International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47D

Semiconductor devices packaging

 
export to xls file

SC 47D Project files (200)

Project

Reference

Current

Stage

Language

Frcst

Date

CLC

Document

Reference

Downloads
PNW 191-6/AMD1/FRAG1 ED1

Supplement to IEC 191-6 - Recommended values for dual-in-line packages of Form E

DEL
  • DEL
  • Deleted items
EN-FR U
PNW 191-6/AMD1/FRAG2 ED1

Supplement to IEC 191-6 - Recommended values for QFPs of form E

DEL
  • DEL
  • Deleted items
EN-FR U
PNW 47D-213 ED1

The individual standard for 48 pins plastic fine pitch ball grid array (P-FBGA), 0,75 & 0,65 mm terminal pitch (Intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/213/NP
PNW 47D-252 ED1

BGA (Ball Grid Array) package measuring method

DEL
  • DEL
  • Deleted items
EN U 47D/252/NP PDF file 787 kB
PNW 47D-503 ED1

Proposed new package outline, 3/4-land SMD

DEL
  • DEL
  • Deleted items
EN U 47D/503/NP PDF file 101 kB
PNW 47D-539 ED1

Proposed new package outline, DDRII SDRAM Family, 1,00 mm contact pitch

DEL
  • DEL
  • Deleted items
EN U 47D/539/NP PDF file 350 kB
PNW 47D-540 ED1

Proposed new package outline, Plastic, small outline family, 1,27 mm pitch, 7,5 mm body width and 14, 16, 18, 20, 24 and 28 lead counts

DEL
  • DEL
  • Deleted items
EN U 47D/540/NP PDF file 204 kB
PNW 47D-542 ED1

Proposed new package outline, Plastic small outline family, 1,27 mm pitch, 3,9 mm body width, 8, 14 and 16 leads

DEL
  • DEL
  • Deleted items
EN U 47D/542/NP PDF file 201 kB
PNW 47D-543 ED1

Proposed new package outline, Plastic small outline family, 25 mil pitch, 150 mil body width, 14, 16, 18, 20, 24 and 28 leads

DEL
  • DEL
  • Deleted items
EN U 47D/543/NP PDF file 257 kB
PNW 47D-652 ED1

Design guide for semiconductor packages - Ball Grid Array Package (BGA)

DEL
  • DEL
  • Deleted items
EN U 47D/652/NP PDF file 698 kB
PNW 47D-674 ED1

Proposed new package outline - 13 Pin reduced size MultiMediaCard (MMC) outline MMCmobile 18 x 24 x 1,4 mm

DEL
  • DEL
  • Deleted items
EN U 47D/674/NP PDF file 230 kB
PNW 47D-675 ED1

Proposed new package outline - 10 pin micro size Multimedia Card (MMC) outline MMCmicro 14 x 12 x 1,1 mm (Intended to become IEC 60191-2/F66, if approved)

DEL
  • DEL
  • Deleted items
EN U 47D/675/NP PDF file 180 kB
PNW 47D-676 ED1

Proposed new package outline - 13 Pin full size Multimedia Card (MMC) Outline MMCplus 32 x 24 x 1,4 mm (Intended to become IEC 60191-2/F67, if approved)

DEL
  • DEL
  • Deleted items
EN U 47D/676/NP PDF file 220 kB
PNW 47D-860 ED1

Standardization of semiconductor mechanical test methodology - Package warpage test sample preparation method by using BGA solder ball removal tool

DEL
  • DEL
  • Deleted items
EN U 47D/860/NP PDF file 812 kB
PNW 47D-866 ED1

Future IEC 60191-7 Ed.1: Package thermal characteristics guideline in semiconductor products

DEL
  • DEL
  • Deleted items
EN U 47D/866/NP PDF file 1617 kB
PNW 47D-869A ED1

Future IEC 60191-X Ed.1: Requirement to semiconductor devices packaging materials from the environment point of view: Low Halogen Molding Compound

