IEC 60068-2-20

Edition 5.0 (2008-07-21)

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Stability Date: 2014

IEC 60068-2-20

Edition 5.0 (2008-07-21)

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

Stability Date: 2014

IEC 60068-2-21

Edition 6.0 (2006-06-22)

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Stability Date: 2016

IEC 60068-2-21

Edition 6.0 (2012-01-24)

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Stability Date: 2016

IEC 60068-2-21

Edition 6.0 (2006-06-22)

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

Stability Date: 2016

IEC 60068-2-21

Edition 6.0 (2006-06-22)

Versión Oficial en Español - Ensayos ambientales. Parte 2-21: Ensayos. Ensayo U: Robustez de los terminales y de los dispositivos de montaje incorporados

Stability Date: 2016

IEC 60068-2-44

Edition 2.0 (1995-01-30)

Environmental testing - Part 2: Tests - Guidance on test T: Soldering

Stability Date: 2014

IEC 60068-2-44

Edition 2.0 (1995-08-01)

Corrigendum 1 - Environmental testing - Part 2: Tests - Guidance on test T: Soldering

Stability Date: 2014

IEC 60068-2-44

Edition 2.0 (1995-01-30)

VERSION OFICIAL EN ESPANOL (Incluye corrigendum:1995) Ensayos ambientales. Parte 2: Ensayos. Guía para el ensayo T: Soldadura.

Stability Date: 2014

IEC 60068-2-54

Edition 2.0 (2006-04-27)

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

Stability Date: 2015

IEC 60068-2-54

Edition 2.0 (2006-04-27)

Versión Oficial En español - Ensayos ambientales. Parte 2-54: Ensayos. Ensayo Ta: Ensayo de soldabilidad de componentes electrónicos por el método de la balanza de mojado

Stability Date: 2015

IEC 60068-2-58

Edition 3.0 (2004-07-15)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Stability Date: 2013

IEC 60068-2-58

Edition 3.0 (2004-07-15)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

Stability Date: 2013

IEC 60068-2-58

Edition 3.0 (2005-02-23)

Versión Oficial en Español - Ensayos ambientales. Parte 2-58: Ensayos. Ensayo Td: Métodos de ensayo de soldabilidad, resistencia de la metalización a la disolución y resistencia de los componentes para montaje en superficie (CMS) al calor de la soldadura.

Stability Date: 2013

IEC 60068-2-69

Edition 2.0 (2007-05-09)

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Stability Date: 2014

IEC 60068-2-69

Edition 2.0 (2007-05-09)

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

Stability Date: 2014

IEC 60068-2-69

Edition 2.0 (2007-05-29)

Versión Oficial En español - Ensayos ambientales. Parte 2-69: Ensayos. Ensayo Te: Ensayo de soldabilidad de componentes electrónicos para los dispositivos de montaje en superficie (SMD) por el método de equilibrado humectante

Stability Date: 2014

IEC 60068-2-77

Edition 1.0 (1999-01-15)

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Stability Date: 2014

IEC 60068-2-77

Edition 1.0 (1999-01-15)

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

Stability Date: 2014

IEC 60068-2-77

Edition 1.0 (1999-01-15)

Versión Oficial en Español - Ensayos ambientales. Parte 2-77: Ensayos. Ensayo 77: Resistencia del cuerpo y resistencia al choque por impacto.

Stability Date: 2014

IEC 60068-2-82

Edition 1.0 (2007-05-23)

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Stability Date: 2015

IEC 60068-2-82

Edition 1.0 (2009-12-17)

Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Stability Date: 2015

IEC 60068-2-82

Edition 1.0 (2007-05-23)

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

Stability Date: 2015

IEC 60068-2-82

Edition 1.0 (2007-05-13)

Versión Oficial En español - Ensayos ambientales. Parte 2-82: Ensayo. Ensayo Tx: Métodos de ensayo whisker para componentes eléctricos y electrónicos

Stability Date: 2015

IEC 60068-2-83

Edition 1.0 (2011-09-07)

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

Stability Date: 2015

IEC/TR 60068-3-12

Edition 1.0 (2007-03-12)

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

Stability Date: 2013

IEC 60097

Edition 4.0 (1991-05-28)

Grid systems for printed circuits

Stability Date: 2014

IEC 60097

Edition 4.0 (1991-05-28)

VERSION OFICIAL EN ESPANOL - Sistemas de retícula para circuitos impresos.

