International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Work programme (14)

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IEC 60749-28 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM)
47/2155/CDV2011-09NADIS
  • NADIS
  • FDIS not approved

2013-06

CDVM
  • CDVM
  • Committee draft with vote for meeting

2013-10

02Jim Lynch2013-11
IEC 60749-42 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature humidity storage
47/2159/CDV2012-04RDIS
  • RDIS
  • Text for FDIS received and registered

2014-04

CDIS
  • CDIS
  • Draft circulated as FDIS

2014-07

02Dr. J. Lynch2014-10
IEC 60749-43 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plan
47/2169/CD2012-07CDM
  • CDM
  • Committee Draft to be discussed at Meeting

2013-09

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2013-11

02Dr. J. Lynch2015-07
IEC 60749-44 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
47/2193/CD2012-101CD
  • 1CD
  • 1st Committee Draft

2014-02

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-06

02Dr J. Lynch2015-09
IEC 62435-1 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
47/2172/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2013-10

03J. Wolbert2014-06
IEC 62435-2 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 2 - Deterioration Mechanisms
47/2173/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2013-10

03J. Wolbert2014-06
IEC 62435-5 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - Die & Wafer Devices
47/2174/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2013-10

03J. Wolbert2014-06
IEC 62779-1 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
47/2152/CD2012-01ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2013-02

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

06Dr. B. N. Lee2015-06
IEC 62779-2 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
47/2153/CD2012-03ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2013-02

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-05

06Dr. J. H. Hwang2015-06
IEC 62779-3 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
47/2197/CD2013-011CD
  • 1CD
  • 1st Committee Draft

2014-04

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-08

06Dr. Sung Won Kang2015-12
IEC 62830-1 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
47/2189/CD2012-081CD
  • 1CD
  • 1st Committee Draft

2014-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-05

07Jae Yeong Park, Cheolung Cha2015-09
IEC 62830-2 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
47/2190/CD2012-081CD
  • 1CD
  • 1st Committee Draft

2014-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-05

07Dr. H. J. Ryu & Dr. C. Cha2015-09
IEC 62830-3 Ed. 1.0  

Semiconductor devices - semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
47/2164/NP2013-07ANW
  • ANW
  • Approved New Work

2013-07

1CD
  • 1CD
  • 1st Committee Draft

2014-06

07J. Y. Park and C. L. Cha2016-06
IEC 62880-1 Ed. 1.0  

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method
47/2191/CD2013-061CD
  • 1CD
  • 1st Committee Draft

2014-01

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2014-05

05H. Matsuyama2016-05