International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
SC 47A |
Integrated circuits |
SC 47A Project files
 Project Reference |  Current Stage | Language | Frcst Date | CLC | Document Reference | Downloads |
|---|---|---|---|---|---|---|
PNW 47A-474 Ed. 1.0Semiconductor devices - Integrated circuits - Part 1: General
| DEL
| E | 47A/474 | |||
PNW 47A-537 Ed. 1.0Integrated film circuits - Materials - Part 1: Substrates | DEL
| E | 47A/537 | |||
PNW 47A-538 Ed. 1.0Integrated film circuits - Materials - Part 2: Methods for the assessment of conductive pastes | DEL
| E | 47A/538 | |||
PNW 47A-539 Ed. 1.0Integrated film circuits - Materials - Part 3: Methods for the assessment of dielectric pastes | DEL
| E | 47A/539 | |||
PNW 47A-540 Ed. 1.0Integrated film circuits - Materials - Part 4: Methods for judgement of thick film resistor compositions | DEL
| E | 47A/540 | |||
PNW 47A-786 Ed. 1.0Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method | DEL
| E | 47A/786 | |||
PNW 47A-787 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2-xx: Digital integrated circuits - Unified wide power supply voltage range CMOS DC interface standard for non-terminated digital integrated circuits | DEL
| E | 47A/787 | |||
PNW/TS 47A-789 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method | DEL
| E | 47A/789 | |||
PNW 47A-878A Ed. 1.0Future IEC 62433-4: EMC IC modelling Part 4: Models of Integrated Circuits for EMI behavioural simulation, Conducted Immunity modelling (ICIM-CI) | DEL
| E | 47A/878A | |||
IEC 60148 Ed. 2.0Letter symbols for semiconductor devices and integrated
microcircuits. *Note.- This publication has been superseded by
IEC 748-1 (1984)
| WPUB
| B | ||||
IEC 60148 Ed. 3.0Systematic review of IEC 148 (1969) | DEL
| B | ||||
DEL 60748-1 Ed. 2.0Estimation of reliability characteristics for plastic
encapsulated integrated circuits
| DEL
| B | 47A/400 | |||
IEC 60748-1 Ed. 1.0Semiconductor devices. Integrated circuits. Part 1: General
| DELPUB
| B | ||||
IEC 60748-1 Ed. 2.0Semiconductor devices - Integrated circuits - Part 1: General | PPUB
| B | no | Webstore | ||
IEC 60748-1 am1 Ed. 1.0Amendment No. 1 | DELPUB
| B | ||||
IEC 60748-1 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60748-1 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
DEL 60748-1 am4 f7 Ed. 1.0Amendment to the definition of hybrid integrated circuits, in
IEC 748-1
| DEL
| E | ||||
IEC 60748-2 Ed. 1.0Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits | DELPUB
| B | ||||
IEC 60748-2 Ed. 2.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits
| PPUB
| B | Webstore | |||
IEC 60748-2 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60748-2 am4 f6 Ed. 1.0Classification and definition for Programme Logic Devices
(PLDs), to be added to IEC 748-1
| MERGED
| B | ||||
IEC 60748-2-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section One: Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays) | PPUB
| B | Webstore | |||
IEC 60748-2-1 Ed. 2.0Systematic review of IEC 748-2-1 (1991) | DEL
| B | ||||
IEC 60748-2-2 Ed. 1.0Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU | PPUB
| B | Webstore | |||
IEC 60748-2-2 Ed. 2.0Systematic review of IEC 60748-2-2 (1992) | DEL
| B | ||||
IEC 60748-2-2 am1 Ed. 1.0Amendment No. 1 | PPUB
| B | Webstore | |||
IEC 60748-2-3 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU) | PPUB
| B | Webstore | |||
IEC 60748-2-3 Ed. 2.0Systematic review of IEC 60748-2-3 (1992) | DEL
| B | ||||
IEC 60748-2-4 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB | PPUB
