IEC 60191-1

Edition 2.0 (2007-04-24)

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Stability Date: 2014

IEC 60191-1

Edition 2.0 (2007-04-24)

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

Stability Date: 2014

IEC 60191-2

Edition 1.0 (1966-01-01)

Mechanical standardization of semiconductor devices. Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am1

Edition 1.0 (2001-03-15)

Amendment 1

Stability Date: 2013

IEC 60191-2-am2

Edition 1.0 (2001-06-20)

Amendment 2

Stability Date: 2013

IEC 60191-2-am3

Edition 1.0 (2001-08-28)

Amendment 3

Stability Date: 2013

IEC 60191-2-am4

Edition 1.0 (2001-11-27)

Amendment 4

Stability Date: 2013

IEC 60191-2-am5

Edition 1.0 (2002-02-12)

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am6

Edition 1.0 (2002-05-01)

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am7

Edition 1.0 (2002-05-10)

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am8

Edition 1.0 (2003-06-27)

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am9

Edition 1.0 (2003-11-19)

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am10

Edition 1.0 (2004-03-29)

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am11

Edition 1.0 (2004-11-23)

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am12

Edition 1.0 (2006-03-24)

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am13

Edition 1.0 (2006-07-17)

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am14

Edition 1.0 (2006-07-17)

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am15

Edition 1.0 (2006-07-17)

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am16

Edition 1.0 (2007-07-25)

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am17

Edition 1.0 (2008-05-27)

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am18

Edition 1.0 (2011-11-22)

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-2-am19

Edition 1.0 (2012-10-02)

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2013

IEC 60191-3

Edition 2.0 (1999-10-29)

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

Stability Date: 2015

IEC 60191-3

Edition 2.0 (1999-10-29)

Versión Oficial en Español - Normalización mecánica de dispositivos semiconductores. Parte 3: Reglas generales para la preparación de esquemas de circuitos integrados

Stability Date: 2015

IEC 60191-4

Edition 2.2 (2002-10-22)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Stability Date: 2012

IEC 60191-4

Edition 2.0 (1999-10-08)

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Stability Date: 2012

IEC 60191-4

Edition 2.0 (1999-10-08)

Versión Oficial en Español - Normalización mecánica de dispositivos semiconductores. Parte 4: Sistema de codificación y clasificación para tipos y formas de los encapsulados de dispositivos semicondutores.

Stability Date: 2012

IEC 60191-4-am1

Edition 2.0 (2001-11-27)

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Stability Date: 2012

IEC 60191-4-am1

Edition 2.0 (2001-11-27)

VERSION OFICIAL EN ESPANOL - Modificación 1 - Normalización mecánica de dispositivos semiconductores. Parte 4: Sistema de codificación y clasificación para los tipos y formas de los encapsulados de dispositivos semiconductores.

Stability Date: 2012

IEC 60191-4-am2

Edition 2.0 (2002-07-17)

Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

Stability Date: 2012

IEC 60191-4-am2

Edition 2.0 (2002-07-17)

VERSION OFICIAL EN ESPANOL - Modificación 2 - Normalización mecánica de dispositivos semiconductores. Parte 4: Sistema de codificación y clasificación para los tipos y formas de los encapsulados de dispositivos semiconductores.

Stability Date: 2012

IEC 60191-5

Edition 2.0 (1997-04-23)

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

Stability Date: 2015

IEC 60191-6

Edition 3.0 (2009-11-26)

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

Stability Date: 2015

IEC 60191-6-1

Edition 1.0 (2001-10-30)

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

Stability Date: 2021

IEC 60191-6-1

Edition 1.0 (2001-10-30)

Versión Oficial En español - Normalización mecánica de dispositivos semiconductores. Parte 6-1: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Guía de diseño de los terminales en forma de ala de gaviota e

Stability Date: 2021

IEC 60191-6-2

Edition 1.0 (2001-12-11)

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Stability Date: 2016

IEC 60191-6-2

Edition 1.0 (2001-12-11)

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Stability Date: 2016

IEC 60191-6-2

Edition 1.0 (2002-10-18)

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

Stability Date: 2016

IEC 60191-6-2

Edition 1.0 (2001-12-11)

Versión Oficial En español (Incluye el Corrigendum 1 de Octubre de 2002) - Normalización mecánica de dispositivos semiconductores. Parte 6-2: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superificie. Guía de diseño para paquetes de terminales de columnas y bolas de paso 1,50 mm, 1,27 mm y 1,00 mm

