International Standards and Conformity Assessment for all electrical, electronic and related technologies

SC 47A

Integrated circuits

 
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SC 47A Project files (159)

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Date

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Reference

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PWI 47A-1 Ed. 1.0

IEC 62433-3 Ed.1: Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

DEL
  • DEL
  • Deleted items
E
PWI 47A-2 Ed. 1.0

IEC 62433-4 Ed.1: ICIM-CI, Integrated Circuit Immunity Model, Conducted Immunity

DEL
  • DEL
  • Deleted items
E
PWI 47A-3 Ed. 1.0

IEC 62228-2 Ed.1: Integrated circuits - EMC Evaluation of LIN transceivers

DEL
  • DEL
  • Deleted items
E
PNW 47A-474 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 1: General

DEL
  • DEL
  • Deleted items
E 47A/474
PNW 47A-537 Ed. 1.0

Integrated film circuits - Materials - Part 1: Substrates

DEL
  • DEL
  • Deleted items
E 47A/537
PNW 47A-538 Ed. 1.0

Integrated film circuits - Materials - Part 2: Methods for the assessment of conductive pastes

DEL
  • DEL
  • Deleted items
E 47A/538
PNW 47A-539 Ed. 1.0

Integrated film circuits - Materials - Part 3: Methods for the assessment of dielectric pastes

DEL
  • DEL
  • Deleted items
E 47A/539
PNW 47A-540 Ed. 1.0

Integrated film circuits - Materials - Part 4: Methods for judgement of thick film resistor compositions

DEL
  • DEL
  • Deleted items
E 47A/540
PNW 47A-786 Ed. 1.0

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

DEL
  • DEL
  • Deleted items
E 47A/786
PNW 47A-787 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2-xx: Digital integrated circuits - Unified wide power supply voltage range CMOS DC interface standard for non-terminated digital integrated circuits

DEL
  • DEL
  • Deleted items
E 47A/787
PNW/TS 47A-789 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method

DEL
  • DEL
  • Deleted items
E 47A/789
PNW 47A-935 Ed. 1.0

Integrated circuits - Fine alignment of stacked dies in three dimensional integrated circuits

DEL
  • DEL
  • Deleted items
E 47A/935
PNW 47A-878A Ed. 1.0

Future IEC 62433-4: EMC IC modelling Part 4: Models of Integrated Circuits for EMI behavioural simulation, Conducted Immunity modelling (ICIM-CI)

DEL
  • DEL
  • Deleted items
E 47A/878A
IEC 60148 Ed. 2.0

Letter symbols for semiconductor devices and integrated microcircuits. *Note.- This publication has been superseded by IEC 748-1 (1984)

WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60148 Ed. 3.0

Systematic review of IEC 148 (1969)

DEL
  • DEL
  • Deleted items
B
DEL 60748-1 Ed. 2.0

Estimation of reliability characteristics for plastic encapsulated integrated circuits

DEL
  • DEL
  • Deleted items
B 47A/400
IEC 60748-1 Ed. 1.0

Semiconductor devices. Integrated circuits. Part 1: General

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-1 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 1: General

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B no Webstore
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
DEL 60748-1 am4 f7 Ed. 1.0

Amendment to the definition of hybrid integrated circuits, in IEC 748-1

DEL
  • DEL
  • Deleted items
E
IEC 60748-2 Ed. 1.0

Semiconductor devices. Integrated circuits. Part 2: Digital integrated circuits

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-2 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits

PPUB
  • PPUB
  • Publication issued
B Webstore
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-2 am4 f6 Ed. 1.0

Classification and definition for Programme Logic Devices (PLDs), to be added to IEC 748-1

MERGED
  • MERGED
  • Merged project
B
IEC 60748-2-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section One: Blank detail specification for bipolar monolithic digital integrated circuit gates (excluding uncommitted logic arrays)

