International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Dispositifs à semiconducteurs

 
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TC 47 Programme de Travail (31)

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IEC 60749-28 Ed. 1.0  

Dispositifs à semiconducteurs - Méthodes d'essai mécaniques et climatiques - Partie 28: Essai de sensibilité aux décharges électrostatiques (DES) Modèle de dispositif chargé par contact direct (DC-CDM)
47/2281/CDV2011-09CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-10

WG 2J. Lynch2017-05
IEC 60749-3 Ed. 2.0  

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination
47/2295/RR2016-04AMW
  • AMW
  • Approved Maintenance Work

2016-04

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-04

WG 2J. Lynch2017-08
IEC 60749-4 Ed. 2.0  

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)
47/2287/CDV2016-02CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-10

WG 2J. Lynch2017-05
IEC 60749-41 Ed. 1.0  

Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices
47/2225/NP2015-10ANW
  • ANW
  • Approved New Work

2015-10

1CD
  • 1CD
  • 1st Committee Draft

2016-05

WG 2J. Lynch2017-12
IEC 60749-43 Ed. 1.0  

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 43: Directives concernant les plans de qualification de la fiabilité des CI
47/2231/CDV2012-07CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-06

WG 2J. Lynch2016-11
IEC 60749-44 Ed. 1.0  

Dispositifs à semiconducteurs - Méthodes d'essais mécaniques et climatiques - Partie 44: Méthode d'essai des effets d'un événement isolé (SEE) irradié par un faisceau de neutrons pour des dispositifs à semiconducteurs
47/2226/CDV2012-10RDIS
  • RDIS
  • Text for FDIS received and registered

2016-04

CDIS
  • CDIS
  • Draft circulated as FDIS

2016-06

WG 2J. Lynch2016-10
IEC 60749-6 Ed. 2.0  

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
47/2294/RR2016-04AMW
  • AMW
  • Approved Maintenance Work

2016-04

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-04

WG 2J. Lynch2017-08
IEC 60749-9 Ed. 2.0  

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking
47/2299/RR2016-04AMW
  • AMW
  • Approved Maintenance Work

2016-04

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-06

WG 2J. Lynch2017-08
IEC 62435-1 Ed. 1.0  

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 1: Généralités
47/2251/CDV2011-03CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-05

WG 3Y. Nagahiro, A. Lucero2017-01
IEC 62435-2 Ed. 1.0  

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 2 - Mécanismes de détérioration
47/2252/CDV2011-03CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-05

WG 3Y. Nagahiro, A. Lucero2017-01
IEC 62435-5 Ed. 1.0  

Composants électroniques - Stockage de longue durée des dispositifs électroniques à semiconducteurs - Partie 5 - Dispositifs de puces et plaquettes
47/2253/CDV2011-03CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-11

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-05

WG 3Y. Nagahiro, A. Lucero2017-01
IEC 62830-1 Ed. 1.0  

Dispositifs à semi-conducteurs - Dispositifs à semi-conducteurs pour récupération et génération d'énergie - Partie 1: Récupération d'énergie piézoélectrique basée sur des vibrations
47/2214/CDV2012-08ADIS
  • ADIS
  • Approved for FDIS circulation

2015-12

DEC
  • DEC
  • Draft at Editing Check

2016-03

WG 7J. Y. Park, C. L. Cha2016-12
IEC 62830-2 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour récupération et production d'énergie - Partie 2: Récupération d'énergie thermoélectrique basée sur la puissance thermoélectrique
47/2229/CDV2012-08ADIS
  • ADIS
  • Approved for FDIS circulation

2015-12

DEC
  • DEC
  • Draft at Editing Check

2016-03

WG 7H. J. Ryu, C. L. Cha2016-12
IEC 62830-3 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs pour récupération et génération d'énergie - Partie 3: Récupération d'énergie électromagnétique basée sur des vibrations
47/2232/CDV2013-07ADIS
  • ADIS
  • Approved for FDIS circulation

2015-12

DEC
  • DEC
  • Draft at Editing Check

2016-03

WG 7J. Y. Park and C. L. Cha2016-12
IEC 62830-4 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
47/2240/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 7J.Y. Park2018-09
IEC 62830-5 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
47/2234/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 7N.S. Kim, C.L. Cha2018-09
IEC 62880-1 Ed. 1.0  

Semiconductor devices - Stress Migration Test Standard - Part 1: Copper Stress Migration Test Standard
47/2191/CD2013-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2016-01

WG 5H. Matsuyama2017-07
IEC 62951-1 Ed. 1.0  

Dispositifs à semiconducteurs - Dispositifs à semiconducteurs souples et extensibles - Partie 1: Méthode d'essai de courbure de couches minces conductrices sur des substrats souples
47/2256/CDV2014-09CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2016-06

WG 6S.H. Choa, W.J. Kim2017-01
IEC 62951-2 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
47/2235/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 6H.J. Ryu2018-09
IEC 62951-3 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics (?, SS, Vth) on flexible substrates under bulging
47/2236/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 6D.K. Kim, H.J. Ryu2018-09
IEC 62951-4 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices
47/2237/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 6S.H. Choa, W.J. Kim2018-09
IEC 62951-5 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials and devices
47/2238/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 6J.C. Lee2018-09
IEC 62951-6 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
47/2239/NP2015-11ANW
  • ANW
  • Approved New Work

2015-11

1CD
  • 1CD
  • 1st Committee Draft

2016-11

WG 6J.W. Chung2018-09
IEC 62969-1 Ed. 1.0  

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
47/2272/CD2014-121CD
  • 1CD
  • 1st Committee Draft

2016-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-04

WG 6C. L. Cha, N. S. Kim2017-08
IEC 62969-2 Ed. 1.0  

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
47/2273/CD2014-121CD
  • 1CD
  • 1st Committee Draft

2016-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-04

WG 6H. J. Ryu, C. L. Cha2017-08
IEC 62969-3 Ed. 1.0  

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
47/2274/CD2014-121CD
  • 1CD
  • 1st Committee Draft

2016-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-04

WG 6J. Y. Park, C. L. Cha2017-08
IEC 62969-4 Ed. 1.0  

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors
47/2275/CD2014-121CD
  • 1CD
  • 1st Committee Draft

2016-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2016-04

WG 6K. B. Yeon, W. J. Kim2017-08
PNW 47-2284 Ed. 1.0  

Future IEC 62951-7 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor
47/2284/NP PNW
  • PNW
  • Proposed New Work

2016-02

ANW
  • ANW
  • Approved New Work

2016-06

WG 6N. S. Kim, C. L. Cha 
PNW 47-2291 Ed. 1.0  

Semiconductor devices - Reliability of automotive semiconductors - Part 1: Estimating aging level of automotive semiconductors
47/2291/NP PNW
  • PNW
  • Proposed New Work

2016-03

ANW
  • ANW
  • Approved New Work

2016-08

WG 6S. J. Park, W. J. Kim 
PNW 47-2293 Ed. 1.0  

Future IEC XXXXX-1 Ed.1: Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects
47/2293/NP PNW
  • PNW
  • Proposed New Work

2016-04

ANW
  • ANW
  • Approved New Work

2016-08

WG 5J. Ohno, J. Senzaki 
PNW 47-2301 Ed. 1.0  

Future IEC 62779-4 Ed.1: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication
47/2301/NP PNW
  • PNW
  • Proposed New Work

2016-04

ANW
  • ANW
  • Approved New Work

2016-09

WG 6B. N. Lee, G. I. Oh