International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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TC 91 Project files (573)

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PNW 52-605 Ed. 1.0

Revision of IEC 410
DEL
  • DEL
  • Deleted items
E52/605
PNW 52-609 Ed. 1.0

Amendment to IEC 249-1 (1982) - Sub-clause 3.8.1
DEL
  • DEL
  • Deleted items
E52/609
PNW 52-685 Ed. 1.0

New specification IEC 2326-XX: Specification for appearance of surfaces of flexible printed boards
DEL
  • DEL
  • Deleted items
E52/685
PNW 52-725 Ed. 1.0

Specification for appearances of surfaces of flexible printed boards
DEL
  • DEL
  • Deleted items
E52/725
PNW 52-727 Ed. 1.0

Process assessment schedule for mass lamination panels
DEL
  • DEL
  • Deleted items
E52/727
PNW 52-728 Ed. 1.0

Technology approval schedule for printed boards
DEL
  • DEL
  • Deleted items
E52/728
PNW 52-729 Ed. 1.0

Base material for printed boards
DEL
  • DEL
  • Deleted items
E52/729
PNW 52-730 Ed. 1.0

Process assessment schedule for printed board design facilities
DEL
  • DEL
  • Deleted items
E52/730
PNW 52-756 Ed. 1.0

Generic computer aided manufacturing format (GenCAM)
DEL
  • DEL
  • Deleted items
E52/756
PWI 52-807 Ed. 1.0

IEC 61249-1: Materials for interconnecting structures - Part 1: Generic specification
DEL
  • DEL
  • Deleted items
E52/807
PNW 91-14-1 Ed. 1.0

Revision of IEC 326-3 - New IEC 1188-2: Design and use requirements of printed boards and printed board assemblies - Part 2: Sectional design and use requirements - Engineering considerations. considerations
DEL
  • DEL
  • Deleted items
E91/64
PNW 91-15-1 Ed. 1.0

New Standard IEC 1193: Guidance on the use of IEC and ISO publications and quality assessment systems for printed boards and printed board assemblies
DEL
  • DEL
  • Deleted items
E91/65
PNW 91-405 Ed. 1.0

IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards
DEL
  • DEL
  • Deleted items
E91/405
PNW 91-407 Ed. 1.0

IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips)
DEL
  • DEL
  • Deleted items
E91/407
PNW 91-432 Ed. 1.0

IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges
DEL
  • DEL
  • Deleted items
E91/432
PNW 91-433 Ed. 1.0

IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics
DEL
  • DEL
  • Deleted items
E91/433
PNW 91-469 Ed. 1.0

Specification for Flexible Optical Board using Glass Fibre and its test methods
DEL
  • DEL
  • Deleted items
E91/469
PNW 91-470 Ed. 1.0

Specification for rigid optical board using planar waveguide and its test methods
DEL
  • DEL
  • Deleted items
E91/470
PNW 91-471 Ed. 1.0

Specification for optical board connector type SF using glass fibre
DEL
  • DEL
  • Deleted items
E91/471
PNW 91-476 Ed. 1.0

Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices
DEL
  • DEL
  • Deleted items
E91/476
PNW 91-486 Ed. 1.0

Detail Specification for Right-angled Optical Board Connector using Glass Fibers
DEL
  • DEL
  • Deleted items
E91/486
PNW 91-563 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
DEL
  • DEL
  • Deleted items
E91/563
PNW 91-592 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly
DEL
  • DEL
  • Deleted items
E91/592
PNW 91-594 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly
DEL
  • DEL
  • Deleted items
E91/594
PNW 91-595 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly
DEL
  • DEL
  • Deleted items
E91/595
PNW 91-596 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly
DEL
  • DEL
  • Deleted items
E91/596
PNW 91-597 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly
DEL
  • DEL
  • Deleted items
E91/597
PNW 91-598 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-38: Sectional specification set for reinforced based materials, clad and unclad - Non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly
DEL
  • DEL
  • Deleted items
E91/598
PNW 91-902 Ed. 1.0

Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder.
DEL
  • DEL
  • Deleted items
E91/902A
PNW 91-1035 Ed. 1.0

Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method
DEL
  • DEL
  • Deleted items
E91/1035
PNW 91-1149 Ed. 1.0

FinSimMath, as a model for HDLMath
DEL
  • DEL
  • Deleted items
E91/1149
DEL 93-2 Ed. 1.0

Library standard architecture (future IEC 62014-2) (TR)
DEL
  • DEL
  • Deleted items
E
DEL 93-3 Ed. 1.0

Test information flow through the product life cycle (TR)
DEL
  • DEL
  • Deleted items
E
DEL 93-4 Ed. 1.0

Models of integrated circuits for EMI behavioural simulation (future IEC 62014-3)
MERGED
  • MERGED
  • Merged project
E
DEL 93-4 f1 Ed. 1.0

Terminology and taxonomy for eletronic design automation
DEL
  • DEL
  • Deleted items
E
DEL 93-5 Ed. 1.0

Library utilities for VHDL (TR)
DEL
  • DEL
  • Deleted items
E
PWI 93-7 Ed. 1.0

Libraries of reusable parts for electrotechnical products
DEL
  • DEL
  • Deleted items
E93/73
DEL 93-9 Ed. 1.0

AI Estate - Overview and Architecture (Fast Track request expected from USNC)
DEL
  • DEL
  • Deleted items
E
DEL 93-10 Ed. 1.0

AI Estate - Data and Knowledge (Fast track request expected from USNC)
DEL
  • DEL
  • Deleted items
E
DEL 93-11 Ed. 1.0

AI Estate - Service specification (Fast track request expected from USNC)
DEL
  • DEL
  • Deleted items
E
PNW 93-31 Ed. 1.0

Electronic design automation - Verilog 1364 - The verilog hardware description language (HDL) reference manual
DEL
  • DEL
  • Deleted items
E93/31
PNW 93-39 Ed. 1.0

Libraries of reusable parts for electrotechnical products: Development of models for CAD tools
DEL
  • DEL
  • Deleted items
E93/39
PNW 93-40 Ed. 1.0

Libraries of reusable parts for electrotechnical products: Component information representation
DEL
  • DEL
  • Deleted items
E93/40
PNW 93-41 Ed. 1.0

Libraries of reusable parts for electrotechnical products: Library organisation
DEL
  • DEL
  • Deleted items
E93/41
PNW 93-60 Ed. 1.0

IBIS models and EMC simulation
DEL
  • DEL
  • Deleted items
E93/60
PNW 93-80 Ed. 1.0

Electronic CAD to CAM exchange
DEL
  • DEL
  • Deleted items
E93/80
PNW 93-127 Ed. 1.0

Standard Hardware Description Language Based on the Verilog Hardware Description Language
DEL
  • DEL
  • Deleted items
E93/127
PNW 93-128 Ed. 1.0

Standard for Standard Delay Format (SDF) for the Electronic Design Process
DEL
  • DEL
  • Deleted items
E93/128
DEL 93-204 Ed. 1.0

Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration
DEL
  • DEL
  • Deleted items
E93/204
DEL 93-209 Ed. 1.0

Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX)
DEL
  • DEL
  • Deleted items
E93/209
PNW 93-283 Ed. 1.0

IEC 61692-2 Ed 1.0: Common rules for circulation of electronic catalogue data - Part 2: Common exchange rules and Interoperability system (IOS)
DEL
  • DEL
  • Deleted items
E2010-1293/283
DEL 60068-2-20 Ed. 5.0

Systematic review of IEC 68-2-20 (1979)
DEL
  • DEL
  • Deleted items
B
IEC 60068-2-20 Ed. 4.0

Environmental testing. Part 2-20: Tests. Test T: Soldering
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  • Deleted Publication
B
IEC 60068-2-20 Ed. 5.0

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
PPUB
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  • Publication issued
B2008-07yesWebstore
IEC 60068-2-20 fF Ed. 5.0

Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
MERGED
  • MERGED
  • Merged project
F2009-08
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60068-2-21 Ed. 4.0

Environmental testing. Part 2-21: Tests. Test U: Robustness of terminations and integral mounting devices
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60068-2-21 Ed. 5.0