| B | Webstore | |||
IEC 60748-2-4 Ed. 2.0Systematic review of IEC 60748-2-4 (1992) | DEL
| B | ||||
IEC 60748-2-5 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB) | PPUB
| B | Webstore | |||
IEC 60748-2-5 Ed. 2.0Systematic review of IEC 60748-2-5 (1992) | DEL
| B | ||||
IEC 60748-2-6 Ed. 1.0Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits | PPUB
| B | Webstore | |||
IEC 60748-2-6 Ed. 2.0Systematic review of IEC 60748-2-6 (1991) | DEL
| B | ||||
IEC 60748-2-7 Ed. 1.0Semiconductor devices. Integrated circuits - Part 2: Digital
integrated circuits - Section seven: Blank detail specification
for integrated circuit fusible-link programmable bipolar
read-only memories
| PPUB
| B | Webstore | |||
IEC 60748-2-7 Ed. 2.0Systematic review of IEC 748-2-7 (1992) | DEL
| B | ||||
IEC 60748-2-8 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories | PPUB
| B | Webstore | |||
IEC 60748-2-9 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories | PPUB
| B | Webstore | |||
IEC 60748-2-10 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories | PPUB
| B | Webstore | |||
IEC 60748-2-11 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory
| PPUB
| B | Webstore | |||
IEC 60748-2-12 Ed. 1.0Semiconductor devices - Integrated circuits - Part 2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs) | PPUB
| B | Webstore | |||
IEC 60748-2-20 Ed. 1.0Semiconductor devices - Integrated circuits
Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits | DELPUB
| B | 2000-10 | |||
IEC 60748-2-20 Ed. 2.0Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits | PPUB
| B | 2008-06 | no | Webstore | |
IEC 60748-3 Ed. 1.0Semiconductor devices. Integrated circuits. Part 3: Analogue
integrated circuits
| PPUB
| B | Webstore | |||
IEC 60748-3 Ed. 2.0Systematic review of IEC 748-3 (1986) | DEL
| B | ||||
IEC 60748-3 am1 Ed. 1.0Amendment No. 1 | PPUB
| B | Webstore | |||
IEC 60748-3 am2 Ed. 1.0Amendment No. 2 | PPUB
| B | Webstore | |||
IEC 60748-3-1 Ed. 1.0Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers | PPUB
| B | Webstore | |||
IEC 60748-3-1 Ed. 2.0Systematic review of IEC 748-3-1 (1991) | DEL
| B | ||||
IEC 60748-4 Ed. 1.0Semiconductor devices. Integrated circuits. Part 4: Interface
integrated circuits
| DELPUB
| B | ||||
IEC 60748-4 Ed. 2.0Semiconductor devices - Integrated circuits - Part 4: Interface
integrated circuits
| PPUB
| B | Webstore | |||
IEC 60748-4 f1 Ed. 2.0Interface integrated circuits - Measuring methods of linear ADC and DAC | MERGED
| B | ||||
IEC 60748-4 f3 Ed. 2.0Interface integrated circuits - Amendments and additions to the IEC 748-4, Chapter II, Clause 2 for Category II | MERGED
| B | ||||
IEC 60748-4 f4 Ed. 2.0Letter symbols for use with ISDN - Oriented modular interface circuits (Revision of IEC 748-4) | MERGED
| E | 47A(U.K.)244 | |||
IEC 60748-4 f5 Ed. 2.0Revision of IEC 748-4 - Interface integrated circuits - Measuring methods of linear ADC and DAC | MERGED
| E | 47A(U.K.)245 | |||
IEC 60748-4 f6 Ed. 2.0Amendment to 47A(Sec.)300 - Measuring methods of maximum operating frequency of ADC | MERGED
| E | 47A(JP)211 | |||
IEC 60748-4 am1 Ed. 1.0Amendment No. 1
| DELPUB
| B | ||||
IEC 60748-4 am2 Ed. 1.0Amendment No. 2
| DELPUB
| B | 47A(C.O.)218 | |||
IEC 60748-4-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC) | PPUB
| B | Webstore | |||
IEC 60748-4-2 Ed. 1.0Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC) | PPUB
| B | Webstore | |||
IEC 60748-4-3 Ed. 1.0Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC) | PPUB