DEL
  • DEL
  • Deleted items
EN U 47D/869A/NP PDF file 252 kB
IEC 60191-1 ED3

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

CDM
  • CDM
  • CD to be discussed at meeting
EN 2018-02 Y 47D/842/CD PDF file 2079 kB
IEC 60191-1:2007 ED2

Mechanical standardization of semiconductor devices - Part 1: General rules for the preparation of outline drawings of discrete devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-01 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-03 U
IEC 60191-1:1966 ED1

Mechanical standardization of semiconductor devices. Part 1: Preparation of drawings of semiconductor devices

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2 ED2

Restructuring of package outlines presently contained in IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/125/NP
IEC 60191-2/FRAG2 ED2

Tape ball grid array package, 0,6 mm ball diameter family (intended for inclusion into IEC 60191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/314A/CD PDF file 1352 kB
IEC 60191-2/FRAG3 ED2

48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0.75 and 0.65 mm pitch , face down (intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/210/NP
IEC 60191-2/FRAG4 ED2

32 and 48 pins P-FBGA (Plastic Fine pitch Ball Grid Array), 0,8 mm pitch (Intended for inclusion into IEC 191-2)

DEL
  • DEL
  • Deleted items
EN N 47D/211/NP
IEC 60191-2:1966 ED1

Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2:1966/FRAG1 ED1

Power semiconductor outline Form B, Types A and B, for inclusion into IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/56/NP
IEC 60191-2:1966/FRAG2 ED1

Inclusion of an additional drawing of integrated circuit in the family drawing A50 of IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR U
IEC 60191-2:1966/FRAG3 ED1

General rules for HSOP (Heat sink small outline package) - Supplement to IEC 191-2

DEL
  • DEL
  • Deleted items
EN U
IEC 60191-2:1966/FRAG4 ED1

Tape ball grid array (TBGA) family (Intended for inclusion into 60191-2)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/269/FDIS PDF file 259 kB
IEC 60191-2:1966/FRAG5 ED1

Drawing family of rectangular plastic leaded chip carrier (PLCCs) packages - Introduction of the outline family 124E in IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR N
IEC 60191-2:1966/FRAG10 ED1

Mechanical standardization power devices. Proposal for tablet case outline drawings for two families to be introduced in IEC 191-2 for future use

DEL
  • DEL
  • Deleted items
EN U 47(SEC.)/1136/CD
IEC 60191-2:1966/FRAG11 ED1

Ceramic quadrature flat packages, square type, for surface mounting - Introduction of the outline families 130E and 131E in IEC 191-2

DEL
  • DEL
  • Deleted items
EN-FR U
IEC 60191-2:1966/FRAG16 ED1

Recommended values for QFP, 0.30, 0.40, 0.50, 0.65, 0.80 and 1.00 mm lead spacing, for inclusion into IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D(SEC.)/29/CD
IEC 60191-2:1966/FRAG17 ED1

Inclusion of a heat sink small outline (HSOP) family, similar to SOP family 075E contained in IEC 191-2

DEL
  • DEL
  • Deleted items
EN U 47D/112/CD
IEC 60191-2:1966/FRAG24 ED1

Plastic small outline family, J-Lead (P-SOJ), 10,16 mm body family (to be published as outline 141E-d)

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/283/FDIS
IEC 60191-2:1966/FRAG25 ED1

Plastic thin small outline package P-TSOP II, 7,62 mm body family

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/284/FDIS
IEC 60191-2:1966/FRAG26 ED1

P-TSOP II, 10,16 mm body family (if approved, to be included in outline 139 E)

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/285/FDIS
IEC 60191-2:1966/FRAG28 ED1

HSOP reverse bend, heatslug up

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/286/FDIS
IEC 60191-2:1966/FRAG29 ED1

Plastic thin small outline package J-Lead (P-TSOJ), 7,62 mm body family - (Supplement to IEC 191-2)

DEL
  • DEL
  • Deleted items
EN U 47D/87/NP
IEC 60191-2:1966/FRAG31 ED1

Proposal for a tape ball grid array, 0.75 mm ball diameter family (intended for inclusion into IEC 60191-2) as outline 146E

MERGED
  • MERGED
  • Fragment merged
EN U 47D/256/CDV
IEC 60191-2:1966/FRAG33 ED1

