International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Programme de Travail (18)

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IEC 60068-2-69 Ed. 3.0  

Essais d'environnement: Partie 2-69: Essais - Essai Te: Essai de brasabilité des composants et cartes électroniques par la méthode de la balance de mouillage (mesure de la force)
91/1326/CDV2012-02CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-02

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-08

WG 3Graham Naisbitt2017-03
IEC 61188-6-4 Ed. 1.0  

Printed boards and printed board assemblies Design and use Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design
91/1357/NP2016-07ANW
  • ANW
  • Approved New Work

2016-07

1CD
  • 1CD
  • 1st Committee Draft

2017-03

12H. Ishibashi2019-03
IEC 61188-7 Ed. 2.0  

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
91/1319/CD2015-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-11

WG 12R. Taube2018-03
IEC 61189-5-503 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
91/1336/CDV2015-09CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-03

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-09

WG 3H. Okamoto2017-05
IEC 61189-5-601 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow solderability test and heat resistance test for test board and solder joint
91/1322/RR2015-11AMW
  • AMW
  • Approved Maintenance Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-09

WG 3T. Yamamoto2018-11
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1255/CDV2014-12ADIS
  • ADIS
  • Approved for FDIS circulation

2016-03

DEC
  • DEC
  • Draft at Editing Check

2016-09

WG 2K. Tsuruta2017-02
IEC 61191-1 Ed. 3.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
91/1367/CD2015-062CD
  • 2CD
  • 2nd Committee Draft

2016-05

A3CD
  • A3CD
  • Approved for 3rd Committee Draft

2016-08

WG 2R. Taube2017-06
IEC 61191-2 Ed. 3.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
91/1285/CD2015-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-05

WG 2R. Taube2017-09
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1300/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-12

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1290/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 62090 Ed. 2.0  

Product package labels for electronic components using bar code and two-dimensional symbologies
91/1318/CD2015-061CD
  • 1CD
  • 1st Committee Draft

2015-11

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-02

WG 1H. Takai2018-01
IEC 62739-3 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
91/1344/CD2015-10ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-04

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2017-02

WG 3H. Nishikawa2017-09
IEC 62878-1 Ed. 1.0  

Device embedded substrate - Generic specification
91/1297/NP2015-12ANW
  • ANW
  • Approved New Work

2015-12

1CD
  • 1CD
  • 1st Committee Draft

2016-08

WG 6W. Huck2018-08
IEC 62878-2-5 Ed. 1.0  

Device embedded substrate - Part 2-5: Guidelines - Implementation of 3D data format requirements for device embedded substrate
91/1321/NP2016-03ANW
  • ANW
  • Approved New Work

2016-03

1CD
  • 1CD
  • 1st Committee Draft

2017-07

WG 6H. Tomokage2019-07
IEC/TR 61189-3-914 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines
91/1378/DTR CDTR
  • CDTR
  • Circulated Draft Technical Report

2016-06

APUB
  • APUB
  • Draft approved for publication

2016-11

2017-05
IEC/TR 63051 Ed. 1.0  

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)
91/1349/DTR CDTR
  • CDTR
  • Circulated Draft Technical Report

2016-03

APUB
  • APUB
  • Draft approved for publication

2016-08

2017-01
PNW 91-1301 Ed. 1.0  

Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning
91/1301/NP PNW
  • PNW
  • Proposed New Work

2015-09

ANW
  • ANW
  • Approved New Work

2016-02

WG 10D. J. Sober 
PNW 91-1353-A Ed. 1.0  

Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)
91/1353A/NP PNW
  • PNW
  • Proposed New Work

2016-03

ANW
  • ANW
  • Approved New Work

2016-08

WG 10C. Hunt