| E | 2006-08 | no | Webstore | |
IEC 60748-5 Ed. 1.0Semiconductor devices - Integrated circuits - Part 5: Semicustom
integrated circuits
| PPUB
| B | yes | Webstore | ||
IEC 60748-5 f1 Ed. 1.0Classification of integrated circuits - New IEC 748-5 | MERGED
| B | ||||
IEC 60748-5 f3 Ed. 1.0Amendment to IEC 748-5 - Chapter V: Acceptance and reliability
| DEL
| B | ||||
IEC 60748-11 Ed. 1.0Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits | PPUB
| B | Webstore | |||
IEC 60748-11 am1 Ed. 1.0Amendment No. 1 | PPUB
| B | Webstore | |||
IEC 60748-11 am2 Ed. 1.0Amendment 2
| PPUB
| B | Webstore | |||
IEC 60748-11-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 11 - Section 1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits | PPUB
| B | Webstore | |||
IEC 60748-11-1 Ed. 2.0Systematic review of IEC 60748-11-1 (1992) | DEL
| B | ||||
IEC 60748-20 Ed. 1.0Semiconductor devices. Integrated circuits. Part 20: Generic
specification for film integrated circuits and hybrid film
integrated circuits
| PPUB
| B | Webstore | |||
IEC 60748-20 Ed. 2.0Systematic review of IEC 748-20 (1988) | DEL
| B | ||||
IEC 60748-20 am1 Ed. 1.0Amendment No. 1 to IEC 748-20 | PPUB
| B | Webstore | |||
IEC 60748-20 am1 f2 Ed. 1.0Amendment to IEC 748-20 | MERGED
| B | ||||
IEC 60748-20-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination | PPUB
| B | Webstore | |||
IEC 60748-21 Ed. 1.0Semiconductor devices. Integrated circuits - Part 21: Sectional
specification for film integrated circuits and hybrid film
integrated circuits on the basis of qualification approval
procedure
| DELPUB
| B | ||||
IEC 60748-21 Ed. 2.0Semiconductor devices - Integrated circuits - Part 21: Sectional
specification for film integrated circuits and hybrid film
integrated circuits on the basis of qualification approval
procedures
| PPUB
| B | Webstore | |||
IEC 60748-21-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 21; Section
One: Blank detail specification for film integrated circuits and
hybrid film integrated circuits on the basis of qualification
approval procedure
| DELPUB
| B | ||||
IEC 60748-21-1 Ed. 2.0Semiconductor devices - Integrated circuits - Part 21-1: Blank
detail specification for film integrated circuits and hybrid film
integrated circuits on the basis of qualification approval
procedures
| PPUB
| B | Webstore | |||
IEC 60748-22 Ed. 1.0Semiconductor devices. Integrated circuits - Part 22: Sectional
specification for film integrated circuits and hybrid film
integrated circuits on the basis of the capability approval
procedures
| DELPUB
| B | ||||
IEC 60748-22 Ed. 2.0Semiconductor devices - Integrated circuits - Part 22: Sectional
specification for film integrated circuits and hybrid film
integrated circuits on the basis of the capability approval
procedures
| PPUB
| B | Webstore | |||
IEC 60748-22-1 Ed. 1.0Semiconductor devices. Integrated circuits - Part 22 - Section
One: Blank detail specification for film integrated circuits and
hybrid film integrated circuits on the basis of the capability
approval procedures
| DELPUB
| B | ||||
IEC 60748-22-1 Ed. 2.0Semiconductor devices - Integrated circuits - Part 22-1: Blank
detail specification for film integrated circuits and hybrid film
integrated circuits on the basis of the capability approval
procedures
| PPUB
| B | Webstore | |||
IEC 60748-23-1 Ed. 1.0Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification | PPUB
| B | no | Webstore | ||
IEC 60748-23-2 Ed. 1.0Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests | PPUB
