International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Work programme (26)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47-2354 ED

Semiconductor devices – Semiconductor devices- Measuring and evaluation methods of kinetic energy harvesting devices for practical applications - Part 1- for arbitrary and random mechanical vibrations

47/2354/NP PRVN
  • PRVN
  • Preparation of RVN

2017-03

2017-04

WG 7 Yuji SUZUKI 2019-09
PNW 47-2381 ED

Future IEC 62830-6: Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 6- contact mode triboelectric energy harvesting

47/2381/NP PNW
  • PNW
  • New Work Item Proposal

2017-03

PRVN
  • PRVN
  • Preparation of RVN document

2017-06

WG 7 Jae Yeong Park 2019-12
PNW 47-2387

Semiconductor devices – Bias-temperature stability test for metal-oxide semiconductor field-effect transistors (MOSFET) - Part 1: Fast BTI Test method

47/2387/NP PNW
  • PNW
  • New Work Item Proposal

2017-04

PRVN
  • PRVN
  • Preparation of RVN document

2017-06

WG 5 Hideya Matsuyama 2020-03
PNW 47-2388

Semiconductor devices – Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices Part 2: Test method for defects using optical inspection

47/2388A/NP PNW
  • PNW
  • New Work Item Proposal

2017-04

2017-06

WG 5 Jun-ichi Ohno 2020-03
IEC 60749-12 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

47/2385/RR 2017-03 TCDV
  • TCDV
  • Translation of CDV

2017-03

CCDV
  • CCDV
  • Draft circulated as CDV

2017-05

WG 2 Jim Lynch 2018-07
IEC 60749-13 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

47/2377/CDV 2017-02 CCDV
  • CCDV
  • Draft circulated as CDV

2017-04

PRVC
  • PRVC
  • Preparation of RVC

2017-07

WG 2 Jim Lynch 2018-04
IEC 60749-26 ED4

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

47/2343/CDV 2016-12 PRVC
  • PRVC
  • Preparation of RVC

2017-04

2017-07

WG 2 Jim Lynch 2018-01
IEC 60749-41 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

47/2325/CD 2015-10 PCC
  • PCC
  • Preparation of CC

2016-12

2017-01

WG 2 J. Lynch 2017-12
IEC 60749-43 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

47/2389/FDIS 2012-07 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-04

PRVD
  • PRVD
  • Preparation of RVD document

2017-05

WG 2 J. Lynch 2017-08
IEC 62435-4 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage

47/2324/CD 2011-03 TCDV
  • TCDV
  • Translation of CDV

2017-04

CCDV
  • CCDV
  • Draft circulated as CDV

2017-06

WG 3 Y. Nagahiro, A. Lucero 2018-07
IEC 62435-6 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 6: Packaged or Finished Devices

47/2390/CD CD
  • CD
  • Draft circulated as CD

2017-04

PCC
  • PCC
  • Preparation of CC document

2017-07

WG 3
IEC 62779-4 ED1

Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

47/2365/NP 2017-04 PRVN
  • PRVN
  • Preparation of RVN

2017-03

ACD
  • ACD
  • Approved for Committee Draft

2017-12

WG 6 Byoung Nam Lee 2020-01
IEC 62830-4 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

47/2338/CD 2015-11 PCC
  • PCC
  • Preparation of CC

2017-01

2017-02

WG 7 Jae Yeong Park 2018-09
IEC 62830-5 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

47/2234/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 7 N.S. Kim, C.L. Cha 2018-09
IEC 62880-1 ED1

Semiconductor devices - Stress migration test standard - Part 1: Copper stress migration test standard

47/2296/CDV 2013-06 TFDIS
  • TFDIS
  • Translation of FDIS

2017-04

DECFDIS
  • DECFDIS
  • FDIS at Editing Check

2017-06

WG 5 H. Matsuyama 2017-11
IEC 62951-2 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices

47/2356/CD 2015-11 TCDV
  • TCDV
  • Translation of CDV

2017-04

CCDV
  • CCDV
  • Draft circulated as CDV

2017-06

WG 6 H.J. Ryu 2018-07
IEC 62951-3 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging

47/2357/CD 2015-11 TCDV
  • TCDV
  • Translation of CDV

2017-04

CCDV
  • CCDV
  • Draft circulated as CDV

2017-06

WG 6 D.K. Kim, H.J. Ryu 2018-07
IEC 62951-4 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices

47/2368/CD 2015-11 PCC
  • PCC
  • Preparation of CC

2017-03

2017-04

WG 6 S.H. Choa, W.J. Kim 2018-09
IEC 62951-5 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

47/2375/CD 2015-11 PCC
  • PCC
  • Preparation of CC

2017-04

2017-05

WG 6 J.C. Lee 2018-09
IEC 62951-6ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

47/2393/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2017-04

PCC
  • PCC
  • Preparation of CC document

2017-07

WG 6 Hojun Ryu 2018-09
IEC 62951-7 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

47/2392/CD 2016-07 CD
  • CD
  • Draft circulated as CD

2017-04

PCC
  • PCC
  • Preparation of CC document

2017-07

WG 6 N. S. Kim, C. L. Cha 2019-07
IEC 62969-1 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

47/2319/CDV 2014-12 PRVC
  • PRVC
  • Preparation of RVC

2017-01

AFDIS
  • AFDIS
  • Approved for FDIS circulation

2017-07

WG 6 C. L. Cha, N. S. Kim 2017-10
IEC 62969-2 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

47/2321/CDV 2014-12 PRVC
  • PRVC
  • Preparation of RVC

2017-01

AFDIS
  • AFDIS
  • Approved for FDIS circulation

2017-07

WG 6 H. J. Ryu, C. L. Cha 2017-10
IEC 62969-3 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

47/2337/CDV 2014-12 PRVC
  • PRVC
  • Preparation of RVC

2017-04

2017-07

WG 6 Jae Yeong Park 2018-01
IEC 62969-4 ED1

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

47/2361/CDV 2014-12 CCDV
  • CCDV
  • Draft circulated as CDV

2017-03

PRVC
  • PRVC
  • Preparation of RVC

2017-05

WG 6 K. B. Yeon, W. J. Kim 2018-03
IEC 63068-1 ED1

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

47/2334/CD 2016-07 ACD
  • ACD
  • Approved for CD

2017-03

2CD
  • 2CD

2017-04

WG 5 J. Ohno, J. Senzaki 2019-07