Stability Date: 2016

IEC 60191-6-3

Edition 1.0 (2000-09-29)

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Stability Date: 2016

IEC 60191-6-3

Edition 1.0 (2000-09-29)

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

Stability Date: 2016

IEC 60191-6-4

Edition 1.0 (2003-06-11)

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Stability Date: 2017

IEC 60191-6-4

Edition 1.0 (2003-06-11)

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

Stability Date: 2017

IEC 60191-6-5

Edition 1.0 (2001-08-27)

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

Stability Date: 2012

IEC 60191-6-5

Edition 1.0 (2001-08-27)

Versión Oficial En español - Normalización mecánica de dispositivos semiconductores. Parte 6-5: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Guia de diseño de rejilla matricial de bolas de paso fino (FB

Stability Date: 2012

IEC 60191-6-6

Edition 1.0 (2001-03-22)

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Stability Date: 2012

IEC 60191-6-6

Edition 1.0 (2001-03-22)

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

Stability Date: 2012

IEC 60191-6-8

Edition 1.0 (2001-08-27)

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Stability Date: 2014

IEC 60191-6-8

Edition 1.0 (2001-08-27)

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

Stability Date: 2014

IEC 60191-6-8

Edition 1.0 (2001-08-27)

Versión Oficial En español - Normalización mecánica de dispositivos semiconductores. Parte 6-8: Reglas generales para la preparación de los diseños de los paquetes de dispositivos semiconductores de montaje en superficie. Guía de diseño de un conjunto cuadrángulo cerámico recubierto

Stability Date: 2014

IEC 60191-6-10

Edition 1.0 (2003-11-19)

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Stability Date: 2016

IEC 60191-6-10

Edition 1.0 (2003-11-19)

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

Stability Date: 2016

IEC 60191-6-10

Edition 1.0 (2003-11-19)

Versión Oficial En español - Normalización mecánica de dispositivos de semiconductores. Parte 6-10: Reglas generales para la preparación de los diseños de los paquetes de dispositivos de semiconductores de montaje en superficie. Dimensiones de los paquetes P-VSON.

Stability Date: 2016

IEC 60191-6-12

Edition 2.0 (2011-06-08)

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

Stability Date: 2016

IEC 60191-6-13

Edition 1.0 (2007-06-27)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Stability Date: 2017

IEC 60191-6-13

Edition 1.0 (2007-06-27)

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

Stability Date: 2017

IEC 60191-6-16

Edition 1.0 (2007-04-26)

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Stability Date: 2014

IEC 60191-6-16

Edition 1.0 (2007-04-26)

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

Stability Date: 2014

IEC 60191-6-17

Edition 1.0 (2011-01-27)

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

Stability Date: 2017

IEC 60191-6-18

Edition 1.0 (2010-01-07)

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Stability Date: 2014

IEC 60191-6-18

Edition 1.0 (2010-05-31)

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Stability Date: 2014

IEC 60191-6-18

Edition 1.0 (2010-07-28)

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

Stability Date: 2014

IEC 60191-6-19

Edition 1.0 (2010-02-25)

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

Stability Date: 2014

IEC 60191-6-20

Edition 1.0 (2010-08-30)

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

Stability Date: 2016

IEC 60191-6-21

Edition 1.0 (2010-08-30)

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

Stability Date: 2016

IEC 60191-6-22

Edition 1.0 (2012-12-11)

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

Stability Date: 2022

IEC 60191-2T

Edition 1.0 (1996-12-20)

Eighteenth supplement

Stability Date: 2014

IEC 60191-2U

Edition 1.0 (1997-05-09)

Nineteenth supplement

Stability Date: 2014

IEC 60191-2V

Edition 1.0 (1998-12-22)

Twentieth supplement

Stability Date: 2014

IEC 60191-2W

Edition 1.0 (1999-07-29)

Twenty-first supplement

Stability Date: 2014

IEC 60191-2X

Edition 1.0 (1999-09-30)

Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2014

IEC 60191-2X

Edition 1.0 (2000-01-31)

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Stability Date: 2014

IEC 60191-2Y

Edition 1.0 (2000-06-16)

Vingt-troisième complément à la Publication 60191-2 (1966)

Stability Date: 2014

IEC 60191-2Z

Edition 1.0 (2000-09-29)

Twenty-fourth supplement to Publication 60191-2 (1966) MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - Part 2: Dimensions

Stability Date: 2014

IEC 60191-2 DB-12M

Edition 1.0 (2012-09-21)

Mechanical standardization of semiconductor devices - Part 2: Dimensions