International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Techniques d'assemblage des composants électroniques

 
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TC 91 Programme de Travail (30)

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IEC 60068-2-58 Ed. 4.0  

Essais d'environnement - Partie 2-58: Essais - Essai Td: Méthodes d'essai de la brasabilité, résistance de la métallisation à la dissolution et résistance à la chaleur de brasage des composants pour montage en surface (CMS)
91/1136/CDV2011-02CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2013-10

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-04

03Msashi Aoki2014-12
IEC 60068-2-69 Ed. 3.0  

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronics components for surface mounting devices (SMD) by the wetting balance method
91/1026/RR2012-02AMW
  • AMW
  • Approved Maintenance Work

2012-02

1CD
  • 1CD
  • 1st Committee Draft

2014-09

03Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
91/994/CD2009-10ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2012-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-03

03Walter Huck2015-07
IEC 60194 Ed. 6.0  

Conception, fabrication et assemblage des cartes imprimees - Termes et definitions
91/1004/CDV2010-02ADIS
  • ADIS
  • Approved for FDIS circulation

2013-08

DEC
  • DEC
  • Draft at Editing Check

2014-02

05Minsu Lee2014-07
IEC 61189-2-721 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les cartes imprimées et autres structures d'interconnexion et ensembles - Partie 2-721: Méthodes d'essai des matériaux pour structures d'interconnexion - Mesure de la permittivité relative et de la tangente de perte pour les stratifiés recouverts de cuivre en hyperfréquences à l'aide d'un résonateur diélectrique en anneaux fendus
91/1110/CD2013-04ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2013-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-03

10Tracy Cai2015-06
IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
91/1152/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-02

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-10

10Udo Welzel2016-02
IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
91/1186/CD2010-103CD
  • 3CD
  • 3rd Committee Draft

2014-04

A4CD
  • A4CD
  • Approved for 4th Committee Draft

2014-07

10Kunio Takahara2015-10
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies - Guidance
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2014-12

03Graham Naisbitt2017-12
IEC 61189-5-2 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 5-2: Méthodes d'essai des assemblages de cartes à circuit imprimé: Flux de brasage
91/1121/CDV2011-11ADIS
  • ADIS
  • Approved for FDIS circulation

2014-03

DEC
  • DEC
  • Draft at Editing Check

2014-06

03Kaichi Tsuruta2014-11
IEC 61189-5-3 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 5-3: Méthodes d'essai des assemblages de cartes à circuit imprimé: Pâte de brasage
91/1122/CDV2011-11ADIS
  • ADIS
  • Approved for FDIS circulation

2014-03

DEC
  • DEC
  • Draft at Editing Check

2014-06

03Kaichi Tsuruta2014-11
IEC 61189-5-4 Ed. 1.0  

Méthodes d'essai pour les matériaux électriques, les structures d'interconnexion et les ensembles - Partie 5-4: Méthodes d'essai des assemblages de cartes à circuit imprimé: Alliages à braser et brasages solides fluxés et non fluxés
91/1123/CDV2011-11ADIS
  • ADIS
  • Approved for FDIS circulation

2014-03

DEC
  • DEC
  • Draft at Editing Check

2014-06

03Kaichi Tsuruta2014-11
IEC 61189-5-5 Ed. 1.0  

General test method for measuring residues inducing Electrochemical Degradation Mechanism
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2014-12

03Graham Naisbitt2017-12
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2013-12

02Dieter Bergman2015-06
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2013-12

02Dieter Bergman2015-06
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1099/CD2013-04ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2013-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-04

04Douglas Sober2015-07
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1100A/CD2013-04ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2013-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-04

04Douglas Sober2015-07
IEC 61249-6-3 Ed. 1.0  

Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics
  PWI
  • PWI
  • Potential new work item

2007-01

 

04Douglas Sober2008-01
IEC 61760-4 Ed. 1.0  

Technique du montage en surface - Partie 4: Méthode normalisée de classification, d'emballage, d'étiquetage et de manipulation des appareils sensibles à l'humidité
91/1127/CDV2011-06CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2013-10

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-04

01Walter Huck2014-11
IEC 62137-4 Ed. 1.0  

Technique d'assemblage des composants électroniques - Partie 4: Méthodes d'essais d'endurance des joints brasés des composants pour montage en surface à boîtiers de type matriciel
91/1090/CDV2011-11RDIS
  • RDIS
  • Text for FDIS received and registered

2014-04

CDIS
  • CDIS
  • Draft circulated as FDIS

2014-06

03Tsuyoshi Yamamoto2014-10
IEC 62326-20 Ed. 1.0  

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
91/1184/CD2010-103CD
  • 3CD
  • 3rd Committee Draft

2014-04

A4CD
  • A4CD
  • Approved for 4th Committee Draft

2014-07

04Kunio Takahara2015-10
IEC 62699 Ed. 1.0  

Règles de mise en correspondance et méthodes d'échange pour bibliothèques de composants hétérogènes
91/1078/CDV2010-08CDVM
  • CDVM
  • Committee draft with vote for meeting

2013-05

ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-03

WG14Mitsuru Takahashi, Jaeho Lee2013-10
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1139/NP2014-01ANW
  • ANW
  • Approved New Work

2014-01

1CD
  • 1CD
  • 1st Committee Draft

2014-07

03Hiroshi Nishikawa2016-06
IEC 62878-1-1 Ed. 1.0  

Substrat intégré à l'appareil - Spécification générique - Méthode d'essai
91/1124/CDV2012-03ADIS
  • ADIS
  • Approved for FDIS circulation

2014-02

DEC
  • DEC
  • Draft at Editing Check

2014-06

06Kunio Takahara2014-11
IEC/PAS 61182-12 Ed. 1.0  

Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology
91/1182/PAS CDPAS
  • CDPAS
  • Circulated Draft for Publicly Available Spec.

2014-04

APUB
  • APUB
  • Draft approved for publication

2014-07

 
IEC/TR 60068-3-12 Ed. 2.0  

Essais d'environnement - Partie 3-12: Documentation d'accompagnement et guide - Méthode d'évaluation d'un profil de température possible de soudage sans plomb par refusion
91/1158/DTR2013-11APUB
  • APUB
  • Draft approved for publication

2014-03

DEC
  • DEC
  • Draft at Editing Check

2014-10

03Udo Welzel2015-03
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1138A/CD2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-04

CDTR
  • CDTR
  • Circulated Draft Technical Report

2014-09

06Hyun Ho Kim2015-02
IEC/TS 62878-2-1 Ed. 1.0  

Substrat intégré à l'appareil - Partie 2-1: Directives - Description générale de la technologie
91/1142/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
IEC/TS 62878-2-3 Ed. 1.0  

Substrat intégré à l'appareil - Partie 2-3: Directives - Guide de conception
91/1143/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
IEC/TS 62878-2-4 Ed. 1.0  

Substrat intégré à l'appareil - Partie 2-4: Directives - Groupes d'éléments d'essai (TEG)
91/1144/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
PNW 91-1185 Ed. 1.0  

Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1185/NP PNW
  • PNW
  • Proposed New Work

2014-04

ANW
  • ANW
  • Approved New Work

2014-08

10T. Suzuki