| E | no | Webstore | ||
IEC 60748-23-3 Ed. 1.0Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report | PPUB
| E | no | Webstore | ||
IEC 60748-23-4 Ed. 1.0Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification | PPUB
| E | no | Webstore | ||
IEC 60748-23-5 Ed. 1.0Semiconductor devices - Integrated circuits - Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval | PPUB
| E | no | Webstore | ||
IEC 61739 Ed. 1.0Integrated circuits - Procedures for manufacturing line approval
and quality management
| PPUB
| B | Webstore | |||
IEC 61748 Ed. 1.0Manufacturing line approval (QML) for MCM
| DEL
| B | yes | |||
IEC 61928 Ed. 1.0Internal inspection after encapsulation
| DEL
| E | 47A/407 | |||
IEC 61933 Ed. 1.0Transient energy - Electrostatic discharge sensitivity testing -
Machine model
| DEL
| E | 47A/410 | |||
IEC 61943 Ed. 1.0Integrated circuits - Manufacturing line approval application guideline | PPUB
| B | yes | Webstore | ||
IEC/TS 61944 Ed. 1.0Integrated circuits - Manufacturing line approval - Demonstration vehicles | PPUB
| B | Webstore | |||
IEC/TS 61945 Ed. 1.0Interated circuits - Manufacturing line approval - Methodology
for technology and failure analysis | PPUB
| B | Webstore | |||
IEC 61962 Ed. 1.0Electromagnetic compatibility measurement procedures for
integrated circuits
| MERGED
| E | 47A/429 | |||
IEC 61964 Ed. 1.0Integrated circuits - Memory devices pin configurations
| PPUB
| B | yes | Webstore | ||
IEC 61967 f2 Ed. 1.0Integrated circuits, Measurement of electromagnetic emission | DEL
| E | 47A/525 | |||
IEC 61967-1 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions
| PPUB
| B | yes | Webstore | ||
IEC/TR 61967-1-1 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format | PPUB
| B | 2010-05 | no | Webstore | |
DEL 61967-2 Ed. 1.0Integrated circuits - Measurement of electromagnetic emission, 150 KHz to 1 GHz - Part 2: Measurement of radiated emissions, TEM-cell method and wideband TEM-cell method (150KHz to 8 GHz)
| DEL
| E | yes | |||
IEC 61967-2 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method
| PPUB
| B | yes | Webstore | ||
DEL 61967-3 Ed. 1.0Integrated circuits - Measurement of electromagnetic emission,
150 KHz to 1 GHz - Part 3: Measurement of radiated emissions,
surface scan method (10 MHz to 3 GHz) | DEL
| E | ||||
IEC/TS 61967-3 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions, 150 KHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method | PPUB
| B | no | Webstore | ||
IEC/TS 61967-3 Ed. 2.0Integrated Circuits - Measurement of Electromagnetic Emissions - Part 3: Measurement of radiated emissions - Surface scan method | A2CD
| E | 2014-02 | yes | ||
IEC 61967-4 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions,
150 kHz to 1 GHz - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method | PPUB
| B | yes | Webstore | ||
IEC 61967-4 Ed. 1.1Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohms direct coupling method | PPUB
| B | Webstore | |||
IEC 61967-4 am1 Ed. 1.0Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method
| PPUB
| B | yes | Webstore | ||
IEC/TR 61967-4-1 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4 | PPUB
| E | 2005-02 | Webstore | ||
IEC 61967-5 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions,
150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method | PPUB
| B | yes | Webstore | ||
IEC 61967-6 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions,
150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method
| PPUB
| B | yes | Webstore | ||