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
DELPUB
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  • Deleted Publication
Byes
IEC 60068-2-21 Ed. 6.0

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
PPUB
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  • Publication issued
B2006-06yesWebstore
IEC 60068-2-21 fC1 Ed. 6.0

Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
PPUB
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BWebstore
IEC 60068-2-21 fF Ed. 5.0

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
MERGED
  • MERGED
  • Merged project
B
IEC 60068-2-21 fF Ed. 6.0

Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
MERGED
  • MERGED
  • Merged project
F2011-08
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  • DELPUB
  • Deleted Publication
B
DELPUB
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  • Deleted Publication
B50(C.O.)243
IEC 60068-2-44 Ed. 1.0

Environmental testing. Part 2-44: Tests. Guidance on Test T: Soldering
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  • Deleted Publication
B
IEC 60068-2-44 Ed. 2.0

Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering
PPUB
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  • Publication issued
ByesWebstore
DEL 60068-2-54 Ed. 2.0

Systematic review of IEC 68-2-54 (1985)
DEL
  • DEL
  • Deleted items
B
IEC 60068-2-54 Ed. 1.0

Environmental testing. Part 2-54: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method
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  • DELPUB
  • Deleted Publication
B
IEC 60068-2-54 Ed. 2.0

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
PPUB
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  • Publication issued
B2006-05yesWebstore
IEC 60068-2-54 fF Ed. 2.0

Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
MERGED
  • MERGED
  • Merged project
F2013-05
IEC 60068-2-58 Ed. 1.0

Environmental testing. Part 2-58: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD)
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60068-2-58 Ed. 2.0

Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
DELPUB
  • DELPUB
  • Deleted Publication
Eyes
IEC 60068-2-58 Ed. 3.0

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 60068-2-58 Ed. 4.0

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
DEC
  • DEC
  • Draft at Editing Check
B2015-03yes
IEC 60068-2-58 fF Ed. 3.0

Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
MERGED
  • MERGED
  • Merged project
B
IEC 60068-2-69 Ed. 1.0

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
DELPUB
  • DELPUB
  • Deleted Publication
B1995-12yes
IEC 60068-2-69 Ed. 2.0

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
PPUB
  • PPUB
  • Publication issued
B2007-06yesWebstore
IEC 60068-2-69 Ed. 3.0

Environmental testing: Part 2-69: Tests - Test Te: Solderability testing of electronic components and boards by the wetting balance (force measurement) method
1CD
  • 1CD
  • 1st Committee Draft
E2016-12yes
IEC 60068-2-69 fF Ed. 2.0

Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method
MERGED
  • MERGED
  • Merged project
B2008-04
DEL 60068-2-69 am1 Ed. 1.0

Amendment 1 to IEC 60068-2-69
DEL
  • DEL
  • Deleted items
E50/380
IEC 60068-2-77 Ed. 1.0

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
PPUB
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ByesWebstore
IEC 60068-2-77 fF Ed. 1.0

Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
MERGED
  • MERGED
  • Merged project
B
DEL 60068-2-80 Ed. 1.0

Environmental testing - Part 2: Tests - Test Tf: Solderability testing of printed wiring boards by the globule wetting balance method
DEL
  • DEL
  • Deleted items
E50/381
IEC 60068-2-82 Ed. 1.0

Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
PPUB
  • PPUB
  • Publication issued
B2007-07yesWebstore
IEC 60068-2-82 fC1 Ed. 1.0

Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 60068-2-82 fF Ed. 1.0

Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
MERGED
  • MERGED
  • Merged project
B2008-04
IEC 60068-2-83 Ed. 1.0

Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste
PPUB
  • PPUB
  • Publication issued
B2011-09yesWebstore
IEC/TR 60068-3-12 Ed. 1.0

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
PPUB
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  • Publication issued
E2007-04noWebstore
IEC/TR 60068-3-12 Ed. 2.0

Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile
BPUB
  • BPUB
  • Publication being printed
B2014-12no
IEC 60068-3-13 Ed. 1.0

IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering.
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
E2015-11yes
IEC 60097 Ed. 4.0

