International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Work programme (25)

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IEC 60068-2-58 Ed. 4.0  

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
91/1222/FDIS2011-02CDIS
  • CDIS
  • Draft circulated as FDIS

2014-12

APUB
  • APUB
  • Draft approved for publication

2015-02

03Msashi Aoki2015-03
IEC 60068-2-69 Ed. 3.0  

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
91/1190/CD2012-021CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

03Graham Naisbitt2016-12
IEC 60068-3-13 Ed. 1.0  

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
91/994/CD2009-10ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2012-11

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

03Walter Huck2016-04
IEC 60194 Ed. 6.0  

Printed board design, manufacture and assembly - Terms and definitions
91/1004/CDV2010-02RDIS
  • RDIS
  • Text for FDIS received and registered

2014-08

CDIS
  • CDIS
  • Draft circulated as FDIS

2014-10

05Minsu Lee2015-02
IEC 61189-2-719 Ed. 1.0  

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
91/1215/CD2014-091CD
  • 1CD
  • 1st Committee Draft

2014-10

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-02

10T. Suzuki2016-08
IEC 61189-2-721 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
91/1169/CDV2013-04ADIS
  • ADIS
  • Approved for FDIS circulation

2014-09

DEC
  • DEC
  • Draft at Editing Check

2014-12

10Tracy Cai2015-05
IEC 61189-3-719 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
91/1189/CDV2012-11CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-09

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-03

10Udo Welzel2015-10
IEC 61189-3-913 Ed. 1.0  

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
91/1214/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

10Kunio Takahara2016-01
IEC 61189-5-1 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
91/1191/CD2011-111CD
  • 1CD
  • 1st Committee Draft

2014-07

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-11

03Graham Naisbitt2017-12
IEC 61189-5-5 Ed. 1.0  

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
91/1021/RR2011-11AMW
  • AMW
  • Approved Maintenance Work

2011-11

1CD
  • 1CD
  • 1st Committee Draft

2015-05

03Graham Naisbitt2014-09
IEC 61190-1-3 Ed. 3.0  

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications
91/1231/CD2014-121CD
  • 1CD
  • 1st Committee Draft

2014-12

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-04

02K. Tsuruta2017-02
IEC 61191-3 Ed. 2.0  

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
91/1074/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-03

02Dieter Bergman2015-06
IEC 61191-4 Ed. 2.0  

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
91/1075/RR2012-11AMW
  • AMW
  • Approved Maintenance Work

2012-11

1CD
  • 1CD
  • 1st Committee Draft

2015-03

02Dieter Bergman2015-06
IEC 61249-2-43 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1175/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-07
IEC 61249-2-44 Ed. 1.0  

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
91/1176/CDV2013-04CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2014-11

04Douglas Sober2015-07
IEC 61249-6-3 Ed. 1.0  

Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics
  PWI
  • PWI
  • Preliminary work item

2007-01

 

04Douglas Sober2008-01
IEC 61523-4 Ed. 1.0  

IEC 61523-4 Ed.1: IEEE Standard for Design and Verification of Low-Power Integrated Circuits (IEEE 1801-2013)
91/1209/FDIS DEC
  • DEC
  • Draft at Editing Check

2014-12

 

2015-01
IEC 61760-4 Ed. 1.0  

Surface mounting technology - Part 4: Classification, packaging, labelling and handling of moisture sensitive devices
91/1127/CDV2011-06RDIS
  • RDIS
  • Text for FDIS received and registered

2014-11

CDIS
  • CDIS
  • Draft circulated as FDIS

2015-02

01Walter Huck2015-06
IEC 62014-4 Ed. 1.0  

IEC 62014-4 Ed.1: IEEE Standard for IP-XACT, Standard Structure for Packaging, Integrating and Reusing IP within Tool flows (IEEE 1685-2009)
91/1207/FDIS DEC
  • DEC
  • Draft at Editing Check

2014-12

 

2015-01
IEC 62014-5 Ed. 1.0  

IEC 62014-5 Ed.1: IEEE Standard for Quality of Electronic and Software Intellectual Property used in System and System on Chip (SoC) Designs (IEEE 1734-2011)
91/1208/FDIS DEC
  • DEC
  • Draft at Editing Check

2014-12

 

2015-01
IEC 62326-20 Ed. 1.0  

Printed boards - Part 20: Printed circuit board for high-brightness LEDs
91/1219/CDV2010-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

04Kunio Takahara2016-02
IEC 62699 Ed. 1.0  

Mapping rules and exchange methods for heterogeneous parts libraries
91/1078/CDV2010-08ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-07

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-11

14Mitsuru Takahashi, Jaeho Lee2014-12
IEC 62739-2 Ed. 1.0  

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
91/1221/CD2014-011CD
  • 1CD
  • 1st Committee Draft

2014-11

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-03

03Hiroshi Nishikawa2016-06
IEC 62878-1-1 Ed. 1.0  

Device embedded substrate - Part 1-1: Generic specification - Test methods
91/1124/CDV2012-03RDIS
  • RDIS
  • Text for FDIS received and registered

2014-11

CDIS
  • CDIS
  • Draft circulated as FDIS

2015-01

06Kunio Takahara2015-05
IEC/TR 62878-2-2 Ed. 1.0  

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
91/1220/DTR2010-08CDTR
  • CDTR
  • Circulated Draft Technical Report

2014-10

APUB
  • APUB
  • Draft approved for publication

2015-03

06Hyun Ho Kim2015-09