International

Electrotechnical

Commission

International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Dispositifs à semiconducteurs

TC 47 Programme de Travail

Référence Projet	Stage	Référence Document	Init. Date	Stage Courant	Prochain Stage	Mod	Fcst. Publ. Date
IEC 60749-26 Ed. 3.0 Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 26: Essai de sensibilité aux décharges électrostatiques (DES) - Modèle du corps humain (HBM)	CDIS CDIS Draft circulated as FDIS	47/2160/FDIS 854 kB 880 kB	2011-05	2013-01	2013-03	no	2013-05
IEC 60749-28 Ed. 1.0 CEI 60749-28 Ed.1: Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 28: Essai de sensibilité aux décharges électrostatiques (DES) Modèle de dispositif chargé par contact direct (DC-CDM)	ACDV ACDV Draft approved for Committee Draft with Vote	47/2149A/CC 231 kB 231 kB	2011-09	2012-12	2013-03	no	2014-07
IEC 60749-42 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage	ACDV ACDV Draft approved for Committee Draft with Vote	47/2150A/CC 116 kB 152 kB	2012-04	2013-01	2013-03	no	2014-07
IEC 60749-43 Ed. 1.0 Guidelines for LSI reliability qualification plans	ANW ANW Approved New Work	47/2139/RVN 954 kB	2012-07	2012-07	2013-05	no	2015-07
IEC 60749-44 Ed. 1.0 Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron irradiated soft error test method for semiconductor devices with memory	ANW ANW Approved New Work	47/2151/RVN 238 kB	2012-10	2012-10	2013-08	no	2015-09
IEC 62435 Ed. 1.0 Long-term storage of electronic semiconductor devices	ANW ANW Approved New Work	47/2088/RVN 142 kB 220 kB	2011-03	2011-03	2013-04	yes	2014-06
IEC 62483 Ed. 1.0 Exigences de réception environnementale pour la susceptibilité des finis de surface en étain et alliage d'étain à la trichite d'étain	ADIS ADIS Approved for FDIS circulation	47/2156/RVC 200 kB 205 kB	2012-07	2012-12	2013-03	no	2013-08
IEC 62779-1 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements	1CD 1CD 1st Committee Draft	47/2152/CD 600 kB	2012-01	2012-10	2013-02	no	2014-12
IEC 62779-2 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances	1CD 1CD 1st Committee Draft	47/2153/CD 745 kB	2012-03	2012-10	2013-02	no	2014-06
IEC 62779-3 Ed. 1.0 Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions	ANW ANW Approved New Work	47/2163/RVN 183 kB	2013-01	2013-01	2013-12	no	2015-12
IEC 62830-1 Ed. 1.0 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting	ANW ANW Approved New Work	47/2142/RVN 120 kB	2012-08	2012-08	2013-08	no	2015-09
IEC 62830-2 Ed. 1.0 Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting	ANW ANW Approved New Work	47/2143/RVN 129 kB	2012-08	2012-08	2013-08	no	2015-09
PNW 47-2157 Ed. 1.0 Copper stress migration test method	PNW PNW Proposed New Work	47/2157/NP 968 kB		2012-12	2013-05	no