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-1 Ed. 2.0

Systematic review of IEC 748-2-1 (1991)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-2 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section two: Family specification for HCMOS digital integrated circuits, series 54/74 HC, 54/74 HCT, 54/74 HCU

PPUB
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B Webstore
IEC 60748-2-2 Ed. 2.0

Systematic review of IEC 60748-2-2 (1992)

DEL
  • DEL
  • Deleted items
B
PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-3 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section three: Blank detail specification for HCMOS digital integrated circuits (series 54/74 HC, 54/74 HCT, 54/74 HCU)

PPUB
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B Webstore
IEC 60748-2-3 Ed. 2.0

Systematic review of IEC 60748-2-3 (1992)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-4 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section four: Family specification for complementary MOS digital integrated circuits, series 4000 B and 4000 UB

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-4 Ed. 2.0

Systematic review of IEC 60748-2-4 (1992)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-5 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section five: Blank detail specification for complementary MOS digital integrated circuits (series 4000 B and 4000 UB)

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  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-5 Ed. 2.0

Systematic review of IEC 60748-2-5 (1992)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-6 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section Six: Blank detail specification for microprocessor integrated circuits

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  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-6 Ed. 2.0

Systematic review of IEC 60748-2-6 (1991)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-7 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 2: Digital integrated circuits - Section seven: Blank detail specification for integrated circuit fusible-link programmable bipolar read-only memories

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B Webstore
IEC 60748-2-7 Ed. 2.0

Systematic review of IEC 748-2-7 (1992)

DEL
  • DEL
  • Deleted items
B
IEC 60748-2-8 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section Eight: Blank detail specification for integrated circuit static read/write memories

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B Webstore
IEC 60748-2-9 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 9: Blank detail specification for MOS ultraviolet light erasable electrically programmable read-only memories

PPUB
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B Webstore
IEC 60748-2-10 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2: Digital integrated circuits - Section 10: Blank detail specification for integrated circuit dynamic read/write memories

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-11 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2-11: Digital integrated circuits - Blank detail specification for single supply integrated circuit, electrically erasable, and programmable read-only memory

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-12 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 2-12: Digital integrated circuits - Blank detail specification for programmable logic devices (PLDs)

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-2-20 Ed. 1.0

Semiconductor devices - Integrated circuits Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

DELPUB
  • DELPUB
  • Deleted Publication
B 2000-10
IEC 60748-2-20 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 2-20: Digital integrated circuits - Family specification - Low voltage integrated circuits

PPUB
  • PPUB
  • Publication issued
B 2008-06 no Webstore
IEC 60748-3 Ed. 1.0

Semiconductor devices. Integrated circuits. Part 3: Analogue integrated circuits

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-3 Ed. 2.0

Systematic review of IEC 748-3 (1986)

DEL
  • DEL
  • Deleted items
B
PPUB
  • PPUB
  • Publication issued
B Webstore
PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-3-1 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 3: Analogue integrated circuits - Section one: Blank detail specification for monolithic integrated operational amplifiers

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-3-1 Ed. 2.0

Systematic review of IEC 748-3-1 (1991)

DEL
  • DEL
  • Deleted items
B
IEC 60748-4 Ed. 1.0

Semiconductor devices. Integrated circuits. Part 4: Interface integrated circuits

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-4 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits

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  • PPUB
  • Publication issued
B Webstore
IEC 60748-4 f1 Ed. 2.0

Interface integrated circuits - Measuring methods of linear ADC and DAC

MERGED
  • MERGED
  • Merged project
B
IEC 60748-4 f3 Ed. 2.0

Interface integrated circuits - Amendments and additions to the IEC 748-4, Chapter II, Clause 2 for Category II

MERGED
  • MERGED
  • Merged project
B
IEC 60748-4 f4 Ed. 2.0

Letter symbols for use with ISDN - Oriented modular interface circuits (Revision of IEC 748-4)