Ceramic thin LGA, 1,0 mm pitch outline family

MERGED
  • MERGED
  • Fragment merged
EN U 47D/399/FDIS PDF file 87 kB
IEC 60191-2:1966/FRAG35 ED1

4-leaded SMD (Body size DxE:2.00x1.25 mm) (for inclusion into IEC 191-2)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/156/NP
IEC 60191-2:1966/FRAG36 ED1

Surface Vertical Packages (SVP) - Outline family 155E

MERGED
  • MERGED
  • Fragment merged
EN U 47D/420/FDIS PDF file 111 kB
IEC 60191-2:1966/FRAG37 ED1

P-VSON (Plastic very small outline - Non-leaded packages) (will be published as Outline 164E-a)

MERGED
  • MERGED
  • Fragment merged
EN Y 47D/448/FDIS PDF file 188 kB
IEC 60191-2:1966/FRAG39 ED1

Proposal for 0,8 mm pitch P-FBGA (plastic fine pitch ball grid array)

DEL
  • DEL
  • Deleted items
EN U 47D/214/NP
IEC 60191-2:1966/FRAG42 ED1

Proposal for a supplement of the rectangular type of QFN outline drawings to the outline family of 119E

MERGED
  • MERGED
  • Fragment merged
EN N 47D/436/FDIS PDF file 101 kB
IEC 60191-2:1966/FRAG43 ED1

Ceramic thin LGA, 0,8 mm pitch outline family

MERGED
  • MERGED
  • Fragment merged
EN U 47D/400/FDIS PDF file 88 kB
IEC 60191-2:1966/FRAG44 ED1

New package outline - Thin fine pitch ball grid array family (rectangular/square)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/317/NP PDF file 321 kB
IEC 60191-2:1966/FRAG46 ED1

Small Outline J-Lead Package (SOJ), 0.80 mm Pitch (Outline 163E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/481/FDIS PDF file 104 kB
IEC 60191-2:1966/FRAG47 ED1

Proposal for 3-Leaded SMD (Body Size D x E : 2.9 x 1.5 mm) Outline Family 162E

MERGED
  • MERGED
  • Fragment merged
EN N 47D/440/FDIS PDF file 64 kB
IEC 60191-2:1966/FRAG50 ED1

Plastic enhanced, low profile quad flat pack (HLQFP) outline family, heat slug down, L-PQFP-G (Outline 151E-a)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/486/FDIS PDF file 513 kB
IEC 60191-2:1966/FRAG51 ED1

Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug up, T-PQFP-G (Outline 152E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/487/FDIS PDF file 455 kB
IEC 60191-2:1966/FRAG52 ED1

Plastic enhanced, thin profile quad flat pack (HTQFP) outline family, heat slug down, T-PQFP-G (Outline 153E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/488/FDIS PDF file 462 kB
IEC 60191-2:1966/FRAG55 ED1

Small Power Package with 17 Pins (published as Outline 168E)

MERGED
  • MERGED
  • Fragment merged
EN N 47D/588/FDIS PDF file 107 kB
IEC 60191-2:1966/FRAG58 ED1

Proposed new package outline for P-DHVQFN family. (Plastic Dual in-line compatible Heatsink Very thin Quad Flat Pack No Leads)

DEL
  • DEL
  • Deleted items
EN U 47D/523/NP PDF file 1260 kB
IEC 60191-2:1966/FRAG62 ED1

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

MERGED
  • MERGED
  • Fragment merged
EN 2008-05 N 47D/712/FDIS PDF file 179 kB
IEC 60191-2:1966/FRAG64 ED1

Proposed new package outline - Small outline package (SOT) 3-, 5- and 6-Lead SMD (to be published as 182E outline)

CAN
  • CAN
  • Draft Cancelled
EN 2008-08 N 47D/647/CD PDF file 880 kB
IEC 60191-2:1966/FRAG67 ED1

Proposed new package outline - large power package with 6 load terminals, P-UMP-A6. To be published as outline 185B, if approved.

