IEC 62047-1

Edition 1.0 (2005-09-27)

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

Stability Date: 2014

IEC 62047-2

Edition 1.0 (2006-08-15)

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

Stability Date: 2015

IEC 62047-3

Edition 1.0 (2006-08-15)

Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing

Stability Date: 2015

IEC 62047-4

Edition 1.0 (2008-08-21)

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

Stability Date: 2015

IEC 62047-5

Edition 1.0 (2011-07-13)

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

Stability Date: 2015

IEC 62047-5

Edition 1.0 (2012-03-08)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

Stability Date: 2015

IEC 62047-6

Edition 1.0 (2009-04-07)

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

Stability Date: 2015

IEC 62047-7

Edition 1.0 (2011-06-16)

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

Stability Date: 2015

IEC 62047-8

Edition 1.0 (2011-03-14)

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

Stability Date: 2015

IEC 62047-9

Edition 1.0 (2011-07-13)

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Stability Date: 2015

IEC 62047-9

Edition 1.0 (2012-03-08)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

Stability Date: 2015

IEC 62047-10

Edition 1.0 (2011-07-26)

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Stability Date: 2015

IEC 62047-10

Edition 1.0 (2012-02-28)

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

Stability Date: 2015

IEC 62047-12

Edition 1.0 (2011-09-13)

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

Stability Date: 2016

IEC 62047-13

Edition 1.0 (2012-02-28)

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

Stability Date: 2016

IEC 62047-14

Edition 1.0 (2012-02-28)

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

Stability Date: 2016