International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (24)

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IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-05

WG 3Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
91/1241/CDV2009-10ADIS
  • ADIS
  • Approved for FDIS circulation

2015-07

DEC
  • DEC
  • Draft at Editing Check

2015-12

WG 3Walter Huck2016-05
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1215/CD2014-09ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-01

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 10T. Suzuki2016-10
IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
91/1189/CDV2012-11DEC
  • DEC
  • Draft at Editing Check

2015-07

 

WG 10Udo Welzel2016-02
IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
91/1214/CDV2010-10DEC
  • DEC
  • Draft at Editing Check

2015-07

 

WG 10Kunio Takahara2016-02
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-11ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-06

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 3Graham Naisbitt2016-10
IEC 61189-5-5 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2015-05

WG 3Graham Naisbitt2016-01
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1255/CDV2014-12CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-11

WG 2K. Tsuruta2016-07
IEC 61191-1 Ed. 3.0  

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
91/1276/CD2015-061CD
  • 1CD
  • 1st Committee Draft

2015-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-09

WG 2R. Taube2017-06
IEC 61191-2 Ed. 3.0  

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
91/1285/CD2015-061CD
  • 1CD
  • 1st Committee Draft

2015-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-10

WG 2R. Taube2017-06
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

WG 2R. Taube2016-01
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-11

WG 2R. Taube2016-01
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

WG 4Douglas Sober2016-01
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

WG 4Douglas Sober2016-01
IEC 62090 Ed. 2.0  

Product package labels for electronic components using bar code and two-dimensional symbologies
91/1271/RR2015-06AMW
  • AMW
  • Approved Maintenance Work

2015-06

1CD
  • 1CD
  • 1st Committee Draft

2016-01

WG 1H. Takai2018-01
IEC 62326-20 Ed. 1.0  

Printed boards - Part 20: Printed circuit boards for high-brightness LEDs
91/1219/CDV2010-10DEC
  • DEC
  • Draft at Editing Check

2015-07

 

WG 4Kunio Takahara2016-02
IEC 62699 Ed. 1.0  

Mapping rules and exchange methods for heterogeneous parts libraries
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

WG 14Mitsuru Takahashi, Jaeho Lee2016-01
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1221/CD2014-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2015-03

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

WG 3Hiroshi Nishikawa2016-09
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1220/DTR2010-08APUB
  • APUB
  • Draft approved for publication

2015-01

DEC
  • DEC
  • Draft at Editing Check

2015-08

WG 6Hyun Ho Kim2016-01
IEC/TR 63017 Ed. 1.0  

Guideline for Impedance Compensation with Using Noise Suppression Materials for FPCB - Impedance measuring method and impedance compensation method for impedance variation of FPCBs using NSMs with prevailing TDR method
91/1283/DTR CDTR
  • CDTR
  • Circulated Draft Technical Report

2015-07

APUB
  • APUB
  • Draft approved for publication

2015-12

WG 4Y. M. Im2016-05
IEC/TR 63018 Ed. 1.0  

Guideline for Improvement of Signal Loss with Using Noise Suppression Materials for FPCB - Signal loss measuring method and signal loss improvement method for impedance variation of FPCBs using NSMs
91/1284/DTR CDTR
  • CDTR
  • Circulated Draft Technical Report

2015-07

APUB
  • APUB
  • Draft approved for publication

2015-12

WG 4Y. M. Im2016-05
PNW 91-1247 Ed. 1.0  

Component shape data specification for CAD library Part 2: 3D shape data specifications
91/1247/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-06

WG 12T. Murata 
PNW 91-1266 Ed. 1.0  

Future IEC 62739-3 Ed.1: Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 3: Selection guidance of erosion test methods
91/1266/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 3H. Nishikawa 
PNW 91-1269 Ed. 1.0  

Future IEC 61189-5-503: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-503: General test methods for materials and assemblies - Conductive Anodic Filaments (CAF) testing of circuit boards
91/1269/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 3H. Okamoto