MERGED
  • MERGED
  • Fragment merged
EN-FR 2013-04 N 47D/817A/CDV PDF file 203 kB
PDF file 660 kB
IEC 60191-2:1966/FRAG68 ED1

Proposed new package outline - flange mounted package with through hole leads, P-SFM-T3 - To be published as outline 186F. if approved.

MERGED
  • MERGED
  • Fragment merged
EN-FR 2013-04 N 47D/818/CDV PDF file 377 kB
PDF file 532 kB
IEC 60191-2:1966/FRAG69 ED1

Proposed new package outline - flange mount package with flat leads, P-SFM-F8 - To be published as outline 187E, if approved.

MERGED
  • MERGED
  • Fragment merged
EN 2013-04 N 47D/819/CDV PDF file 330 kB
PDF file 556 kB
IEC 60191-2:1966/FRAG70 ED1

Proposed new package outline - P-ZMP-P165

AFDIS
  • AFDIS
  • Approved for FDIS
EN 2017-05 N 47D/863/CDV
PDF file 604 kB
IEC 60191-2:1966/FRAG71 ED1

Proposed new package outline - P-ZMP-P89

AFDIS
  • AFDIS
  • Approved for FDIS
EN 2017-05 N 47D/864/CDV
PDF file 595 kB
IEC 60191-2:1966/FRAG72 ED1

Proposed new package outline - P-UMP-Ax

ACDV
  • ACDV
  • Approved for CDV
EN 2018-04 N 47D/870/CD PDF file 625 kB
IEC 60191-2:1966/AMD1:2001 ED1

Amendment 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2:1966/AMD1:2001/FRAG1 ED1

Inclusion of three drawings for power modules - Supplement to IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D(SEC.)/7/CDV
IEC 60191-2:1966/AMD1:2001/FRAG3 ED1

Additional outline drawing of power semiconductor device, to be included in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG4 ED1

Integrated circuits - Drawing family of leaded packages of Form E (Quad Flat packages), to be included in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG5 ED1

Amendment to Document 47(C.O.)1148: Inclusion of the outline drawings 121E and 122E in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG8 ED1

Surface mounted cylindrical diodes - Introduction of the outline family 100H in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG9 ED1

Surface mounted packages - Introduction of the outline family 129E in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG10 ED1

Dual in line packages for 0.07 inches pitch (1.778 mm) - Introduction of the outline family 101G in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD1:2001/FRAG12 ED1

Amendment to IEC 191-2 - Single-ended package outline of Form A

MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD2:2001 ED1

Amendment 2 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2:1966/AMD2:2001/FRAG14 ED1

Standard outlines for non-cylindrical surface-mount semiconductors, to be added to IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47(SEC.)/1237/CDV
IEC 60191-2:1966/AMD2:2001/FRAG15 ED1

Inclusion in IEC 191-2 of a wire-ended diode package (small signal diode)

MERGED
  • MERGED
  • Fragment merged
EN U 47D(SEC.)/30/CD
IEC 60191-2:1966/AMD2:2001/FRAG18 ED1

Flange-mounted header family (peripheral terminals) - 0.100 spacing for inclusion in IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN U 47D(U.K.)/1/NP
IEC 60191-2:1966/AMD3:2001 ED1

Amendment 3 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD4:2001 ED1

Amendment 4 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD5:2002 ED1

Amendment 5 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD6:2002 ED1

Amendment 6 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD7:2002 ED1

Amendment 7 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD8:2003 ED1

Amendment 8 - Mechanical standardization of semiconductor devices. Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD9:2003 ED1

Amendment 9 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
MERGED
  • MERGED
  • Fragment merged
EN-FR U
IEC 60191-2:1966/AMD10:2004 ED1

Amendment 10 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN N Webstore
IEC 60191-2:1966/AMD11:2004 ED1

Amendment 11 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR N Webstore
IEC 60191-2:1966/AMD12:2006 ED1

Amendment 12 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-03 N Webstore
IEC 60191-2:1966/AMD13:2006 ED1

Amendment 13 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-09 N Webstore
IEC 60191-2:1966/AMD14:2006 ED1