Stability Date: 2014

IEC 60194

Edition 5.0 (2006-02-09)

Printed board design, manufacture and assembly - Terms and definitions

Stability Date: 2012

IEC 61182-1

Edition 1.0 (1994-09-09)

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

Stability Date: 2014

IEC 61182-2

Edition 1.0 (2006-09-27)

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

Stability Date: 2012

IEC 61182-2-2

Edition 1.0 (2012-04-27)

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

Stability Date: 2016

IEC 61182-7

Edition 1.0 (1995-09-22)

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

Stability Date: 2014

IEC 61182-7

Edition 1.0 (2002-10-15)

Corrigendum 1 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

Stability Date: 2014

IEC 61182-7

Edition 1.0 (1995-09-22)

VERSION OFICIAL EN ESPANOL - Tarjetas con circuito impreso. Descriptión y transmisión de datos informáticos. Parte 7: Codificación digital de los datos de los ensayos eléctricos en tarjetas desnudas.

Stability Date: 2014

IEC 61182-10

Edition 1.0 (1999-12-22)

Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy

Stability Date: 2014

IEC 61188-1-1

Edition 1.0 (1997-08-26)

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

Stability Date: 2014

IEC 61188-1-2

Edition 1.0 (1998-04-29)

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

Stability Date: 2014

IEC 61188-5-1

Edition 1.0 (2002-07-12)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

Stability Date: 2014

IEC 61188-5-2

Edition 1.0 (2003-06-24)

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

Stability Date: 2014

IEC 61188-5-3

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Stability Date: 2014

IEC 61188-5-3

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

Stability Date: 2014

IEC 61188-5-4

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Stability Date: 2014

IEC 61188-5-4

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

Stability Date: 2014

IEC 61188-5-5

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Stability Date: 2014

IEC 61188-5-5

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

Stability Date: 2014

IEC 61188-5-6

Edition 1.0 (2003-01-23)

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

Stability Date: 2014

IEC 61188-5-8

Edition 1.0 (2007-10-30)

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Stability Date: 2014

IEC 61188-5-8

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

Stability Date: 2014

IEC 61188-7

Edition 1.0 (2009-05-26)

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Stability Date: 2014

IEC 61188-7

Edition 1.0 (2009-05-26)

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Stability Date: 2014

IEC 61188-7

Edition 1.0 (2009-07-14)

Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

Stability Date: 2014

IEC 61189-1

Edition 1.1 (2001-11-22)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Stability Date: 2015

IEC 61189-1

Edition 1.0 (1997-03-27)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Stability Date: 2015

IEC 61189-1-am1

Edition 1.0 (2001-08-09)

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

Stability Date: 2015

IEC 61189-2

Edition 2.0 (2006-05-30)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

Stability Date: 2013

IEC 61189-3

Edition 2.0 (2007-10-09)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Stability Date: 2013

IEC 61189-3

Edition 2.0 (2007-10-09)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Stability Date: 2013

IEC/PAS 61189-3-913

Edition 1.0 (2011-01-31)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs

Stability Date: 2014

IEC 61189-5

Edition 1.0 (2006-08-29)

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Stability Date: 2015

IEC 61189-5

Edition 1.0 (2006-08-29)

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

Stability Date: 2015

IEC 61189-6

Edition 1.0 (2006-07-24)

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Stability Date: 2015

IEC 61189-6

Edition 1.0 (2006-07-24)

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

Stability Date: 2015

IEC 61190-1-1

Edition 1.0 (2002-03-25)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

Stability Date: 2013

IEC 61190-1-2

Edition 2.0 (2007-04-26)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Stability Date: 2013

IEC 61190-1-2

Edition 2.0 (2007-04-26)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

Stability Date: 2013

IEC 61190-1-3

Edition 2.1 (2010-11-10)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Stability Date: 2014

