International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Work programme (33)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47-2291 ED1

Semiconductor devices - Reliability of automotive semiconductors - Part 1: Estimating aging level of automotive semiconductors

47/2291/NP PRVN
  • PRVN
  • Preparation of RVN

2016-06

2016-07

WG 6 S. J. Park, W. J. Kim
PNW 47-2301 ED1

Future IEC 62779-4 Ed.1: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

47/2301/NP PRVN
  • PRVN
  • Preparation of RVN

2016-07

2016-08

WG 6 B. N. Lee, G. I. Oh
IEC 60749-3 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

47/2298/CDV 2016-04 RFDIS
  • RFDIS
  • FDIS received and registered

2016-11

CDIS
  • CDIS

2017-02

WG 2 J. Lynch 2017-05
IEC 60749-4 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)

47/2287/CDV 2016-02 RFDIS
  • RFDIS
  • FDIS received and registered

2016-11

CDIS
  • CDIS

2017-02

WG 2 J. Lynch 2017-05
IEC 60749-5 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

47/2311/CDV 2016-06 DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2016-12

RFDIS
  • RFDIS
  • FDIS received and registered

2016-12

WG 2 J. Lynch 2017-06
IEC 60749-6 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

47/2297/CDV 2016-04 RFDIS
  • RFDIS
  • FDIS received and registered

2016-11

CDIS
  • CDIS

2017-02

WG 2 J. Lynch 2017-05
IEC 60749-9 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

47/2300/CDV 2016-04 RFDIS
  • RFDIS
  • FDIS received and registered

2016-11

CDIS
  • CDIS

2017-02

WG 2 J. Lynch 2017-05
IEC 60749-26 ED4

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

47/2339/RR 2016-12 ACDV
  • ACDV
  • Approved for CDV

2016-11

2017-01

WG 2 Jim Lynch 2018-06
IEC 60749-28 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

47/2281/CDV 2011-09 RFDIS
  • RFDIS
  • FDIS received and registered

2016-12

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-02

WG 2 2017-05
IEC 60749-41 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

47/2325/CD 2015-10 CD
  • CD
  • Draft circulated as CD

2016-10

PCC
  • PCC
  • Preparation of CC document

2016-12

WG 2 J. Lynch 2017-12
IEC 60749-43 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

47/2316/CDV 2012-07 PRVC
  • PRVC
  • Preparation of RVC

2016-12

2017-02

WG 2 J. Lynch 2017-10
IEC 62435-1 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

47/2326/FDIS 2011-03 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-11

PRVD
  • PRVD
  • Preparation of RVD document

2016-12

WG 3 Y. Nagahiro, A. Lucero 2017-02
IEC 62435-2 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 2 - Deterioration Mechanisms

47/2327/FDIS 2011-03 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-11

PRVD
  • PRVD
  • Preparation of RVD document

2016-12

WG 3 Y. Nagahiro, A. Lucero 2017-02
IEC 62435-4 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage

47/2324/CD 2011-03 CD
  • CD
  • Draft circulated as CD

2016-09

PCC
  • PCC
  • Preparation of CC document

2016-12

WG 3 Y. Nagahiro, A. Lucero
IEC 62435-5 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - Die & Wafer Devices

47/2328/FDIS 2011-03 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-11

PRVD
  • PRVD
  • Preparation of RVD document

2016-12

WG 3 Y. Nagahiro, A. Lucero 2017-02
IEC 62830-1 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting

47/2214/CDV 2012-08 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-12

PRVD
  • PRVD
  • Preparation of RVD document

2017-01

WG 7 J. Y. Park, C. L. Cha 2017-03
IEC 62830-2 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

47/2329/FDIS 2012-08 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2016-11

PRVD
  • PRVD
  • Preparation of RVD document

2016-12

WG 7 H. J. Ryu, C. L. Cha 2017-02
IEC 62830-3 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting

47/2232/CDV 2013-07 RFDIS
  • RFDIS
  • FDIS received and registered

2016-11

CDIS
  • CDIS

2017-02

WG 7 J. Y. Park and C. L. Cha 2017-05
IEC 62830-4 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

47/2338/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2016-12

PCC
  • PCC
  • Preparation of CC document

2017-01

WG 7 2018-09
IEC 62830-5 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

47/2234/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 7 N.S. Kim, C.L. Cha 2018-09
IEC 62880-1 ED1

Semiconductor devices - Stress Migration Test Standard - Part 1: Copper Stress Migration Test Standard

47/2296/CDV 2013-06 PRVC
  • PRVC
  • Preparation of RVC

2016-09

2016-12

WG 5 H. Matsuyama 2017-07
IEC 62951-1 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

47/2256/CDV 2014-09 PRVC
  • PRVC
  • Preparation of RVC

2016-03

2016-06

WG 6 S.H. Choa, W.J. Kim 2017-05
IEC 62951-2 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices

47/2235/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 H.J. Ryu 2018-09
IEC 62951-3 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics (?, SS, Vth) on flexible substrates under bulging

47/2236/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 D.K. Kim, H.J. Ryu 2018-09
IEC 62951-4 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices

47/2237/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 S.H. Choa, W.J. Kim 2018-09
IEC 62951-5 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials and devices

47/2238/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 J.C. Lee 2018-09
IEC 62951-6 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

47/2239/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 J.W. Chung 2018-09
IEC 62951-7 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

47/2284/NP 2016-07 ACD
  • ACD
  • Approved for CD

2016-07

CD
  • CD
  • Draft circulated as CD

2017-07

WG 6 N. S. Kim, C. L. Cha 2019-07
IEC 62969-1 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

47/2319/CDV 2014-12 CCDV
  • CCDV
  • Draft circulated as CDV

2016-10

PRVC
  • PRVC
  • Preparation of RVC

2017-01

WG 6 C. L. Cha, N. S. Kim 2017-12
IEC 62969-2 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

47/2321/CDV 2014-12 CCDV
  • CCDV
  • Draft circulated as CDV

2016-10

PRVC
  • PRVC
  • Preparation of RVC

2017-01

WG 6 H. J. Ryu, C. L. Cha 2017-12
IEC 62969-3 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

47/2274/CD 2014-12 ACDV
  • ACDV
  • Approved for CDV

2016-11

TCDV
  • TCDV
  • Translation of CDV

2017-01

WG 6 2017-08
IEC 62969-4 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

47/2275/CD 2014-12 PCC
  • PCC
  • Preparation of CC

2016-03

2016-04

WG 6 K. B. Yeon, W. J. Kim 2017-08
IEC 63068-1 ED1

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

47/2334/CD 2016-07 CD
  • CD
  • Draft circulated as CD

2016-11

PCC
  • PCC
  • Preparation of CC document

2017-02

WG 5 J. Ohno, J. Senzaki 2019-07