Amendment 14 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-09 N Webstore
IEC 60191-2:1966/AMD15:2006 ED1

Amendment 15 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-09 N Webstore
IEC 60191-2:1966/AMD16:2007 ED1

Amendment 16 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-09 N Webstore
IEC 60191-2:1966/AMD17:2008 ED1

Amendment 17 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2008-05 N Webstore
IEC 60191-2:1966/AMD18:2011 ED1

Amendment 18 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-10 N Webstore
IEC 60191-2:1966/AMD19:2012 ED1

Amendment 19 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-09 N Webstore
IEC 60191-3:1999 ED2

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
IEC 60191-3:1999/FRAG1 ED2

Mold flash, interlead flash, gate burrs, and protrusion for plastic packages

MERGED
  • MERGED
  • Fragment merged
EN-FR Y 47D/165/CDV
IEC 60191-3:1999/FRAG2 ED2

Definition of mold flash, interlead flash, gate burrs and protrusions for plastic packages, to be introduced into IEC 191-2

MERGED
  • MERGED
  • Fragment merged
EN Y 47D(SEC.)/40/NP
IEC 60191-3:1999/FRAG3 ED2

Standardization of Pin #1 mark for identification in automatic handling systems

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D/120/CDV
IEC 60191-3:1999/FRAG4 ED2

Definition of pin No. 1 orientation for TAB packages (intended for inclusion into IEC 191-3)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/73/CD
IEC 60191-3:1974 ED1

Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3:1974/AMD1:1983 ED1

Amendment 1 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3:1974/AMD2:1995 ED1

Amendment 2 - Mechanical standardization of semiconductor devices. Part 3: General rules for the preparation of outline drawings of integrated circuits

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U 47D(SEC.)/14/CDV
IEC 60191-3:1974/AMD2:1995/FRAG1 ED1

Amendment to Sub-clause 4.5 of IEC 191-3 - Devices with terminals disposed in three or more rows in each orthogonal direction

MERGED
  • MERGED
  • Fragment merged
EN-FR U 47D(SEC.)/31/CDV
IEC 60191-4:2013 ED3

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-10 Y Webstore
IEC 60191-4/AMD1 ED3

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

ACDV
  • ACDV
  • Approved for CDV
EN 2018-12 Y 47D/882/CD PDF file 277 kB
IEC 60191-4:2002+AMD1:2001+AMD2:2002 CSV ED2.2

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-4:1999 ED2

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 1999-10 Y 47D/298/FDIS PDF file 922 kB
IEC 60191-4:1999/FRAG1 ED2

Proposed replacement of IEC 191-4: Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor devices

MERGED
  • MERGED
  • Fragment merged
EN U 47D/98/NP
IEC 60191-4:1999/FRAG2 ED2

Amendment to IEC 191-4 to add a package style and a descriptive designator for high power semiconductor packages (100 ... 1700 V/10 ... 1000 A)

MERGED
  • MERGED
  • Fragment merged
EN U 47D/124/NP
IEC 60191-4:1999/FRAG3 ED2

Definition and value of L, T

MERGED
  • MERGED
  • Fragment merged
EN U 47D/132/NP
IEC 60191-4:1999/AMD1:2001 ED2

Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2001-12 Y 47D/461/FDIS PDF file 85 kB
PDF file 86 kB
IEC 60191-4:1999/AMD2:2002 ED2

Amendment 2 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2002-08 Y 47D/505/FDIS PDF file 181 kB
PDF file 183 kB
IEC 60191-4:1987 ED1

Mechanical standardization of semiconductor devices. Part 4: Coding systems and classification into forms of package outlines for semiconductor devices

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-5:1997 ED2

Mechanical standardization of semiconductor devices - Part 5: Recommendations applying to integrated circuit packages using tape automated bonding (TAB)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-5:1987 ED1

Mechanical standardization of semiconductor devices. Part 5: Recommendations applying to tape automated bonding (TAB) of integrated circuits.

