International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (20)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 91-1353-A ED1

Future IEC 61189-5-504 Ed.1: Test methods for electrical materials, interconnection structures and assemblies - Part 5-504: General test methods for materials and assemblies - Process ionic contamination testing (PICT)

91/1353A/NP PRVN
  • PRVN
  • Preparation of RVN

2016-05

2016-06

WG 10 C. Hunt
IEC 60068-2-58:2015/AMD1 ED4

Environmental testing - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

91/1389/CD 2016-08 TCDV
  • TCDV
  • Translation of CDV

2016-10

CCDV
  • CCDV
  • Draft circulated as CDV

2016-12

WG 3 H. Oshima 2018-02
IEC 60068-2-69 ED3

Environmental testing: Part 2-69: Tests - Test Te/Tc: Solderability testing of electronic components and printed boards by the wetting balance (force measurement) method

91/1405/FDIS 2012-02 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-12

PRVD
  • PRVD
  • Preparation of RVD document

2017-01

WG 3 Graham Naisbitt 2017-03
IEC 60068-2-82 ED2

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

91/1392/RR 2016-08 ACD
  • ACD
  • Approved for CD

2016-08

CD
  • CD
  • Draft circulated as CD

2016-11

WG 3 I. Sakamoto 2018-12
IEC 61188-6-4 ED1

Printed boards and printed board assemblies Design and use Part 6-4: Generic requirements for dimensional drawings of SMDs from viewpoint of land-pattern design

91/1357/NP 2016-07 ACD
  • ACD
  • Approved for CD

2016-07

CD
  • CD
  • Draft circulated as CD

2017-03

WG 12 H. Ishibashi 2019-03
IEC 61188-7 ED2

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

91/1382/CDV 2015-08 CCDV
  • CCDV
  • Draft circulated as CDV

2016-12

PRVC
  • PRVC
  • Preparation of RVC

2016-12

WG 12 R. Taube 2017-10
IEC 61189-2-630 ED1

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning

91/1301/NP 2016-08 ACD
  • ACD
  • Approved for CD

2016-08

CD
  • CD
  • Draft circulated as CD

2017-03

WG 10 D. J. Sober 2019-03
IEC TR 61189-3-914 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-914: Test method for thermal conductivity of printed circuit boards for high-brightness LEDs - Guidelines

91/1378/DTR 2016-06 APUB
  • APUB
  • Approved for publication

2016-10

TPUB
  • TPUB
  • Translation of publication

2017-02

2017-07
IEC 61189-5-503 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards

91/1336/CDV 2015-09 AFDIS
  • AFDIS
  • Approved for FDIS

2016-11

TFDIS
  • TFDIS
  • Translation of FDIS

2017-05

WG 3 H. Okamoto 2017-10
IEC 61189-5-601 ED1

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow solderability test and heat resistance test for test board and solder joint

91/1322/RR 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-09

WG 3 T. Yamamoto 2018-11
IEC 61190-1-3 ED3

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications

91/1255/CDV 2014-12 AFDIS
  • AFDIS
  • Approved for FDIS

2016-03

TFDIS
  • TFDIS
  • Translation of FDIS

2016-09

WG 2 K. Tsuruta 2017-06
IEC 61191-1 ED3

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

91/1367/CD 2015-06 CDM
  • CDM
  • CD to be discussed at meeting

2016-08

2016-11

WG 2 R. Taube 2017-06
IEC 61191-2 ED3

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

91/1386/CDV 2015-06 CCDV
  • CCDV
  • Draft circulated as CDV

2016-10

PRVC
  • PRVC
  • Preparation of RVC

2016-12

WG 2 R. Taube 2017-11
IEC 61191-3 ED2

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

91/1300/CD 2012-11 TCDV
  • TCDV
  • Translation of CDV

2016-10

CCDV
  • CCDV
  • Draft circulated as CDV

2016-12

WG 2 R. Taube 2018-02
IEC 61191-4 ED2

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

91/1290/CD 2012-11 TCDV
  • TCDV
  • Translation of CDV

2016-10

CCDV
  • CCDV
  • Draft circulated as CDV

2016-12

WG 2 R. Taube 2018-02
IEC 62090 ED2

Product package labels for electronic components using bar code and two-dimensional symbologies

91/1394/CDV 2015-06 CCDV
  • CCDV
  • Draft circulated as CDV

2016-10

PRVC
  • PRVC
  • Preparation of RVC

2017-01

WG 1 H. Takai 2017-12
IEC 62739-3 ED1

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods

91/1368/CDV 2015-10 RPUB
  • RPUB
  • Publication received and registered

2016-12

RPUB
  • RPUB
  • Text for PUB received and registered

2017-02

WG 3 2017-03
IEC 62878-1 ED1

Device embedded substrate - Generic specification

91/1297/NP 2015-12 ACD
  • ACD
  • Approved for CD

2015-12

CD
  • CD
  • Draft circulated as CD

2016-08

WG 6 W. Huck 2018-08
IEC 62878-2-5 ED1

Device embedded substrate - Part 2-5: Guidelines - Implementation of 3D data format requirements for device embedded substrate

91/1321/NP 2016-03 ACD
  • ACD
  • Approved for CD

2016-03

CD
  • CD
  • Draft circulated as CD

2017-07

WG 6 H. Tomokage 2019-07
IEC TR 63051 ED1

Documentation on design automation subjects - Mathematical algorithm hardware description languages for system level modeling and verification (HDLMath)

91/1349/DTR 2016-03 RPUB
  • RPUB
  • Text for PUB received and registered

2016-11

BPUB
  • BPUB
  • Publication being printed

WG 13 2017-03