IEC 60748-1

Edition 2.0 (2002-05-08)

Semiconductor devices - Integrated circuits - Part 1: General

Stability Date: 2015

IEC 60748-2

Edition 2.0 (1997-12-22)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

Stability Date: 2015

IEC 60748-2-1

Edition 1.0 (1991-10-01)

Semiconductor devices - Integrated circuits - Part 2-1: Digital integrated circuits - Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

Stability Date: 2015

IEC 60748-2-2

Edition 1.0 (1992-02-29)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

Stability Date: 2017

IEC 60748-2-2-am1

Edition 1.0 (1994-06-07)

Amendment 1 - Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

Stability Date: 2017

IEC 60748-2-3

Edition 1.0 (1992-02-20)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)

Stability Date: 2017

IEC 60748-2-4

Edition 1.0 (1992-01-30)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB

Stability Date: 2017

IEC 60748-2-5

Edition 1.0 (1992-01-31)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)

Stability Date: 2017

IEC 60748-2-6

Edition 1.0 (1991-11-15)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits

Stability Date: 2017

IEC 60748-2-7

Edition 1.0 (1992-10-23)

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories

Stability Date: 2017

IEC 60748-2-8

Edition 1.0 (1993-07-29)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories

Stability Date: 2017

IEC 60748-2-9

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

Stability Date: 2017

IEC 60748-2-10

Edition 1.0 (1994-12-21)

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

Stability Date: 2018

IEC 60748-2-11

Edition 1.0 (1999-04-12)

Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

Stability Date: 2018

IEC 60748-2-12

Edition 1.0 (2001-01-30)

Semiconductor devices - Integrated circuits - part2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

Stability Date: 2018

IEC 60748-2-20

Edition 2.0 (2008-02-27)

Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

Stability Date: 2017

IEC 60748-3

Edition 1.0 (1986-01-01)

Semiconductor devices - Integrated circuits - Part 3: Analogue integrated circuits

Stability Date: 2016

IEC 60748-3-am1

Edition 1.0 (1991-11-15)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Stability Date: 2016

IEC 60748-3-am2

Edition 1.0 (1994-02-08)

Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Stability Date: 2016

IEC 60748-3-am2

Edition 1.0 (1996-06-11)

Corrigendum 1 to Amendment 2 - Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

Stability Date: 2016

IEC 60748-3-1

Edition 1.0 (1991-08-02)

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers

Stability Date: 2017

IEC 60748-4

Edition 2.0 (1997-04-23)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits

Stability Date: 2015

IEC 60748-4-1

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

Stability Date: 2015

IEC 60748-4-2

Edition 1.0 (1993-11-11)

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

Stability Date: 2015

IEC 60748-4-3

Edition 1.0 (2006-08-29)

Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

Stability Date: 2017

IEC 60748-5

Edition 1.0 (1997-05-30)

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

Stability Date: 2015

IEC 60748-11

Edition 1.0 (1990-12-20)

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Stability Date: 2016

IEC 60748-11-am1

Edition 1.0 (1995-06-06)

Amendment 1 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Stability Date: 2016

IEC 60748-11-am2

Edition 1.0 (1999-04-16)

Amendment 2 - Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

Stability Date: 2016

IEC 60748-11-1

Edition 1.0 (1992-04-01)

Semiconductor devices - Integrated circuits - Part 11-1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

Stability Date: 2016

IEC 60748-20

Edition 1.0 (1988-06-30)

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Stability Date: 2017

IEC 60748-20-am1

Edition 1.0 (1995-09-22)

Amendment 1 - Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

Stability Date: 2017

IEC 60748-20-1

Edition 1.0 (1994-03-01)

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

Stability Date: 2017

IEC 60748-21

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

Stability Date: 2015

IEC 60748-21-1

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

Stability Date: 2015

IEC 60748-22

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Stability Date: 2015

IEC 60748-22-1

Edition 2.0 (1997-04-10)

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

Stability Date: 2015

IEC 60748-23-1

Edition 1.0 (2002-05-15)

