International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Programme de Travail (18)

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IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

03Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

Essais d'environnement - Partie 3-13: Documentation d'accompagnement et guide sur les essais T: Brasage
91/1241/CDV2009-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-03

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-09

03Walter Huck2016-05
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1215/CD2014-09ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

10T. Suzuki2017-01
IEC 61189-3-719 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et les autres structures et assemblages d'interconnexion - Partie 3-719: Méthodes d'essai pour les structures d'interconnexion (cartes imprimées) - Contrôles de la variation de résistance des trous métallisés uniques (PTH) au cours des cycles thermiques
91/1189/CDV2012-11ADIS
  • ADIS
  • Approved for FDIS circulation

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-03

10Udo Welzel2015-08
IEC 61189-3-913 Ed. 1.0  

Méthodes d essai pour les matériaux électriques, les cartes imprimées et autres structures d interconnexion et ensembles - Partie 3 -913: Méthodes d'essais pour la conductivité thermique des circuits imprimés pour les LED à forte luminosité
91/1214/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

10Kunio Takahara2016-01
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-111CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

03Graham Naisbitt2017-12
IEC 61189-5-5 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2015-05

03Graham Naisbitt2015-09
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1231/CD2014-12A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-07

02K. Tsuruta2016-07
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

02R. Taube2015-09
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

02R. Taube2015-09
IEC 61249-2-43 Ed. 1.0  

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-43: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/papier cellulose époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-10
IEC 61249-2-44 Ed. 1.0  

Matériaux pour circuits imprimés et autres structures d'interconnexion - Partie 2-44: Matériaux de base renforcés, plaqués et non plaqués - Feuilles stratifiées renforcées en verre de type E tissé/non-tissé époxyde non halogéné, plaquées cuivre, d'inflammabilité définie (essai de combustion verticale) pour les assemblages sans plomb
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-10
IEC 62326-20 Ed. 1.0  

Cartes imprimees - Partie 20: Cartes de circuits imprimés destinées aux LED à haute luminosité
91/1219/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

04Kunio Takahara2016-02
IEC 62699 Ed. 1.0  

Règles de mise en correspondance et méthodes d'échange pour bibliothèques de composants hétérogènes
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

14Mitsuru Takahashi, Jaeho Lee2015-09
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1221/CD2014-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

03Hiroshi Nishikawa2017-03
IEC/PAS 62878-2-5 Ed. 1.0  

Device embedded substrate - Guidelines - Data format
91/1257/PAS CDPAS
  • CDPAS
  • Circulated Draft for Publicly Available Spec.

2015-03

 

 
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1220/DTR2010-08APUB
  • APUB
  • Draft approved for publication

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-08

06Hyun Ho Kim2016-01
PNW 91-1247 Ed. 1.0  

Component shape data specification for CAD library Part 2: 3D shape data specifications
91/1247/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-06

12T. Murata