MERGED
  • MERGED
  • Merged project
E 47A(U.K.)244
IEC 60748-4 f5 Ed. 2.0

Revision of IEC 748-4 - Interface integrated circuits - Measuring methods of linear ADC and DAC

MERGED
  • MERGED
  • Merged project
E 47A(U.K.)245
IEC 60748-4 f6 Ed. 2.0

Amendment to 47A(Sec.)300 - Measuring methods of maximum operating frequency of ADC

MERGED
  • MERGED
  • Merged project
E 47A(JP)211
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B 47A(C.O.)218
IEC 60748-4-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 1: Blank detail specification for linear digital-to-analogue converters (DAC)

PPUB
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  • Publication issued
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IEC 60748-4-2 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 4: Interface integrated circuits - Section 2: Blank detail specification for linear analogue-to-digital converters (ADC)

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IEC 60748-4-3 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 4-3: Interface integrated circuits - Dynamic criteria for analogue-digital converters (ADC)

PPUB
  • PPUB
  • Publication issued
E 2006-08 no Webstore
IEC 60748-5 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 5: Semicustom integrated circuits

PPUB
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  • Publication issued
B yes Webstore
IEC 60748-5 f1 Ed. 1.0

Classification of integrated circuits - New IEC 748-5

MERGED
  • MERGED
  • Merged project
B
IEC 60748-5 f3 Ed. 1.0

Amendment to IEC 748-5 - Chapter V: Acceptance and reliability

DEL
  • DEL
  • Deleted items
B
IEC 60748-11 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

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  • Publication issued
B Webstore
PPUB
  • PPUB
  • Publication issued
B Webstore
PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-11-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 11 - Section 1: Internal visual examination for semiconductor integrated circuits excluding hybrid circuits

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-11-1 Ed. 2.0

Systematic review of IEC 60748-11-1 (1992)

DEL
  • DEL
  • Deleted items
B
IEC 60748-20 Ed. 1.0

Semiconductor devices. Integrated circuits. Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits

PPUB
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  • Publication issued
B Webstore
IEC 60748-20 Ed. 2.0

Systematic review of IEC 748-20 (1988)

DEL
  • DEL
  • Deleted items
B
IEC 60748-20 am1 Ed. 1.0

Amendment No. 1 to IEC 748-20

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  • Publication issued
B Webstore
IEC 60748-20 am1 f2 Ed. 1.0

Amendment to IEC 748-20

MERGED
  • MERGED
  • Merged project
B
IEC 60748-20-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 20: Generic specification for film integrated circuits and hybrid film integrated circuits - Section 1: Requirements for internal visual examination

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IEC 60748-21 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-21 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 21: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-21-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 21; Section One: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedure

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-21-1 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 21-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of qualification approval procedures

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-22 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-22 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 22: Sectional specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 60748-22-1 Ed. 1.0

Semiconductor devices. Integrated circuits - Part 22 - Section One: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60748-22-1 Ed. 2.0

Semiconductor devices - Integrated circuits - Part 22-1: Blank detail specification for film integrated circuits and hybrid film integrated circuits on the basis of the capability approval procedures

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  • Publication issued
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IEC 60748-23-1 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 23-1: Hybrid integrated circuits and film structures - Manufacturing line certification - Generic specification

PPUB
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B no Webstore
IEC 60748-23-2 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 23-2: Hybrid integrated circuits and film structures - Manufacturing line certification - Internal visual inspection and special tests

PPUB
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  • Publication issued
E no Webstore
IEC 60748-23-3 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 23-3: Hybrid integrated circuits and film structures - Manufacturing line certification - Manufacturers' self-audit checklist and report

PPUB
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E no Webstore
IEC 60748-23-4 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 23-4: Hybrid integrated circuits and film structures - Manufacturing line certification - Blank detail specification

PPUB
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E no Webstore
IEC 60748-23-5 Ed. 1.0

Semiconductor devices - Integrated circuits - Part 23-5: Hybrid integrated circuits and film structures - Manufacturing line certification - Procedure for qualification approval