IEC 61190-1-3

Edition 2.0 (2007-04-26)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Stability Date: 2014

IEC 61190-1-3

Edition 2.0 (2007-04-26)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Stability Date: 2014

IEC 61190-1-3-am1

Edition 2.0 (2010-06-10)

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

Stability Date: 2014

IEC 61191-1

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

Stability Date: 2014

IEC 61191-2

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

Stability Date: 2014

IEC 61191-3

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

Stability Date: 2014

IEC 61191-4

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

Stability Date: 2014

IEC 61191-6

Edition 1.0 (2010-01-14)

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

Stability Date: 2014

IEC 61192-1

Edition 1.0 (2003-02-20)

Workmanship requirements for soldered electronic assemblies - Part 1: General

Stability Date: 2014

IEC 61192-2

Edition 1.0 (2003-03-14)

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

Stability Date: 2014

IEC 61192-3

Edition 1.0 (2002-12-17)

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

Stability Date: 2014

IEC 61192-4

Edition 1.0 (2002-11-29)

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

Stability Date: 2014

IEC 61192-5

Edition 1.0 (2007-05-23)

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Stability Date: 2014

IEC 61192-5

Edition 1.0 (2007-05-23)

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

Stability Date: 2014

IEC 61193-1

Edition 1.0 (2001-12-19)

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

Stability Date: 2014

IEC 61193-2

Edition 1.0 (2007-08-30)

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

Stability Date: 2016

IEC 61193-3

Edition 1.0 (2013-01-24)

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

Stability Date: 2015

IEC 61249-2-1

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Stability Date: 2013

IEC 61249-2-2

Edition 1.0 (2005-01-20)

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

Stability Date: 2013

IEC 61249-2-4

Edition 1.0 (2001-12-19)

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-4

Edition 1.0 (2001-12-19)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-4: Materiales de base reforzados, con y sin revestimiento. Laminado de poliéster reforzado con fibra de vidrio no trenzada/trenzada, de inflamabilidad definida (ensayo de combu

Stability Date: 2013

IEC 61249-2-5

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2015

IEC 61249-2-5

Edition 1.0 (2003-11-12)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-5: Materiales de base reforzados, con y sin revestimiento. Laminado de papel de celulosa de epóxido bromado con nucleo reforzado y superficie reforzada con fibra de vidrio de Tipo E trenzada, de inflamabilidad definida (ensayo de combustión vertical) con revestimiento de cobre

Stability Date: 2015

IEC 61249-2-6

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-6

Edition 1.0 (2003-11-12)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-6: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado con fibra de vidrio de tipo E trenzada/no trenzada de epóxido bromado, de inflamabilidad definida (ensayo de combustión vertical), con revestimiento de cobre

Stability Date: 2013

IEC 61249-2-7

Edition 1.0 (2002-03-05)

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-8

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-8

Edition 1.0 (2003-02-27)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-8: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado con fibra de vidrio trenzada con epóxido bromado modificado, de inflamabilidad definida (ensayo de

Stability Date: 2013

IEC 61249-2-9

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-9

Edition 1.0 (2003-02-27)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-9: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado con fibra de vidrio de tipo E trenzada con epóxido, modificado o no, y con bismaleimida/triacina,

Stability Date: 2013

IEC 61249-2-10

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-10

Edition 1.0 (2003-02-27)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-10: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado con fibra de vidrio de tipo E trenzada con epóxido bromado modificado o no, y con éster de cianat

Stability Date: 2013

IEC 61249-2-11

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-11

Edition 1.0 (2003-11-12)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-11: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado de fibra de vidrio de tipo E trenzada con epóxido bromado, modificado o no y con poliimida, de inflamabilidad definida (ensayo de combustión vertical) con revestimiento de cobre

Stability Date: 2013

IEC 61249-2-12

Edition 1.0 (1999-01-29)

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Stability Date: 2013

IEC 61249-2-12

Edition 1.0 (1999-01-29)

