International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47F

Micro-electromechanical systems

 
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SC 47F Project files (41)

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PNW 47F-38 ED1

(Future IEC 62047-15): Semiconductor devices -Micro-electromechanical devices - Part 15: Test method for bond strength in PDMS/Glass chip

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EN U 47F/38/NP PDF file 505 kB
PNW 47F-39 ED1

(Future IEC 62047-16): Semiconductor devices -Micro-electromechanical devices - Part 16: Test method forresidual stress measurement

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EN U 47F/39/NP PDF file 413 kB
PNW 47F-139 ED1

Semiconductor devices - Micro-electromechanical devices - Part 23: General rules for the assessment of micro-geometrical parameters

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EN U 47F/139/NP PDF file 257 kB
PNW 47F-140 ED1

Semiconductor devices - Micro-electromechanical devices - Part 24: Silicon-based MEMS fabrication technology - Basic regulation for layout design

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EN U 47F/140/NP PDF file 325 kB
PNW 47F-255 ED1

Future IEC 62047-32: Semiconductor devices - Micro-electromechanical devices - Part 32: Test method for the nonliear vibration of the MEMS resonators

PRVN
  • PRVN
  • Preparation of RVN
EN U 47F/255/NP PDF file 589 kB
PNW 47F-256 ED1

Future IEC 62047-33: Semiconductor devices - Micro-electromechanical devices - Part 33: MEMS piezoresistive pressure-sensitive device

PRVN
  • PRVN
  • Preparation of RVN
EN U 47F/256/NP PDF file 541 kB
PNW 47F-257 ED1

Future IEC 62047-34: Semiconductor devices - Micro-electromechanical devices - Part 34: Test methods for wafer level MEMS piezoresistive pressure-sensitive device

PRVN
  • PRVN
  • Preparation of RVN
EN U 47F/257/NP PDF file 453 kB
PNW 47f-4 ED1

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials (Future IEC 62047-10)

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  • Deleted items
EN U 47F/4/NP PDF file 195 kB
PNW 47f-5 ED1

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for linear thermal expansion coefficients of MEMS materials (Future IEC 62047-11)

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  • Deleted items
EN U 47F/5/NP PDF file 927 kB
IEC 62047-1:2016 ED2

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-01 Y Webstore
IEC 62047-1:2005 ED1

Semiconductor devices - Micro-electromechanical devices - Part 1: Terms and definitions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2005-11 Y 47/1821/FDIS PDF file 388 kB
PDF file 420 kB
IEC 62047-2:2006 ED1

Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-10 Y Webstore
IEC 62047-4:2008 ED1

Semiconductor devices - Micro-electromechanical devices - Part 4: Generic specification for MEMS

PPUB
  • PPUB
  • Publication issued
EN-FR 2008-09 Y Webstore
IEC 62047-5:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-08 Y Webstore
IEC 62047-5:2011/COR1:2012 ED1

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 5: RF MEMS switches

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 62047-6:2009 ED1

Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-04 Y Webstore
IEC 62047-7:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 7: MEMS BAW filter and duplexer for radio frequency control and selection

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-06 Y Webstore
IEC 62047-8:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-03 Y Webstore
IEC 62047-9:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-07 Y Webstore
IEC 62047-9:2011/COR1:2012 ED1

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 9: Wafer to wafer bonding strength measurement for MEMS

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 62047-10:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-08 Y Webstore
IEC 62047-10:2011/COR1:2012 ED1

Corrigendum 1 - Semiconductor devices - Micro-electromechanical devices - Part 10: Micro-pillar compression test for MEMS materials

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 62047-11:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-07 Y Webstore
IEC 62047-12:2011 ED1

Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-09 Y Webstore
IEC 62047-13:2012 ED1

Semiconductor devices - Micro-electromechanical devices - Part 13: Bend - and shear - type test methods of measuring adhesive strength for MEMS structures

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-03 Y Webstore
IEC 62047-14:2012 ED1

Semiconductor devices - Micro-electromechanical devices - Part 14: Forming limit measuring method of metallic film materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-03 Y Webstore
IEC 62047-15:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 15: Test method of bonding strength between PDMS and glass

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 Y Webstore
IEC 62047-16:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 16: Test methods for determining residual stresses of MEMS films - Wafer curvature and cantilever beam deflection methods

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 Y Webstore
IEC 62047-17:2015 ED1

Semiconductor devices - Micro-electromechanical devices - Part 17: Bulge test method for measuring mechanical properties of thin films

PPUB
  • PPUB
  • Publication issued
EN-FR 2015-03 Y Webstore
IEC 62047-18:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-07 Y Webstore
IEC 62047-19:2013 ED1

Semiconductor devices - Micro-electromechanical devices - Part 19: Electronic compasses

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-07 Y Webstore
IEC 62047-20:2014 ED1

Semiconductor devices - Micro-electromechanical devices - Part 20: Gyroscopes

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-07 Y Webstore
IEC 62047-21:2014 ED1

Semiconductor devices - Micro-electromechanical devices - Part 21: Test method for Poisson's ratio of thin film MEMS materials

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-06 Y Webstore
IEC 62047-22:2014 ED1

Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates

PPUB
  • PPUB
  • Publication issued
EN-FR 2014-06 Y Webstore
IEC 62047-25:2016 ED1

Semiconductor devices - Micro-electromechanical devices - Part 25: Silicon based MEMS fabrication technology - Measurement method of pull-press and shearing strength of micro bonding area

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-09 Y Webstore
IEC 62047-26:2016 ED1

Semiconductor devices - Micro-electromechanical devices - Part 26: Description and measurement methods for micro trench and needle structures

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-01 Y Webstore
IEC 62047-27 ED1

Semiconductor devices - Micro-electromechanical devices - Part 27: Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

DECPUB
  • DECPUB
  • Publication at Editing Check
EN 2017-03 Y 47F/230A/CDV PDF file 562 kB
PDF file 615 kB
IEC 62047-28 ED1

Semiconductor devices - Micro-electromechanical devices - Part 28: Performance testing method of vibration-driven MEMS electret energy harvesting devices

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN 2017-02 Y 47F/266/FDIS PDF file 736 kB
IEC 62047-29 ED1

Semiconductor devices - Micro-electromechanical devices - Part 29: Electromechanical relaxation test method for freestanding conductive thin-films under room temperature

CCDV
  • CCDV
  • Draft circulated as CDV
EN 2017-12 N 47F/263/CDV
PDF file 1289 kB
IEC 62047-30 ED1

Semiconductor devices - Micro-electromechanical devices - Part 30: Measurement methods of electro-mechanical conversion characteristics of MEMS piezoelectric thin film

CCDV
  • CCDV
  • Draft circulated as CDV
EN 2017-11 N 47F/254/CDV
PDF file 495 kB
IEC 62047-31 ED1

Semiconductor devices - Micro-electromechanical devices - Part 31: Four-point bending test method for interfacial adhesion energy of layered MEMS materials

ACD
  • ACD
  • Approved for CD
EN 2019-12 U 47F/246/NP PDF file 527 kB