PPUB
  • PPUB
  • Publication issued
E no Webstore
IEC 61739 Ed. 1.0

Integrated circuits - Procedures for manufacturing line approval and quality management

PPUB
  • PPUB
  • Publication issued
B Webstore
IEC 61748 Ed. 1.0

Manufacturing line approval (QML) for MCM

DEL
  • DEL
  • Deleted items
B yes
IEC 61928 Ed. 1.0

Internal inspection after encapsulation

DEL
  • DEL
  • Deleted items
E 47A/407
IEC 61933 Ed. 1.0

Transient energy - Electrostatic discharge sensitivity testing - Machine model

DEL
  • DEL
  • Deleted items
E 47A/410
IEC 61943 Ed. 1.0

Integrated circuits - Manufacturing line approval application guideline

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B yes Webstore
IEC/TS 61944 Ed. 1.0

Integrated circuits - Manufacturing line approval - Demonstration vehicles

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B Webstore
IEC/TS 61945 Ed. 1.0

Interated circuits - Manufacturing line approval - Methodology for technology and failure analysis

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B Webstore
IEC 61962 Ed. 1.0

Electromagnetic compatibility measurement procedures for integrated circuits

MERGED
  • MERGED
  • Merged project
E 47A/429
IEC 61964 Ed. 1.0

Integrated circuits - Memory devices pin configurations

PPUB
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  • Publication issued
B yes Webstore
IEC 61967 f2 Ed. 1.0

Integrated circuits, Measurement of electromagnetic emission

DEL
  • DEL
  • Deleted items
E 47A/525
IEC 61967-1 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 1: General conditions and definitions

PPUB
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B yes Webstore
IEC/TR 61967-1-1 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

DELPUB
  • DELPUB
  • Deleted Publication
B 2010-05 no
IEC/TR 61967-1-1 Ed. 2.0

Integrated circuits - Measurement of electromagnetic emissions - Part 1-1: General conditions and definitions - Near-field scan data exchange format

PPUB
  • PPUB
  • Publication issued
E 2015-09 no Webstore
DEL 61967-2 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emission, 150 KHz to 1 GHz - Part 2: Measurement of radiated emissions, TEM-cell method and wideband TEM-cell method (150KHz to 8 GHz)

DEL
  • DEL
  • Deleted items
E yes
IEC 61967-2 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 2: Measurement of radiated emissions - TEM cell and wideband TEM cell method

PPUB
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B yes Webstore
DEL 61967-3 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emission, 150 KHz to 1 GHz - Part 3: Measurement of radiated emissions, surface scan method (10 MHz to 3 GHz)

DEL
  • DEL
  • Deleted items
E
IEC/TS 61967-3 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 KHz to 1 GHz - Part 3: Measurement of radiated emissions - Surface scan method

DELPUB
  • DELPUB
  • Deleted Publication
B 2005-06 no
IEC/TS 61967-3 Ed. 2.0

Integrated circuits - Measurement of electromagnetic emissions - Part 3: Measurement of radiated emissions - Surface scan method

PPUB
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  • Publication issued
B 2014-08 no Webstore
IEC 61967-4 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions, 1 ohm/150 ohm direct coupling method

PPUB
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B yes Webstore
IEC 61967-4 Ed. 1.1

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohms direct coupling method

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IEC 61967-4 am1 Ed. 1.0

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4: Measurement of conducted emissions - 1 ohm/150 ohm direct coupling method

PPUB
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B yes Webstore
IEC/TR 61967-4-1 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 4-1: Measurement of conducted emissions - 1 Ohm/150 Ohm direct coupling method - Application guidance to IEC 61967-4

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E 2005-02 Webstore
IEC 61967-5 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 5: Measurement of conducted emissions - Workbench Faraday Cage method

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B yes Webstore
IEC 61967-6 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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B yes Webstore
IEC 61967-6 Ed. 1.1