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

Stability Date: 2013

IEC 61249-2-12

Edition 1.0 (1999-01-29)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-12: Conjunto de especificaciones intermedias para los materiales de base reforzados, con y sin revestimiento laminado a base de aramida no trenzada adherida mediante resinaepox

Stability Date: 2013

IEC 61249-2-13

Edition 1.0 (1999-02-26)

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Stability Date: 2013

IEC 61249-2-13

Edition 1.0 (1999-02-26)

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

Stability Date: 2013

IEC 61249-2-13

Edition 1.0 (1999-02-26)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-13: Conjunto de especificaciones intermedias para los materiales de base reforzados, con y sin revestimiento. Laminado a base de aramida no trenzada adherida mediante resinaést

Stability Date: 2013

IEC 61249-2-18

Edition 1.0 (2002-02-13)

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-18

Edition 1.0 (2002-02-13)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-18: Materiales de base reforzados, con y sin revestimiento. Laminado de poliéster reforzado con fibra de vidrio no trenzada, de inflamabilidad definida (ensayo de combustión ve

Stability Date: 2013

IEC 61249-2-19

Edition 1.0 (2001-11-28)

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

Stability Date: 2013

IEC 61249-2-19

Edition 1.0 (2001-11-28)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-19: Materiales de base reforzados, con y sisn revestiminento. Laminado de epóxidos, reforzado con fibra de vidrio lineal de capas cruzadas, de inflamabilidad definida (ensayo d

Stability Date: 2013

IEC 61249-2-21

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-21

Edition 1.0 (2003-11-12)

Versión Oficial En español - Materiales para placas impresas y otras estructuras de interconexión. Parte 2-21: Materiales de base reforzados, con y sin revestimiento. Laminado reforzado de fibra de vidrio de tipo E trenzada de epóxido no halogenado, de inflamabilidad definida (ensayo de combustión vertical) con revestimiento de cobre

Stability Date: 2013

IEC 61249-2-22

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-23

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

Stability Date: 2013

IEC 61249-2-26

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2013

IEC 61249-2-27

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

Stability Date: 2016

IEC 61249-2-30

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

Stability Date: 2016

IEC 61249-2-31

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

Stability Date: 2014

IEC 61249-2-32

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

Stability Date: 2014

IEC 61249-2-33

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

Stability Date: 2014

IEC 61249-2-34

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

Stability Date: 2014

IEC 61249-2-35

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC 61249-2-36

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC 61249-2-37

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC 61249-2-38

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC 61249-2-39

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2016

IEC 61249-2-40

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2016

IEC 61249-2-41

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC 61249-2-42

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

Stability Date: 2014

IEC/PAS 61249-3-1

Edition 1.0 (2007-05-30)

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

Stability Date: 2013

IEC 61249-3-3

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Stability Date: 2013

IEC 61249-3-3

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

Stability Date: 2013

IEC 61249-3-3

Edition 1.0 (1999-02-10)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 3-3: Conjunto de especificaciones seccionales para materiales de base no reforzados, con y sin revestimiento (concebidos para placas impresas flexibles).Película de poliesterflex

Stability Date: 2013

IEC 61249-3-4

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Stability Date: 2013

IEC 61249-3-4

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

Stability Date: 2013

IEC 61249-3-4

Edition 1.0 (1999-02-10)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 3-4: Conjunto de especificaciones seccionales para los materiales de base no reforzados con y sin revestimiento (concebidos para placas impresas flexibles). Pelicula de poliimida

Stability Date: 2013

IEC 61249-3-5

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Stability Date: 2013

IEC 61249-3-5

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

Stability Date: 2013

IEC 61249-3-5

Edition 1.0 (1999-02-10)

Versión Oficial en Español - Materiales para placas impresas y otras estructuras de interconexión. Parte 3-5: Conjunto de especificaciones seccionales para los materiales de base no reforzados con y sin revestimiento (concebidos para placas impresas flexibles).Peliculas de transmisi

Stability Date: 2013

IEC 61249-4-1

Edition 1.0 (2008-01-30)

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-1

Edition 1.0 (2008-01-30)

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-2

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-5

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-11

Edition 1.0 (2005-09-22)

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-12

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

Stability Date: 2013

IEC 61249-4-14

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-14

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-15

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-15

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-16

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-16

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-17

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-4-17

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

Stability Date: 2014

IEC 61249-5-1

Edition 1.0 (1995-11-28)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

Stability Date: 2013

IEC 61249-5-1

Edition 1.0 (1995-11-28)

VERSION OFICIAL EN ESPANOL - Materiales para las estructuras de interconexión. Parte 5: Conjunto de especificaciones intermedias para hojas y películas conductoras con o sin revestimiento. Sección 1: Hojas de cobre (para la fabricación de materiales base chapados en cobre).

