International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (22)

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IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-02ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-12

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-02

WG 3Graham Naisbitt2017-06
IEC 60068-3-13 Ed. 1.0  

Environmental testing - Part 3-13: Supporting documentation and guidance on test T - Soldering.
91/1241/CDV2009-10RDIS
  • RDIS
  • Text for FDIS received and registered

2016-01

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-03

WG 3Walter Huck2016-07
IEC 61188-7 Ed. 2.0  

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
91/1319/CD2015-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-11

WG 12R. Taube2018-03
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1286/CDV2014-09ADIS
  • ADIS
  • Approved for FDIS circulation

2016-01

DEC
  • DEC
  • Draft at Editing Check

2016-03

WG 10T. Suzuki2016-08
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-1: General test methods for materials and assemblies - Guidance for printed board assemblies
91/1273/CDV2011-11CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-08

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-02

WG 3K. Tsuruta2016-10
IEC 61189-5-503 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
91/1307/CD2015-09ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-12

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 3H. Okamoto2018-01
IEC 61189-5-601 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow solderability test and heat resistance test for test board and solder joint
91/1322/RR2015-11AMW
  • AMW
  • Approved Maintenance Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-09

WG 3T. Yamamoto2018-11
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1255/CDV2014-12CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-11

WG 2K. Tsuruta2016-07
IEC 61191-1 Ed. 3.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
91/1276/CD2015-06A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-01

2CD
  • 2CD
  • 2nd Committee Draft

2016-03

WG 2R. Taube2017-06
IEC 61191-2 Ed. 3.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
91/1285/CD2015-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-05

WG 2R. Taube2017-09
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1300/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-12

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1290/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2016-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-09

WG 2R. Taube2018-01
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1175/CDV2013-04RDIS
  • RDIS
  • Text for FDIS received and registered

2016-01

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-04

WG 4Douglas Sober2016-07
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1176/CDV2013-04RDIS
  • RDIS
  • Text for FDIS received and registered

2016-01

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-04

WG 4Douglas Sober2016-07
IEC 61671-6 Ed. 1.0  

IEEE Standard for Automatic Test Markup Language (ATML) Test Station Description (IEEE 1671.6 - 2015)
91/1317/FDIS DEC
  • DEC
  • Draft at Editing Check

2016-01

BPUB
  • BPUB
  • Publication being printed

2016-01

WG 152016-05
IEC 62090 Ed. 2.0  

Product package labels for electronic components using bar code and two-dimensional symbologies
91/1318/CD2015-061CD
  • 1CD
  • 1st Committee Draft

2015-11

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-02

WG 1H. Takai2018-01
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1265/CDV2014-01ADIS
  • ADIS
  • Approved for FDIS circulation

2015-11

DEC
  • DEC
  • Draft at Editing Check

2016-03

WG 3Hiroshi Nishikawa2016-08
IEC 62739-3 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
91/1266/NP2015-10ANW
  • ANW
  • Approved New Work

2015-10

1CD
  • 1CD
  • 1st Committee Draft

2016-01

WG 3H. Nishikawa2018-01
IEC 62878-1 Ed. 1.0  

Device embedded substrate - Generic specification
91/1297/NP2015-12ANW
  • ANW
  • Approved New Work

2015-12

1CD
  • 1CD
  • 1st Committee Draft

2016-08

WG 6W. Huck2018-08
PNW 91-1291 Ed. 1.0  

Future IEC/TS 61189-3-XXX: Appearance Inspection Method for Plated Surfaces on PWB
91/1291/NP PNW
  • PNW
  • Proposed New Work

2015-08

ANW
  • ANW
  • Approved New Work

2015-12

WG 10K. Nonaka 
PNW 91-1301 Ed. 1.0  

Future IEC 61189-2-XXX Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-XXX: Test methods for printed board and assembly materials - Moisture absorption after pressure vessel conditioning
91/1301/NP PNW
  • PNW
  • Proposed New Work

2015-09

ANW
  • ANW
  • Approved New Work

2016-02

WG 10D. J. Sober 
PNW 91-1321 Ed. 1.0  

Future IEC 62878-2-5: Device embedded substrate Part 2-5: Implementation of 3D data format requirements for device embedded substrate
91/1321/NP PNW
  • PNW
  • Proposed New Work

2015-11

ANW
  • ANW
  • Approved New Work

2016-04

WG 6H. Tomokage