International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Work programme (25)

Project

Reference

Document

Reference

Init.

Date

Current

Stage

Next

Stage

Working

Group

Project

Leader

Fcst. Publ.

Date

PNW 47-2354

Semiconductor devices – Semiconductor devices- Measuring and evaluation methods of kinetic energy harvesting devices for practical applications - Part 1- for arbitrary and random mechanical vibrations

47/2354/NP PNW
  • PNW
  • New Work Item Proposal

2016-12

PRVN
  • PRVN
  • Preparation of RVN document

2017-03

WG 7 Yuji SUZUKI 2019-09
PNW 47-2365

Future IEC 62779-4 Ed.1.0: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

47/2365/NP PNW
  • PNW
  • New Work Item Proposal

2017-01

PRVN
  • PRVN
  • Preparation of RVN document

2017-03

WG 6 Byoung Nam Lee 2019-12
IEC 60749-5 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

47/2367/FDIS 2016-06 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-02

PRVD
  • PRVD
  • Preparation of RVD document

2017-03

WG 2 J. Lynch 2017-05
IEC 60749-13 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

47/2374/RR 2017-02 TCDV
  • TCDV
  • Translation of CDV

2017-02

CCDV
  • CCDV
  • Draft circulated as CDV

2017-04

WG 2 Jim Lynch 2018-05
IEC 60749-26 ED4

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

47/2343/CDV 2016-12 CCDV
  • CCDV
  • Draft circulated as CDV

2017-01

PRVC
  • PRVC
  • Preparation of RVC

2017-04

WG 2 Jim Lynch 2018-01
IEC 60749-28 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

47/2362/FDIS 2011-09 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-01

PRVD
  • PRVD
  • Preparation of RVD document

2017-02

WG 2 Jim Lynch 2017-05
IEC 60749-41 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

47/2325/CD 2015-10 PCC
  • PCC
  • Preparation of CC

2016-12

2017-01

WG 2 J. Lynch 2017-12
IEC 60749-43 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

47/2316/CDV 2012-07 RFDIS
  • RFDIS
  • FDIS received and registered

2017-02

CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-05

WG 2 J. Lynch 2017-07
IEC 62435-4 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage

47/2324/CD 2011-03 PCC
  • PCC
  • Preparation of CC

2016-12

2017-01

WG 3 Y. Nagahiro, A. Lucero
IEC 62830-3 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting

47/2363/FDIS 2013-07 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-01

PRVD
  • PRVD
  • Preparation of RVD document

2017-03

WG 7 J. Y. Park and C. L. Cha 2017-05
IEC 62830-4 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

47/2338/CD 2015-11 PCC
  • PCC
  • Preparation of CC

2017-01

2017-02

WG 7 Jae Yeong Park 2018-09
IEC 62830-5 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

47/2234/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 7 N.S. Kim, C.L. Cha 2018-09
IEC 62880-1 ED1

Semiconductor devices - Stress Migration Test Standard - Part 1: Copper Stress Migration Test Standard

47/2296/CDV 2013-06 PRVC
  • PRVC
  • Preparation of RVC

2016-09

2016-12

WG 5 H. Matsuyama 2017-07
IEC 62951-1 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

47/2369/FDIS 2014-09 CFDIS
  • CFDIS
  • Draft circulated as FDIS

2017-02

PRVD
  • PRVD
  • Preparation of RVD document

2017-03

WG 6 S.H. Choa, W.J. Kim 2017-05
IEC 62951-2 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices

47/2356/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2017-01

PCC
  • PCC
  • Preparation of CC document

2017-03

WG 6 H.J. Ryu 2018-09
IEC 62951-3 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics on flexible substrates under bulging

47/2357/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2017-01

PCC
  • PCC
  • Preparation of CC document

2017-03

WG 6 D.K. Kim, H.J. Ryu 2018-09
IEC 62951-4 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices

47/2368/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2017-02

PCC
  • PCC
  • Preparation of CC document

2017-03

WG 6 S.H. Choa, W.J. Kim 2018-09
IEC 62951-5 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials

47/2375/CD 2015-11 CD
  • CD
  • Draft circulated as CD

2017-02

PCC
  • PCC
  • Preparation of CC document

2017-04

WG 6 J.C. Lee 2018-09
IEC 62951-6 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

47/2239/NP 2015-11 ACD
  • ACD
  • Approved for CD

2015-11

CD
  • CD
  • Draft circulated as CD

2016-11

WG 6 J.W. Chung 2018-09
IEC 62951-7 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

47/2284/NP 2016-07 ACD
  • ACD
  • Approved for CD

2016-07

CD
  • CD
  • Draft circulated as CD

2017-07

WG 6 N. S. Kim, C. L. Cha 2019-07
IEC 62969-1 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

47/2319/CDV 2014-12 PRVC
  • PRVC
  • Preparation of RVC

2017-01

2017-04

WG 6 C. L. Cha, N. S. Kim 2017-10
IEC 62969-2 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

47/2321/CDV 2014-12 PRVC
  • PRVC
  • Preparation of RVC

2017-01

2017-04

WG 6 H. J. Ryu, C. L. Cha 2017-10
IEC 62969-3 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

47/2337/CDV 2014-12 CCDV
  • CCDV
  • Draft circulated as CDV

2017-01

PRVC
  • PRVC
  • Preparation of RVC

2017-04

WG 6 Jae Yeong Park 2018-01
IEC 62969-4 ED1

Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

47/2275/CD 2014-12 TCDV
  • TCDV
  • Translation of CDV

2017-01

CCDV
  • CCDV
  • Draft circulated as CDV

2017-02

WG 6 K. B. Yeon, W. J. Kim 2018-04
IEC 63068-1 ED1

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

47/2334/CD 2016-07 PCC
  • PCC
  • Preparation of CC

2017-02

2017-03

WG 5 J. Ohno, J. Senzaki 2019-07