International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Publications (159)

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IEC 60068-2-20:2008

Edition 5.0 (2008-07-21)

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads

EN-FR, EN
Preview
IEC 60068-2-21:2006

Edition 6.0 (2006-06-22)

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

EN-FR, EN, ES
No preview
IEC 60068-2-21:2006/COR1:2012

Edition 6.0 (2012-01-24)

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices

EN-FR
Preview
IEC 60068-2-44:1995

Edition 2.0 (1995-01-30)

Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering

EN-FR, ES, RU
No preview
IEC 60068-2-44:1995/COR1:1995

Edition 2.0 (1995-08-01)

Corrigendum 1 - Environmental testing - Part 2: Tests - Guidance on test T: Soldering

EN-FR
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IEC 60068-2-54:2006

Edition 2.0 (2006-04-27)

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method

EN-FR, EN, ES
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IEC 60068-2-58:2004

Edition 3.0 (2004-07-15)

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)

EN-FR, EN, ES
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IEC 60068-2-69:2007

Edition 2.0 (2007-05-09)

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method

EN-FR, EN, ES
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IEC 60068-2-77:1999

Edition 1.0 (1999-01-15)

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock

EN-FR, EN, ES
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IEC 60068-2-82:2007

Edition 1.0 (2007-05-13)

Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

EN-FR, EN, ES
No preview
IEC 60068-2-82:2007/COR1:2009

Edition 1.0 (2009-12-17)

Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test XW1: Whisker test methods for electronic and electric components

EN-FR
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IEC 60068-2-83:2011

Edition 1.0 (2011-09-07)

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste

EN-FR
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IEC TR 60068-3-12:2007

Edition 1.0 (2007-03-12)

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile

EN
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IEC 60097:1991

Edition 4.0 (1991-05-28)

Grid systems for printed circuits

EN-FR, ES
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IEC 60194:2006

Edition 5.0 (2006-02-09)

Printed board design, manufacture and assembly - Terms and definitions

EN
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IEC 61182-1:1994

Edition 1.0 (1994-09-09)

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form

EN-FR
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IEC 61182-2:2006

Edition 1.0 (2006-09-27)

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements

EN
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IEC 61182-2-2:2012

Edition 1.0 (2012-04-27)

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description

EN-FR
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IEC 61182-7:1995

Edition 1.0 (1995-09-22)

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

EN-FR, ES
No preview
IEC 61182-7:1995/COR1:2002

Edition 1.0 (2002-10-15)

Corrigendum 1 - Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form

EN-FR
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IEC 61182-10:1999

Edition 1.0 (1999-12-22)

Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy

EN
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IEC 61188-1-1:1997

Edition 1.0 (1997-08-26)

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies

EN-FR
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IEC 61188-1-2:1998

Edition 1.0 (1998-04-29)

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance

EN-FR
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IEC 61188-5-1:2002

Edition 1.0 (2002-07-12)

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements

EN-FR
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IEC 61188-5-2:2003

Edition 1.0 (2003-06-24)

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components

EN-FR
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IEC 61188-5-3:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides

EN-FR, EN
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IEC 61188-5-4:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides

EN-FR, EN
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IEC 61188-5-5:2007

Edition 1.0 (2007-10-30)

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides

EN-FR, EN
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IEC 61188-5-6:2003

Edition 1.0 (2003-01-23)

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides

EN-FR
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IEC 61188-5-8:2007

Edition 1.0 (2007-10-30)

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)

EN-FR, EN
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IEC 61188-7:2009

Edition 1.0 (2009-05-26)

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

EN-FR, EN
No preview
IEC 61188-7:2009/COR1:2009

Edition 1.0 (2009-07-14)

Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction

EN
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IEC 61189-1:1997+AMD1:2001 CSV

Edition 1.1 (2001-11-22)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
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IEC 61189-1:1997

Edition 1.0 (1997-03-27)

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
No preview
IEC 61189-1:1997/AMD1:2001

Edition 1.0 (2001-08-09)

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology

EN-FR
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IEC 61189-2:2006

Edition 2.0 (2006-05-30)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures

EN
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IEC 61189-3:2007

Edition 2.0 (2007-10-09)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

EN-FR, EN
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IEC PAS 61189-3-913:2011

Edition 1.0 (2011-01-31)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs

EN
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IEC 61189-5:2006

Edition 1.0 (2006-08-29)

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies

EN-FR, EN
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IEC 61189-6:2006

Edition 1.0 (2006-07-24)

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies

EN-FR, EN
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IEC 61189-11:2013

Edition 1.0 (2013-05-07)

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys

EN-FR
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IEC 61190-1-1:2002

Edition 1.0 (2002-03-25)

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly

EN-FR
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IEC 61190-1-2:2014

Edition 3.0 (2014-02-19)

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly

EN-FR
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IEC 61190-1-3:2007+AMD1:2010 CSV

Edition 2.1 (2010-11-10)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

EN-FR
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IEC 61190-1-3:2007

Edition 2.0 (2007-04-26)