Stability Date: 2013

IEC 61249-5-4

Edition 1.0 (1996-06-18)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

Stability Date: 2013

IEC 61249-5-4

Edition 1.0 (1996-06-18)

VERSION OFICIAL EN ESPANOL - Materiales para estructuras de interconexión. Parte 5: Conjunto de especificaciones intermedias para láminas y películas conductoras con o sin revestimiento. Sección 4: Tintas conductoras.

Stability Date: 2013

IEC/PAS 61249-6-3

Edition 1.0 (2011-09-23)

Specification for finished fabric woven from "E" glass for printed boards

Stability Date: 2014

IEC 61249-7-1

Edition 1.0 (1995-04-26)

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

Stability Date: 2013

IEC 61249-7-1

Edition 1.0 (1995-04-26)

VERSION OFICIAL EN ESPANOL - Materiales para las estructuras de interconexión. Parte 7: Conjunto de especificaciones intermedias para materiales con alma que restringe la dilatación. Sección 1: Cobre/Invar/cobre.

Stability Date: 2013

IEC 61249-8-7

Edition 1.0 (1996-04-26)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

Stability Date: 2013

IEC 61249-8-7

Edition 1.0 (1996-04-26)

VERSION OFICIAL EN ESPANOL - Materiales para las estructuras de interconexión. Parte 8: Conjunto de especificaciones intermedias para películas y revestimientos no conductoras. Sección 7:Tintas para marcado de leyendas.

Stability Date: 2013

IEC 61249-8-8

Edition 1.0 (1997-06-24)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

Stability Date: 2013

IEC 61249-8-8

Edition 1.0 (1997-06-24)

Versión oficial en español - Materiales para estructuras de interconexión - Parte 8: Conjunto de especificaciones seccionales para películas no conductoras y revestimientos - Sección 8: Revestimientos poliméricos temporales

Stability Date: 2013

IEC 61445

Edition 1.0 (2012-06-21)

Digital Test Interchange Format (DTIF)

Stability Date: 2015

IEC 61523-1

Edition 2.0 (2012-06-21)

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

Stability Date: 2015

IEC 61523-3

Edition 1.0 (2004-09-24)

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

Stability Date: 2015

IEC 61671

Edition 1.0 (2012-06-21)

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML

Stability Date: 2015

IEC 61690-1

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

Stability Date: 2015

IEC 61690-2

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

Stability Date: 2015

IEC 61691-1-1

Edition 2.0 (2011-05-19)

Behavioural languages - Part 1-1: VHDL Language Reference Manual

Stability Date: 2013

IEC 61691-6

Edition 1.0 (2009-12-14)

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

Stability Date: 2013

IEC 61691-7

Edition 1.0 (2009-12-14)

Behavioural languages - Part 7: SystemC R Language Reference Manual

Stability Date: 2013

IEC 61760-1

Edition 2.0 (2006-04-10)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

Stability Date: 2015

IEC 61760-2

Edition 2.0 (2007-04-24)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Stability Date: 2015

IEC 61760-2

Edition 2.0 (2007-04-24)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

Stability Date: 2015

IEC 61760-3

Edition 1.0 (2010-03-16)

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

Stability Date: 2014

IEC/TR 61908

Edition 1.0 (2004-11-24)

The technology roadmap for industry data dictionary structure, utilization and implementation

Stability Date: 2015

IEC 61926-1

Edition 1.0 (1999-10-18)

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

Stability Date: 2015

IEC/TR 61926-1-1

Edition 1.0 (1999-10-20)