IEC 61967-6 Ed. 1.1Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method | PPUB
| B | Webstore | |||
IEC 61967-6 fC1 Ed. 1.0Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method | PPUB
| B | Webstore | |||
IEC 61967-6 am1 Ed. 1.0Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method | PPUB
| B | 2008-03 | yes | Webstore | |
IEC 61967-7 Ed. 1.0Integrated circuits, Universal testboard for EMC measurement
| MERGED
| E | 47A/552 | |||
IEC 61967-8 Ed. 1.0Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method | PPUB
| B | 2011-08 | yes | Webstore | |
IEC/TS 62049 Ed. 1.0Guidance for QML approval achievement according to IEC 61739
| DEL
| E | 47A/473 | |||
IEC 62132-1 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions | PPUB
| B | yes | Webstore | ||
IEC 62132-1 Ed. 2.0Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions | 2CD
| E | 2014-06 | yes | ||
DEL 62132-2 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Narrowband disturbance by bulk current injection (BCI)
| CAN
| E | 47A/526 | |||
IEC 62132-2 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method | PPUB
| B | 2010-04 | yes | Webstore | |
DEL 62132-3 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Conducted RF disturbance by direct RF power injection
| CAN
| E | 47A/529 | |||
IEC 62132-3 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method | PPUB
| B | 2007-10 | yes | Webstore | |
IEC 62132-4 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method | PPUB
| B | yes | Webstore | ||
IEC 62132-5 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method
| PPUB
| B | yes | Webstore | ||
IEC/TS 62132-6 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method | DEL
| E | 2012-12 | |||
IEC 62132-8 Ed. 1.0Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method | PPUB
| B | 2012-07 | yes | Webstore | |
IEC/TS 62132-9 Ed. 1.0Integrated circuits, measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method | 2CD
| E | 2015-06 | |||
IEC 62147 Ed. 1.0Unified Quality Management Standard for Approval / Certification | DEL
| E | ||||
IEC 62200 Ed. 1.0Integrated circuits, I/O Interface Model (IMIC) | CAN
| E | 47A/575 | |||
IEC/TS 62215-2 Ed. 1.0Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method | PPUB
| E | 2007-11 | no | Webstore | |
IEC 62215-3 Ed. 1.0Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method | APUB
| B | 2013-06 | yes | ||
IEC/TS 62228 Ed. 1.0Integrated circuits - EMC evaluation of CAN transceivers | PPUB
| E | 2007-12 | no | Webstore | |
IEC/TS 62404 Ed. 1.0Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3) | PPUB
| E | 2007-12 | yes | Webstore | |
IEC/TS 62433-1 Ed. 1.0EMC IC modelling - Part 1: General modelling framework
| PPUB
| B | 2011-05 | no | Webstore | |
IEC 62433-2 Ed. 1.0EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) | PPUB
| B | 2008-10 | yes | Webstore | |
IEC 62433-2 fF Ed. 1.0EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE) | MERGED
| F | 2012-10 | |||
IEC/TR 62433-2-1 Ed. 1.0EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission
| PPUB
| B | 2010-10 | no | Webstore | |
IEC 62433-4 Ed. 1.0ICIM-CI, Integrated Circuit Immunity Model, Conducted Immunity | PWI
| E | ||||
IEEC 62433-4 Ed. 1.0ICIM-CI, Integrated Circuit Immunity Model, Conducted Immunity | PWI
| E | ||||
IEC 60148A Ed. 2.0First supplement
| WPUB
| B | ||||
IEC 60148A Ed. 3.0Systematic review of IEC 148A (1974) | DEL
| B | ||||
IEC 60148B Ed. 2.0Second supplement
| WPUB
| B | ||||
IEC 60148B Ed. 3.0Systematic review of IEC 148B (1979) | DEL
| B |
49 kB