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

EN-FR, EN
No preview
IEC 61190-1-3:2007/AMD1:2010

Edition 2.0 (2010-06-10)

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications

EN-FR
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IEC 61191-1:2013

Edition 2.0 (2013-05-21)

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies

EN-FR
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IEC 61191-2:2013

Edition 2.0 (2013-06-05)

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies

EN-FR
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IEC 61191-3:1998

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies

EN-FR
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IEC 61191-4:1998

Edition 1.0 (1998-08-28)

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies

EN-FR
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IEC 61191-6:2010

Edition 1.0 (2010-01-14)

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method

EN-FR
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IEC 61192-1:2003

Edition 1.0 (2003-02-20)

Workmanship requirements for soldered electronic assemblies - Part 1: General

EN-FR
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IEC 61192-2:2003

Edition 1.0 (2003-03-14)

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies

EN-FR
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IEC 61192-3:2002

Edition 1.0 (2002-12-17)

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies

EN-FR
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IEC 61192-4:2002

Edition 1.0 (2002-11-29)

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies

EN-FR
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IEC 61192-5:2007

Edition 1.0 (2007-05-23)

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies

EN-FR, EN
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IEC 61193-1:2001

Edition 1.0 (2001-12-19)

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies

EN-FR
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IEC 61193-2:2007

Edition 1.0 (2007-08-30)

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages

EN
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IEC 61193-3:2013

Edition 1.0 (2013-01-24)

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing

EN-FR
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IEC 61249-2-1:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

EN-FR
Preview
IEC 61249-2-2:2005

Edition 1.0 (2005-01-20)

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad

EN-FR
Preview
IEC 61249-2-4:2001

Edition 1.0 (2001-12-19)

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-5:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-6:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-7:2002

Edition 1.0 (2002-03-05)

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-8:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-9:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-10:2003

Edition 1.0 (2003-02-27)

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-11:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-12:1999

Edition 1.0 (1999-01-29)

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad

EN-FR, EN, ES
Preview
IEC 61249-2-13:1999

Edition 1.0 (1999-02-26)

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad

EN-FR, EN, ES
Preview
IEC 61249-2-18:2002

Edition 1.0 (2002-02-13)

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-19:2001

Edition 1.0 (2001-11-28)

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper clad

EN-FR, ES
Preview
IEC 61249-2-21:2003

Edition 1.0 (2003-11-12)

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR, ES
Preview
IEC 61249-2-22:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-23:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad

EN-FR
Preview
IEC 61249-2-26:2005

Edition 1.0 (2005-01-11)

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-27:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-30:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-31:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-32:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-33:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-34:2009

Edition 1.0 (2009-02-11)

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad

EN-FR
Preview
IEC 61249-2-35:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-36:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-37:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-38:2008

Edition 1.0 (2008-11-27)

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-39:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-40:2012

Edition 1.0 (2012-11-29)

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-41:2010

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC 61249-2-42:2010

Edition 1.0 (2010-04-21)

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly

EN-FR
Preview
IEC PAS 61249-3-1:2007

Edition 1.0 (2007-05-30)

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)

EN
Preview
IEC 61249-3-3:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film

EN-FR, EN, ES
Preview
IEC 61249-3-4:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film

EN-FR, EN, ES
Preview
IEC 61249-3-5:1999

Edition 1.0 (1999-02-10)

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films

EN-FR, EN, ES
Preview
IEC 61249-4-1:2008

Edition 1.0 (2008-01-30)

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability

EN-FR, EN
Preview
IEC 61249-4-2:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability

EN
Preview
IEC 61249-4-5:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability

EN
Preview
IEC 61249-4-11:2005

Edition 1.0 (2005-09-22)

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability

EN-FR
Preview
IEC 61249-4-12:2005

Edition 1.0 (2005-09-05)

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability

EN-FR
Preview
IEC 61249-4-14:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-15:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-16:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-17:2009

Edition 1.0 (2009-05-26)

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR, EN
Preview
IEC 61249-4-18:2013

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR
Preview
IEC 61249-4-19:2013

Edition 1.0 (2013-11-04)

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly

EN-FR
Preview
IEC 61249-5-1:1995

Edition 1.0 (1995-11-28)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)

EN-FR, ES
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IEC 61249-5-4:1996

Edition 1.0 (1996-06-18)

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks

EN-FR, ES
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IEC PAS 61249-6-3:2011

Edition 1.0 (2011-09-23)

Specification for finished fabric woven from "E" glass for printed boards

EN
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IEC 61249-7-1:1995

Edition 1.0 (1995-04-26)

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper

EN-FR, ES
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IEC PAS 61249-8-1:2014

Edition 1.0 (2014-06-10)

Qualification and performance of electrical insulating compound for printed wiring assemblies

EN
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IEC PAS 61249-8-5:2014

Edition 1.0 (2014-06-10)

Qualification and performance specification of permanent solder mask and flexible cover materials

EN
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IEC 61249-8-7:1996

Edition 1.0 (1996-04-26)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks

EN-FR, ES
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IEC 61249-8-8:1997