Design automation - Part 1-1: Harmonization of ATLAS test languages

Stability Date: 2015

IEC 62014-1

Edition 1.0 (2001-05-18)

Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)

Stability Date: 2015

IEC/TR 62014-3

Edition 1.0 (2002-12-04)

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

Stability Date: 2015

IEC 62016

Edition 1.0 (2003-12-18)

Core model of the electronics domain

Stability Date: 2012

IEC 62090

Edition 1.0 (2002-11-22)

Product package labels for electronic components using bar code and two-dimensional symbologies

Stability Date: 2016

IEC 62137

Edition 1.0 (2004-07-06)

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Stability Date: 2013

IEC 62137

Edition 1.0 (2004-07-06)

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Stability Date: 2013

IEC 62137

Edition 1.0 (2005-01-27)

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

Stability Date: 2013

IEC 62137-1-1

Edition 1.0 (2007-07-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Stability Date: 2014

IEC 62137-1-1

Edition 1.0 (2007-07-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

Stability Date: 2014

IEC 62137-1-2

Edition 1.0 (2007-07-25)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Stability Date: 2014

IEC 62137-1-2

Edition 1.0 (2007-07-25)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

Stability Date: 2014

IEC 62137-1-3

Edition 1.0 (2008-11-27)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

Stability Date: 2014

IEC 62137-1-4

Edition 1.0 (2009-01-26)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

Stability Date: 2014

IEC 62137-1-5

Edition 1.0 (2009-02-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

Stability Date: 2014

IEC 62137-3

Edition 1.0 (2011-11-08)

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

Stability Date: 2016

IEC 62243

Edition 2.0 (2012-06-21)

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

Stability Date: 2015

IEC 62326-1

Edition 2.0 (2002-03-05)

Printed boards - Part 1: Generic specification

Stability Date: 2013

IEC 62326-1

Edition 2.0 (2002-03-05)

Versión oficial en español - Tarjetas impresas - Parte 1: Especificación genérica

Stability Date: 2013

IEC 62326-4

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

Stability Date: 2013

IEC 62326-4

Edition 1.0 (1996-12-19)

Versión Oficial en Español - Tarjetas impresas. Parte 4: Tarjetas con circuito impreso multicapas rígidas con conexión entre las capas. Especificación intermedia.

Stability Date: 2013

IEC 62326-4-1

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

Stability Date: 2013

IEC 62326-4-1

Edition 1.0 (1996-12-19)

Versión oficial en español - Tarjetas impresas - Parte 4: Tarjetas con circuito impreso multicapa rígidas con conexiones entre las capas - Especificación intermedia - Sección 1: Especificación particular de competencia - Niveles de funcionamiento A, B y C

Stability Date: 2013

IEC/PAS 62326-7-1

Edition 1.0 (2007-04-26)

Performance guide for single- and double-sided flexible printed wiring boards

Stability Date: 2013

IEC/PAS 62326-14

Edition 1.0 (2010-09-29)

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

Stability Date: 2014

IEC/PAS 62326-20

Edition 1.0 (2011-01-26)

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs

Stability Date: 2014

IEC 62421

Edition 1.0 (2007-08-29)

Electronics assembly technology - Electronic modules

Stability Date: 2015

IEC 62525

Edition 1.0 (2007-11-07)

Standard Test Interface Language (STIL) for Digital Test Vector Data

Stability Date: 2015

IEC 62526

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

Stability Date: 2015

IEC 62527

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification

Stability Date: 2014

IEC 62528

Edition 1.0 (2007-11-07)

Standard Testability Method for Embedded Core-based Integrated Circuits

Stability Date: 2015

IEC 62529

Edition 2.0 (2012-06-21)

Standard for Signal and Test Definition

Stability Date: 2015

IEC 62530

Edition 2.0 (2011-05-19)

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

Stability Date: 2013

IEC 62531

Edition 2.0 (2012-06-21)

Property Specification Language (PSL)

Stability Date: 2015

IEC/PAS 62588

Edition 1.0 (2008-09-08)

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

Stability Date: 2014