Hyun Ho Kim2016-01
PNW 91-1247 Ed. 1.0  

Component shape data specification for CAD library Part 2: 3D shape data specifications
91/1247/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-06

WG 12T. Murata 
PNW 91-1266 Ed. 1.0  

Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
91/1266/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 3H. Nishikawa 
PNW 91-1269 Ed. 1.0  

Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
91/1269/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 3H. Okamoto