Edition 1.0 (1997-06-24)

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings

EN-FR, ES
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IEC 61445:2012

Edition 1.0 (2012-06-21)

Digital Test Interchange Format (DTIF)

EN
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IEC 61523-1:2012

Edition 2.0 (2012-06-21)

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems

EN
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IEC 61523-3:2004

Edition 1.0 (2004-09-24)

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process

EN
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IEC 61671:2012

Edition 1.0 (2012-06-21)

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML

EN
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IEC 61690-1:2000

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0. (This publication is available in electronic HTML format only)

EN
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IEC 61690-2:2000

Edition 1.0 (2000-01-31)

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0. (This publication is available in electronic HTML format only)

EN
Preview
IEC 61691-1-1:2011

Edition 2.0 (2011-05-19)

Behavioural languages - Part 1-1: VHDL Language Reference Manual

EN
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IEC 61691-6:2009

Edition 1.0 (2009-12-14)

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions

EN
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IEC 61691-7:2009

Edition 1.0 (2009-12-14)

Behavioural languages - Part 7: SystemC R Language Reference Manual

EN
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IEC 61760-1:2006

Edition 2.0 (2006-04-10)

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)

EN-FR, EN
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IEC 61760-2:2007

Edition 2.0 (2007-04-24)

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide

EN-FR, EN
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IEC 61760-3:2010

Edition 1.0 (2010-03-16)

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering

EN-FR
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IEC TR 61908:2004

Edition 1.0 (2004-11-24)

The technology roadmap for industry data dictionary structure, utilization and implementation

EN
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IEC 61926-1:1999

Edition 1.0 (1999-10-18)

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)

EN
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IEC TR 61926-1-1:1999

Edition 1.0 (1999-10-20)

Design automation - Part 1-1: Harmonization of ATLAS test languages

EN
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IEC 62014-1:2001

Edition 1.0 (2001-05-18)

Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)

EN
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IEC TR 62014-3:2002

Edition 1.0 (2002-12-04)

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation

EN
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IEC 62090:2002

Edition 1.0 (2002-11-22)

Product package labels for electronic components using bar code and two-dimensional symbologies

EN-FR
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IEC 62137:2004

Edition 1.0 (2004-07-06)

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

EN-FR, EN
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IEC 62137:2004/COR1:2005

Edition 1.0 (2005-01-27)

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN

EN
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IEC 62137-1-1:2007

Edition 1.0 (2007-07-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test

EN-FR, EN
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IEC 62137-1-2:2007

Edition 1.0 (2007-07-25)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test

EN-FR, EN
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IEC 62137-1-3:2008

Edition 1.0 (2008-11-27)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test

EN-FR
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IEC 62137-1-4:2009

Edition 1.0 (2009-01-26)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test

EN-FR
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IEC 62137-1-5:2009

Edition 1.0 (2009-02-11)

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test

EN-FR
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IEC 62137-3:2011

Edition 1.0 (2011-11-08)

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints

EN-FR
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IEC 62243:2012

Edition 2.0 (2012-06-21)

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)

EN
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IEC 62326-1:2002

Edition 2.0 (2002-03-05)

Printed boards - Part 1: Generic specification

EN-FR, ES
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IEC 62326-4:1996

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification

EN-FR, ES
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IEC 62326-4-1:1996

Edition 1.0 (1996-12-19)

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification - Performance levels A, B and C

EN-FR, ES
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IEC PAS 62326-7-1:2007

Edition 1.0 (2007-04-26)

Performance guide for single- and double-sided flexible printed wiring boards

EN
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IEC PAS 62326-14:2010

Edition 1.0 (2010-09-29)

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide

EN
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IEC PAS 62326-20:2011

Edition 1.0 (2011-01-26)

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs

EN
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IEC 62421:2007

Edition 1.0 (2007-08-24)

Electronics assembly technology - Electronic modules

EN-FR, EN
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IEC 62525:2007

Edition 1.0 (2007-11-07)

Standard Test Interface Language (STIL) for Digital Test Vector Data

EN
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IEC 62526:2007

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments

EN
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IEC 62527:2007

Edition 1.0 (2007-11-07)

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification

EN
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IEC 62528:2007

Edition 1.0 (2007-11-07)

Standard Testability Method for Embedded Core-based Integrated Circuits

EN
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IEC 62529:2012

Edition 2.0 (2012-06-21)

Standard for Signal and Test Definition

EN
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IEC 62530:2011

Edition 2.0 (2011-05-19)

SystemVerilog - Unified Hardware Design, Specification, and Verification Language

EN
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IEC 62531:2012

Edition 2.0 (2012-06-21)

Property Specification Language (PSL)

EN
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IEC PAS 62588:2008

Edition 1.0 (2008-09-08)

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes

EN
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IEC 62739-1:2013

Edition 1.0 (2013-06-18)

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing

EN-FR
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IEC TR 62856:2013

Edition 1.0 (2013-08-07)

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)

EN-FR
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IEC TR 62866:2014

Edition 1.0 (2014-05-07)

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing

EN-FR