International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
export to xls file

TC 91 Work programme (30)

sort up

Project

Reference

Document

Reference

Init.

Date

sort upsort down

Current

Stage

sort upsort down

Next

Stage

Working

Group

sort upsort down

Project

Leader

sort upsort down

Fcst. Publ.

Date

IEC 60068-2-58 Ed. 4.0  

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
91/1136/CDV2011-02ADIS
  • ADIS
  • Approved for FDIS circulation

2014-07

DEC
  • DEC
  • Draft at Editing Check

2014-10

03Msashi Aoki2015-03
IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

03Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
91/994/CD2009-10ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2012-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-07

03Walter Huck2015-11
IEC 60194 Ed. 6.0  

Printed board design, manufacture and assembly - Terms and definitions
91/1004/CDV2010-02DEC
  • DEC
  • Draft at Editing Check

2014-07

 

05Minsu Lee2015-02
IEC 61189-2-721 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
91/1169/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

10Tracy Cai2015-06
IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
91/1152/CD2012-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-02

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-10

10Udo Welzel2015-10
IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
91/1186/CD2010-103CD
  • 3CD
  • 3rd Committee Draft

2014-04

A4CD
  • A4CD
  • Approved for 4th Committee Draft

2014-07

10Kunio Takahara2015-10
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-111CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

03Graham Naisbitt2017-12
IEC 61189-5-2 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
91/1121/CDV2011-11DEC
  • DEC
  • Draft at Editing Check

2014-08

 

03Kaichi Tsuruta2015-02
IEC 61189-5-3 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
91/1122/CDV2011-11DEC
  • DEC
  • Draft at Editing Check

2014-08

 

03Kaichi Tsuruta2015-02
IEC 61189-5-4 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
91/1123/CDV2011-11DEC
  • DEC
  • Draft at Editing Check

2014-08

 

03Kaichi Tsuruta2015-02
IEC 61189-5-5 Ed. 1.0  

General test method for measuring residues inducing Electrochemical Degradation Mechanism
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2014-12

03Graham Naisbitt2017-12
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2013-12

02Dieter Bergman2015-06
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2013-12

02Dieter Bergman2015-06
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-07
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-07
IEC 61249-6-3 Ed. 1.0  

Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics
  PWI
  • PWI
  • Potential new work item

2007-01

 

04Douglas Sober2008-01
IEC 61760-4 Ed. 1.0  

Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
91/1127/CDV2011-06CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2013-10

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-04

01Walter Huck2014-11
IEC 62137-4 Ed. 1.0  

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
91/1188/FDIS2011-11CDIS
  • CDIS
  • Draft circulated as FDIS

2014-06

APUB
  • APUB
  • Draft approved for publication

2014-08

03Tsuyoshi Yamamoto2014-10
IEC 62326-20 Ed. 1.0  

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
91/1184/CD2010-103CD
  • 3CD
  • 3rd Committee Draft

2014-04

A4CD
  • A4CD
  • Approved for 4th Committee Draft

2014-07

04Kunio Takahara2015-10
IEC 62699 Ed. 1.0  

Mapping rules and exchange methods for heterogeneous parts libraries
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-11

14Mitsuru Takahashi, Jaeho Lee2014-12
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1139/NP2014-01ANW
  • ANW
  • Approved New Work

2014-01

1CD
  • 1CD
  • 1st Committee Draft

2014-07

03Hiroshi Nishikawa2016-06
IEC 62878-1-1 Ed. 1.0  

Device embedded substrate - Part 1-1: Generic specification - Test method
91/1124/CDV2012-03ADIS
  • ADIS
  • Approved for FDIS circulation

2014-02

DEC
  • DEC
  • Draft at Editing Check

2014-06

06Kunio Takahara2014-11
IEC/TR 60068-3-12 Ed. 2.0  

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
91/1158/DTR2013-11APUB
  • APUB
  • Draft approved for publication

2014-03

DEC
  • DEC
  • Draft at Editing Check

2014-10

03Udo Welzel2015-03
IEC/TR 62699-1 Ed. 1.0  

Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
91/1187/DTR APUB
  • APUB
  • Draft approved for publication

2014-08

DEC
  • DEC
  • Draft at Editing Check

2014-10

14Mitsuru Takahashi, Jaeho Lee2015-03
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1138A/CD2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-04

CDTR
  • CDTR
  • Circulated Draft Technical Report

2014-09

06Hyun Ho Kim2015-02
IEC/TS 62878-2-1 Ed. 1.0  

Device embedded substrate - Part 2-1: Guidelines - General description of technology
91/1142/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
IEC/TS 62878-2-3 Ed. 1.0  

Device embedded substrate - Part 2-3: Guidelines - Design Guide
91/1143/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
IEC/TS 62878-2-4 Ed. 1.0  

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
91/1144/DTS2012-03APUB
  • APUB
  • Draft approved for publication

2014-01

DEC
  • DEC
  • Draft at Editing Check

2014-10

06Kunio Takahara2015-03
PNW 91-1185 Ed. 1.0  

Future IEC 61189-2-719: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1185/NP PNW
  • PNW
  • Proposed New Work

2014-04

ANW
  • ANW
  • Approved New Work

2014-08

10T. Suzuki