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-6:2009 ED3

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

PPUB
  • PPUB
  • Publication issued
EN-FR 2009-11 Y Webstore
IEC 60191-6:2004 ED2

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN 2004-09 Y 47D/584/FDIS PDF file 424 kB
IEC 60191-6:1990 ED1

Mechanical standardization of semiconductor devices. Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-6:1990/AMD1:1999 ED1

Amendment 1 - Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages

DELPUB
  • DELPUB
  • Publication Deleted
EN U 47D/320/FDIS PDF file 207 kB
IEC 60191-6:1990/AMD1:1999/FRAG1 ED1

Inclusion of an SVP outline family into IEC 191-6

DEL
  • DEL
  • Deleted items
EN U 47D/47/CD
IEC 60191-6:1990/AMD1:1999/FRAG3 ED1

O value of leaded packages with two parallel rows of terminals in IEC 191-6, Appendix B1

DEL
  • DEL
  • Deleted items
EN U 47D/133/NP
IEC 60191-6:1990/AMD1:1999/FRAG5 ED1

IEC 191-6 - General rules for TSOP (Thin small outline package) Type II

MERGED
  • MERGED
  • Fragment merged
EN U 47D/170/CDV
IEC 60191-6:1990/AMD2/FRAG8 ED1

Amendment to IEC 60191-6 - Renaming 'terminal land area' to 'terminal position area'

DELPUB
  • DELPUB
  • Publication Deleted
EN U 47D/189/NP
IEC 60191-6-1 ED2

IEC 60191-6-1 Ed.2: Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

DEL
  • DEL
  • Deleted items
EN-FR 2012-07 Y 47D/804/CDV PDF file 371 kB
PDF file 377 kB
IEC 60191-6-1:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-1: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for gull-wing lead terminals

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 60191-6-2:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor devices packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-2:2001/COR1:2002 ED1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-6-3:2000 ED1

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of quad flat packs (QFP)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-4:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-5 ED2

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

DEL
  • DEL
  • Deleted items
EN-FR 2013-12 Y 47D/829/FDIS PDF file 349 kB
PDF file 400 kB
IEC 60191-6-5:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)

PPUB
  • PPUB
  • Publication issued
EN Y Webstore
IEC 60191-6-6:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-7 ED1

Mechanical standardization of semiconductor devices - part 6-7: General rules for the dimensions of P-VQFN

CAN
  • CAN
  • Draft Cancelled
EN Y 47D/534/CDV PDF file 219 kB
IEC 60191-6-8:2001 ED1

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-9 ED1

Mechanical standardization of semiconductor devices - Part 6-9: General rules for the preparation of outline drawing of surface mounted semiconductor device packages - Design guideline of integrated circuits for Plastic Quad Flat Package (P-QFP)

CAN
  • CAN
  • Draft Cancelled
EN U 47D/533/CD PDF file 189 kB
IEC 60191-6-10:2003 ED1

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON

PPUB
  • PPUB
  • Publication issued
EN-FR Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-09 U
IEC 60191-6-11 ED1

Mechanical standardization of semiconductor devices - Part 6-11: General design guidelines for rectangular Fine Pitch Ball Grid Array Packages (FBGA)

DEL
  • DEL
  • Deleted items
EN Y 47D/482/CDV PDF file 151 kB
IEC 60191-6-12:2011 ED2

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-06 Y Webstore
IEC 60191-6-12:2002 ED1

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA) - Rectangular type

DELPUB
  • DELPUB
  • Publication Deleted
EN 2002-07 Y 47D/493/FDIS PDF file 406 kB
IEC 60191-6-13:2016 ED2

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-10 Y Webstore
IEC 60191-6-13:2007 ED1

Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (FBGA/FLGA)

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR 2007-06 Y 47D/681/FDIS PDF file 268 kB
MERGED
  • MERGED
  • Publication merged with EN version
FR 2008-09 U
IEC 60191-6-14 ED1

Mechanical standardization of semiconductor devices - Part 6-14: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

DEL
  • DEL
  • Deleted items
EN 2007-12 U 47D/670/NP PDF file 383 kB
IEC 60191-6-15 ED1

Mechanical standardization of semiconductor devices - Part 6-15: General rules for the preparation of outline drawings of surface mounted semiconductor device packages- Measuring methods for package dimensions of small outline packages (SOP)