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

Stability Date: 2016

IEC 60748-23-2

Edition 1.0 (2002-05-23)

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

Stability Date: 2016

IEC 60748-23-3

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

Stability Date: 2016

IEC 60748-23-4

Edition 1.0 (2002-05-17)

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

Stability Date: 2016

IEC 60748-23-5

Edition 1.0 (2003-10-03)

Semiconductor devices - Integrated circuits, Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval

Stability Date: 2016

IEC 61739

Edition 1.0 (1996-10-30)

Integrated circuits - Part 1: Procedures for manufacturing line approval and quality management

Stability Date: 2015

IEC 61943

Edition 1.0 (1999-03-19)

Integrated circuits - Manufacturing line approval application guideline

Stability Date: 2015

IEC/TS 61944

Edition 1.0 (2000-01-31)

Integrated circuits - Manufacturing line approval - Demonstration vehicles

Stability Date: 2017

IEC/TS 61945

Edition 1.0 (2000-03-10)

Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

Stability Date: 2017

IEC 61964

Edition 1.0 (1999-04-30)

Integrated circuits - Memory devices pin configurations

Stability Date: 2015

IEC 61967-1

Edition 1.0 (2002-03-12)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions

Stability Date: 2017

IEC/TR 61967-1-1

Edition 1.0 (2010-05-11)

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

Stability Date: 2014

IEC 61967-2

Edition 1.0 (2005-09-29)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

Stability Date: 2017

IEC/TS 61967-3

Edition 1.0 (2005-06-10)

Integrated circuits - Measurement of electromagnetic emissions, 150 KHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method

Stability Date: 2015

IEC 61967-4

Edition 1.1 (2006-07-27)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

Stability Date: 2015

IEC 61967-4

Edition 1.0 (2002-04-30)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method

Stability Date: 2015

IEC 61967-4-am1

Edition 1.0 (2006-02-09)

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method

Stability Date: 2015

IEC/TR 61967-4-1

Edition 1.0 (2005-02-07)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ω/150 Ω direct coupling method - Application guidance to IEC 61967-4

Stability Date: 2014

IEC 61967-5

Edition 1.0 (2003-02-13)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method

Stability Date: 2014

IEC 61967-6

Edition 1.1 (2008-06-24)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Stability Date: 2018

IEC 61967-6

Edition 1.0 (2002-06-25)

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Stability Date: 2018

IEC 61967-6

Edition 1.0 (2010-08-30)

Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Stability Date: 2018

IEC 61967-6-am1

Edition 1.0 (2008-03-12)

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

Stability Date: 2018

IEC 61967-8

Edition 1.0 (2011-08-11)

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

Stability Date: 2015

IEC 62132-1

Edition 1.0 (2006-01-19)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions

Stability Date: 2017

IEC 62132-2

Edition 1.0 (2010-03-30)

Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method

Stability Date: 2014

IEC 62132-3

Edition 1.0 (2007-09-26)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

Stability Date: 2015

IEC 62132-4

Edition 1.0 (2006-02-21)

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method

Stability Date: 2015

IEC 62132-5

Edition 1.0 (2005-10-10)

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method

Stability Date: 2014

IEC 62132-8

Edition 1.0 (2012-07-06)

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

Stability Date: 2016

IEC/TS 62215-2

Edition 1.0 (2007-09-10)

Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

Stability Date: 2017

IEC/TS 62228

Edition 1.0 (2007-02-16)

Integrated circuits - EMC evaluation of CAN transceivers

Stability Date: 2015

IEC/TS 62404

Edition 1.0 (2007-02-20)

Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

Stability Date: 2017

IEC/TS 62433-1

Edition 1.0 (2011-04-21)

EMC IC modelling - Part 1: General modelling framework

Stability Date: 2016

IEC 62433-2

Edition 1.0 (2008-10-08)

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

Stability Date: 2015

IEC 62433-2

Edition 1.0 (2008-10-08)

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

Stability Date: 2015

IEC/TR 62433-2-1

Edition 1.0 (2010-10-05)

EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission

Stability Date: 2018