International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
export to xls file

TC 47 Work programme (27)

sort up

Project

Reference

Document

Reference

Init.

Date

sort upsort down

Current

Stage

sort upsort down

Next

Stage

Working

Group

sort upsort down

Project

Leader

sort upsort down

Fcst. Publ.

Date

IEC 60749-28 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic Discharge (ESD) Sensitivity Testing Direct contact charged device model (DC-CDM)
47/2155/CDV2011-09NADIS
  • NADIS
  • FDIS not approved

2013-06

CDVM
  • CDVM
  • Committee draft with vote for meeting

2013-10

02J. Lynch2016-01
IEC 60749-43 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans
47/2231/CDV2012-07CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-05

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-11

02J. Lynch2016-07
IEC 60749-44 Ed. 1.0  

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices
47/2226/CDV2012-10CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-10

02J. Lynch2016-06
IEC 62435-1 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General
47/2172/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-04

03Y. Nagahiro, A. Lucero2016-01
IEC 62435-2 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 2 - Deterioration Mechanisms
47/2173/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-04

03Y. Nagahiro, A. Lucero2016-01
IEC 62435-5 Ed. 1.0  

Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - Die & Wafer Devices
47/2174/CD2011-031CD
  • 1CD
  • 1st Committee Draft

2013-06

A2CD
  • A2CD
  • Approved for 2nd Committee Draft

2015-04

03Y. Nagahiro, A. Lucero2016-01
IEC 62779-1 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements
47/2195/CDV2012-01ADIS
  • ADIS
  • Approved for FDIS circulation

2014-10

DEC
  • DEC
  • Draft at Editing Check

2015-02

06B. N. Lee2015-11
IEC 62779-2 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
47/2196/CDV2012-03ADIS
  • ADIS
  • Approved for FDIS circulation

2014-10

DEC
  • DEC
  • Draft at Editing Check

2015-02

06J. H. Hwang2015-11
IEC 62779-3 Ed. 1.0  

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
47/2227/CDV2013-01CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-10

06S. W. Kang2016-06
IEC 62830-1 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting
47/2214/CDV2012-08CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2014-12

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-06

07J. Y. Park, C. L. Cha2016-02
IEC 62830-2 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting
47/2229/CDV2012-08CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-04

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-10

07H. J. Ryu, C. L. Cha2016-06
IEC 62830-3 Ed. 1.0  

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting
47/2232/CDV2013-07CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-06

ADIS
  • ADIS
  • Approved for FDIS circulation

2015-12

07J. Y. Park and C. L. Cha2016-07
IEC 62880-1 Ed. 1.0  

Semiconductor devices - Wafer level reliability for semiconductor devices - Part 1: Copper stress migration test method
47/2191/CD2013-06ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote

2014-05

CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote

2015-09

05H. Matsuyama2017-01
IEC 62951-1 Ed. 1.0  

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates
47/2242/CD2014-092CD
  • 2CD
  • 2nd Committee Draft

2015-06

A3CD
  • A3CD
  • Approved for 3rd Committee Draft

2015-09

06S.H. Choa, W.J. Kim2017-06
IEC 62969-1 Ed. 1.0  

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors
47/2205/NP2014-12ANW
  • ANW
  • Approved New Work

2014-12

1CD
  • 1CD
  • 1st Committee Draft

2015-10

06C. L. Cha, N. S. Kim2017-08
IEC 62969-2 Ed. 1.0  

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors
47/2206/NP2014-12ANW
  • ANW
  • Approved New Work

2014-12

1CD
  • 1CD
  • 1st Committee Draft

2015-10

06H. J. Ryu, C. L. Cha2017-08
IEC 62969-3 Ed. 1.0  

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors
47/2207/NP2014-12ANW
  • ANW
  • Approved New Work

2014-12

1CD
  • 1CD
  • 1st Committee Draft

2015-10

06J. Y. Park, C. L. Cha2017-08
IEC 62969-4 Ed. 1.0  

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation methods of data interface for automotive vehicle sensors
47/2208/NP2014-12ANW
  • ANW
  • Approved New Work

2014-12

1CD
  • 1CD
  • 1st Committee Draft

2015-10

06K. B. Yeon, W. J. Kim2017-08
PNW 47-2225 Ed. 1.0  

Future IEC 60749-41 Ed.1: Semiconductor devices - mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices
47/2225/NP PNW
  • PNW
  • Proposed New Work

2015-02

ANW
  • ANW
  • Approved New Work

2015-06

02J. Lynch 
PNW 47-2234 Ed. 1.0  

Future IEC 62830-5 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices
47/2234/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

07N.S. Kim, C.L. Cha 
PNW 47-2235 Ed. 1.0  

Future IEC 62951-2 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices
47/2235/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

06H.J. Ryu, H.S. Kim 
PNW 47-2236 Ed. 1.0  

Future IEC 62951-3 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics (?, SS, Vth) on flexible substrates under bulging
47/2236/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

06D.K. Kim, H.J. Ryu 
PNW 47-2237 Ed. 1.0  

Future IEC 62951-4 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices
47/2237/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

06S.H. Choa, W.J. Kim 
PNW 47-2238 Ed. 1.0  

Future IEC 62951-5 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials and devices
47/2238/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

06J.C. Lee 
PNW 47-2239 Ed. 1.0  

Future IEC 62951-6 Ed.1: Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films
47/2239/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

06J.W. Chung 
PNW 47-2240 Ed. 1.0  

Future IEC 62830-4 Ed.1: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices
47/2240/NP PNW
  • PNW
  • Proposed New Work

2015-05

ANW
  • ANW
  • Approved New Work

2015-09

07J.Y. Park 
PNW 47-2243 Ed. 1.0  

Future IEC 62969-5 Ed.1: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 5: Test/diagnosis method via vehicular network for automotive semiconductors
47/2243/NP PNW
  • PNW
  • Proposed New Work

2015-06

ANW
  • ANW
  • Approved New Work

2015-10

WG 6S. J. Park