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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IEC 61967-6 fC1 Ed. 1.0

Corrigendum 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

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IEC 61967-6 am1 Ed. 1.0

Amendment 1 - Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method

PPUB
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  • Publication issued
B 2008-03 yes Webstore
IEC 61967-7 Ed. 1.0

Integrated circuits, Universal testboard for EMC measurement

MERGED
  • MERGED
  • Merged project
E 47A/552
IEC 61967-8 Ed. 1.0

Integrated circuits - Measurement of electromagnetic emissions - Part 8: Measurement of radiated emissions - IC stripline method

PPUB
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  • Publication issued
B 2011-08 yes Webstore
IEC/TS 62049 Ed. 1.0

Guidance for QML approval achievement according to IEC 61739

DEL
  • DEL
  • Deleted items
E 47A/473
IEC 62132-1 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 1: General conditions and definitions

DELPUB
  • DELPUB
  • Deleted Publication
B 2006-01 yes
IEC 62132-1 Ed. 2.0

Integrated circuits - Measurement of electromagnetic immunity - Part 1: General conditions and definitions

PPUB
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  • Publication issued
B 2015-10 yes Webstore
DEL 62132-2 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Narrowband disturbance by bulk current injection (BCI)

CAN
  • CAN
  • Draft cancelled
E 47A/526
IEC 62132-2 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 2: Measurement of radiated immunity - TEM cell and wideband TEM cell method

PPUB
  • PPUB
  • Publication issued
B 2010-04 yes Webstore
DEL 62132-3 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Conducted RF disturbance by direct RF power injection

CAN
  • CAN
  • Draft cancelled
E 47A/529
IEC 62132-3 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 3: Bulk current injection (BCI) method

PPUB
  • PPUB
  • Publication issued
B 2007-10 yes Webstore
IEC 62132-4 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity 150 kHz to 1 GHz - Part 4: Direct RF power injection method

PPUB
  • PPUB
  • Publication issued
B yes Webstore
IEC 62132-4 Ed. 2.0

Integrated circuits - Measurement of electoromagnatic immuity - Part 4: Direct RF power injection method

AMW
  • AMW
  • Approved Maintenance Work
E 2018-12 yes 47A/981
IEC 62132-5 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity, 150 kHz to 1 GHz - Part 5: Workbench Faraday cage method

PPUB
  • PPUB
  • Publication issued
B yes Webstore
IEC/TS 62132-6 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 6: Local Injection Horn Antenna (LIHA) method

DEL
  • DEL
  • Deleted items
E 2012-12
IEC 62132-8 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 8: Measurement of radiated immunity - IC stripline method

PPUB
  • PPUB
  • Publication issued
B 2012-07 yes Webstore
IEC/TS 62132-9 Ed. 1.0

Integrated circuits - Measurement of electromagnetic immunity - Part 9: Measurement of radiated immunity - Surface scan method

PPUB
  • PPUB
  • Publication issued
B 2014-08 no Webstore
IEC 62147 Ed. 1.0

Unified Quality Management Standard for Approval / Certification

DEL
  • DEL
  • Deleted items
E
IEC 62200 Ed. 1.0

Integrated circuits, I/O Interface Model (IMIC)

CAN
  • CAN
  • Draft cancelled
E 47A/575
IEC/TS 62215-2 Ed. 1.0

Integrated circuits - Measurement of impulse immunity - Part 2: Synchronous transient injection method

PPUB
  • PPUB
  • Publication issued
E 2007-11 no Webstore
IEC 62215-3 Ed. 1.0

Integrated circuits - Measurement of impulse immunity - Part 3: Non-synchronous transient injection method

PPUB
  • PPUB
  • Publication issued
B 2013-06 yes Webstore
IEC/TS 62228 Ed. 1.0

Integrated circuits - EMC evaluation of CAN transceivers

PPUB
  • PPUB
  • Publication issued
E 2007-12 no Webstore
IEC 62228-1 Ed. 1.0

Integrated Circuits - EMC evaluation of transceivers - Part 1: General conditions and definitions

