International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Publications (22)

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IEC 62047-1:2005

Edition 1.0 (2005-09-27)

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

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IEC 62047-2:2006

Edition 1.0 (2006-08-15)

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

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IEC 62047-3:2006

Edition 1.0 (2006-08-15)

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

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IEC 62047-4:2008

Edition 1.0 (2008-08-21)

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

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IEC 62047-5:2011

Edition 1.0 (2011-07-13)

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

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IEC 62047-5:2011/COR1:2012

Edition 1.0 (2012-03-08)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

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IEC 62047-6:2009

Edition 1.0 (2009-04-07)

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

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IEC 62047-7:2011

Edition 1.0 (2011-06-16)

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

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IEC 62047-8:2011

Edition 1.0 (2011-03-14)

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

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IEC 62047-9:2011

Edition 1.0 (2011-07-13)

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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IEC 62047-9:2011/COR1:2012

Edition 1.0 (2012-03-08)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

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IEC 62047-10:2011

Edition 1.0 (2011-07-26)

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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IEC 62047-10:2011/COR1:2012

Edition 1.0 (2012-02-28)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

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IEC 62047-11:2013

Edition 1.0 (2013-07-17)

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

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IEC 62047-12:2011

Edition 1.0 (2011-09-13)

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

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IEC 62047-13:2012

Edition 1.0 (2012-02-28)

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

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IEC 62047-14:2012

Edition 1.0 (2012-02-28)

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

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IEC 62047-18:2013

Edition 1.0 (2013-07-17)

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

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IEC 62047-19:2013

Edition 1.0 (2013-07-17)

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

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IEC 62047-20:2014

Edition 1.0 (2014-06-26)

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

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IEC 62047-21:2014

Edition 1.0 (2014-06-19)

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

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IEC 62047-22:2014

Edition 1.0 (2014-06-19)

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

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