DEL
  • DEL
  • Deleted items
EN 2007-12 U 47D/672/NP PDF file 283 kB
IEC 60191-6-16 ED2

Semiconductor Packaging - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

DEL
  • DEL
  • Deleted items
EN 2014-12 Y 47D/835/CD PDF file 138 kB
IEC 60191-6-16:2007 ED1

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-06 Y Webstore
MERGED
  • MERGED
  • Publication merged with EN version
FR 2012-04 U
IEC 60191-6-17:2011 ED1

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2011-02 Y Webstore
IEC 60191-6-18:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-01 Y Webstore
IEC PAS 60191-6-18:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

DELPUB
  • DELPUB
  • Publication Deleted
EN 2007-11 U 47D/677/NP PDF file 1086 kB
IEC 60191-6-18:2010/COR1:2010 ED1

Corrigendum 1 - Mechanical stardardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-6-18:2010/COR2:2010 ED1

Corrigendum 2 - Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC PAS 60191-6-19:2008 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of package warpage at elevated temperature and the maximum permissible warpage

DELPUB
  • DELPUB
  • Publication Deleted
EN 2007-12 U 47D/691/NP PDF file 386 kB
IEC 60191-6-19:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-02 Y Webstore
IEC 60191-6-20:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-09 Y Webstore
IEC 60191-6-21:2010 ED1

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-09 Y Webstore
IEC 60191-6-22:2012 ED1

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)

PPUB
  • PPUB
  • Publication issued
EN-FR 2012-12 Y Webstore
IEC 60191-1A:1969 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - First supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-1B:1970 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Second supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-1C:1974 ED1

Mechanical standardization of semiconductor devices - Part 1: Preparation of drawings of semiconductor devices - Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2A:1967 ED1

First supplement to Publication 191-2 (1966) Mechanical standardization of semiconductor devices - Part 2: Dimensions Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2B:1969 ED1

Second supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2C:1970 ED1

Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2D:1971 ED1

Fourth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2E:1974 ED1

Fifth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2F:1976 ED1

Sixth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2G:1978 ED1

Seventh supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2H:1978 ED1

Eigth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2J:1980 ED1

Ninth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2K:1981 ED1

Tenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2L:1982 ED1

Eleventh supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2M:1983 ED1

Twelfth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2N:1987 ED1

Thirteenth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2P:1988 ED1

Fourteenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2Q:1990 ED1

fifteenth complement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2R:1995 ED1

Sixteenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-2S:1995 ED1

Seventeenth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U 47(SEC.)/1242/NP
IEC 60191-2T:1996 ED1

Eighteenth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2U:1997 ED1

Nineteenth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2V:1998 ED1

Twentieth supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2W:1999 ED1

Twenty-first supplement

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2W:1999/FRAG1 ED1

Proposal for a plastic thin shrink small outline package (TSSOP/HTSSOP), 1,00 mm lead length outline family, R-PDSO-G

MERGED
  • MERGED
  • Fragment merged
EN U 47D/233/FDIS
IEC 60191-2X:1999 ED1

Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2X:1999/COR1:2000 ED1

Corrigendum 1 - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN-FR U Webstore
IEC 60191-2Y:2000 ED1

Twenty-third supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-2Y:2000/FRAG30 ED1

Addition to the metric plastic quad flatpack family; 1.0 mm, 0,80 mm and 0,65 mm

MERGED
  • MERGED
  • Fragment merged
EN U 47D/342/FDIS PDF file 186 kB
IEC 60191-2Z:2000 ED1

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 60191-3A:1976 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - First supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3B:1978 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Second supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3C:1987 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Third supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3D:1988 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fourth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3E:1990 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Fifth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 60191-3F:1994 ED1

Mechanical standardization of semiconductor devices - Part 3: General rules for the preparation of outline drawings of integrated circuits - Sixth supplement

DELPUB
  • DELPUB
  • Publication Deleted
EN-FR U
IEC 61927 ED1

Dimensional check of surface mounted devices

DEL
  • DEL
  • Deleted items
EN U 47A/406/NP