ANW
  • ANW
  • Approved New Work
E 2018-10 47A/970
IEC 62228-2 Ed. 1.0

Integrated circuits - EMC Evaluation of transceivers - Part 2: LIN transceivers

CDIS
  • CDIS
  • Draft circulated as FDIS
B 2017-01 yes
IEC 62228-3 Ed. 1.0

Integrated circuits - EMC evaluation of transceivers - Part 3: CAN transceivers

AMW
  • AMW
  • Approved Maintenance Work
E 2018-12 yes 47A/980
IEC/TS 62404 Ed. 1.0

Logic digital integrated circuits - Specification for I/O interface model for integrated circuit (IMIC version 1.3)

PPUB
  • PPUB
  • Publication issued
E 2007-12 yes Webstore
IEC/TS 62433-1 Ed. 1.0

EMC IC modelling - Part 1: General modelling framework

PPUB
  • PPUB
  • Publication issued
B 2011-05 no Webstore
IEC 62433-2 Ed. 1.0

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

PPUB
  • PPUB
  • Publication issued
B 2008-10 yes Webstore
IEC 62433-2 Ed. 2.0

EMC IC Modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

ADIS
  • ADIS
  • Approved for FDIS circulation
B 2017-04 yes
IEC 62433-2 fF Ed. 1.0

EMC IC modelling - Part 2: Models of integrated circuits for EMI behavioural simulation - Conducted emissions modelling (ICEM-CE)

MERGED
  • MERGED
  • Merged project
F 2012-10
IEC/TR 62433-2-1 Ed. 1.0

EMC IC modelling - Part 2-1: Theory of black box modelling for conducted emission

PPUB
  • PPUB
  • Publication issued
B 2010-10 no Webstore
IEC 62433-3 Ed. 1.0

EMC IC modelling - Part 3: Models of integrated circuits for EMI behavioural simulation - Radiated emissions modelling (ICEM-RE)

ADIS
  • ADIS
  • Approved for FDIS circulation
B 2017-04 yes
IEC 62433-4 Ed. 1.0

EMC IC modelling - Part 4: Models of integrated circuits for RF immunity behavioural simulation - Conducted immunity modelling (ICIM-CI)

PPUB
  • PPUB
  • Publication issued
B 2016-06 yes Webstore
IEC 62433-4 f1 Ed. 1.0

ICIM-CI, Integrated Circuit Immunity Model, Conducted Immunity

DEL
  • DEL
  • Deleted items
E
IEEC 62433-4 Ed. 1.0

ICIM-CI, Integrated Circuit Immunity Model, Conducted Immunity

DEL
  • DEL
  • Deleted items
E
IEC 63011-1 Ed. 1.0

Integrated circuits - Three dimensional integrated circuits - Part 1: General conditions and definitions

ANW
  • ANW
  • Approved New Work
E 2019-02 47A/978
IEC 63011-2 Ed. 1.0

Semiconductor devices - Advanced hybrid integrated circuits - Alignment of stacked dies having fine pitch interconnect

ANW
  • ANW
  • Approved New Work
E 2018-06 47A/961
IEC 63011-3 Ed. 1.0

Integrated circuits - Three dimensional integrated circuits - Part 3: A model and measurement conditions of Through Silicon Via

ANW
  • ANW
  • Approved New Work
E 2019-02 47A/979
IEC 60148A Ed. 2.0

First supplement

WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60148A Ed. 3.0

Systematic review of IEC 148A (1974)

DEL
  • DEL
  • Deleted items
B
IEC 60148B Ed. 2.0

Second supplement

WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60148B Ed. 3.0

Systematic review of IEC 148B (1979)

DEL
  • DEL
  • Deleted items
B