International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (18)

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IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

03Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
91/1241/CDV2009-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-03

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-09

03Walter Huck2016-05
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1215/CD2014-09ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

10T. Suzuki2017-01
IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
91/1189/CDV2012-11ADIS
  • ADIS
  • Approved for FDIS circulation

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-03

10Udo Welzel2015-12
IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
91/1214/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

10Kunio Takahara2016-01
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-111CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

03Graham Naisbitt2017-12
IEC 61189-5-5 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2015-05

03Graham Naisbitt2015-09
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1231/CD2014-12A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-07

02K. Tsuruta2016-07
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

02R. Taube2015-09
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

02R. Taube2015-09
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-10
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-10
IEC 62326-20 Ed. 1.0  

Printed boards - Part 20: Printed circuit board for high-brightness LEDs
91/1219/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

04Kunio Takahara2016-02
IEC 62699 Ed. 1.0  

Mapping rules and exchange methods for heterogeneous parts libraries
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

14Mitsuru Takahashi, Jaeho Lee2015-09
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1221/CD2014-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

03Hiroshi Nishikawa2017-03
IEC/PAS 62878-2-5 Ed. 1.0  

Device embedded substrate - Guidelines - Data format
91/1257/PAS CDPAS
  • CDPAS
  • Circulated Draft for Publicly Available Spec.

2015-03

 

 
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1220/DTR2010-08APUB
  • APUB
  • Draft approved for publication

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-08

06Hyun Ho Kim2016-01
PNW 91-1247 Ed. 1.0  

Component shape data specification for CAD library Part 2: 3D shape data specifications
91/1247/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-06

12T. Murata