Grid systems for printed circuits
PPUB
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  • Publication issued
BWebstore
IEC 60097 Ed. 5.0

Systematic review of IEC 97 (1991)
DEL
  • DEL
  • Deleted items
B
IEC 60194 Ed. 3.0

Terms and definitions for printed circuits
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60194 Ed. 4.0

Printed board design, manufacture and assembly - Terms and definitions
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E
IEC 60194 Ed. 5.0

Printed board design, manufacture and assembly - Terms and definitions
PPUB
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  • Publication issued
EnoWebstore
IEC 60194 Ed. 6.0

Printed board design, manufacture and assembly - Terms and definitions
RDIS
  • RDIS
  • Text for FDIS received and registered
B2015-02no
IEC 60194 f2 Ed. 4.0

Terms and definitions for printed circuits and a proposal for a decimal classification code (DCC) for the categorization of the terms and definitions (Revision of IEC 194)
DEL
  • DEL
  • Deleted items
E
IEC 60249-1 Ed. 2.0

Base materials for printed circuits. Part 1: Test methods
WPUB
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  • Publication withdrawn
B
IEC 60249-1 f1 Ed. 3.0

Amendment to IEC 249-1 - Measurement method for glass transition temperature using differential scanning calorimetry (New Sub-clause 4.5)
DEL
  • DEL
  • Deleted items
E
IEC 60249-1 f2 Ed. 3.0

Amendment to IEC 249-1 - Measurement method of cure factor (New Sub-clause 4.6)
DEL
  • DEL
  • Deleted items
E
IEC 60249-1 f3 Ed. 3.0

Addition of a new Sub-clause 4.5.2 -Measurement method for glass transition temperature using thermomechanical analysis (TMA)- to IEC 249-1
DEL
  • DEL
  • Deleted items
E
IEC 60249-1 f4 Ed. 3.0

Amendment to Sub-clause 2.2.1 and 2.2.2 of IEC 249-1
DEL
  • DEL
  • Deleted items
E52(Sec.)302
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  • Publication withdrawn
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DEL 60249-2-1 f2 Ed. 2.0

Requirements for pull-off strength - Revision of Specification 249-2-1
DEL
  • DEL
  • Deleted items
E52/553
IEC 60249-2-1 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality
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  • WPUB
  • Publication withdrawn
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DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
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B
WPUB
  • WPUB
  • Publication withdrawn
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IEC 60249-2-2 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-2-2 f5 Ed. 2.0

Requirements for pull-off strength - Revision of Specification 249-2-2
MERGED
  • MERGED
  • Merged project
E52/553
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B
DELPUB
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B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-3 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper-clad laminated sheet of defined flammability (vertical burning test)
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  • WPUB
  • Publication withdrawn
B
IEC 60249-2-3 f2 Ed. 2.0

Requirements for pull-off strength - Revision of Specification 249-2-3
MERGED
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  • Merged project
E52/553
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WPUB
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IEC 60249-2-4 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade
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  • Publication withdrawn
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DEL 60249-2-5 f1 Ed. 2.0

Requirements for pull-off strength - Revision of Specification 249-2-5
DEL
  • DEL
  • Deleted items
E52/553
DEL 60249-2-5 f2 Ed. 2.0

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-5 (Sub-clause 5.5)
DEL
  • DEL
  • Deleted items
E52/552
IEC 60249-2-5 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
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  • WPUB
  • Publication withdrawn
B
IEC 60249-2-5 Ed. 3.0

Introduction of a new subclause 6.6 to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor
MERGED
  • MERGED
  • Merged project
Byes
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WPUB
  • WPUB
  • Publication withdrawn
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IEC 60249-2-6 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test)
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  • Publication withdrawn
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  • WPUB
  • Publication withdrawn
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DEL 60249-2-7 f11 Ed. 2.0

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/555
IEC 60249-2-7 Ed. 2.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test)
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-2-7 f5 Ed. 2.0

Requirements for surface waviness - Revision of Specification 249-2-7
MERGED
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  • Merged project
E52/554
DELPUB
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DELPUB
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B
WPUB
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IEC 60249-2-8 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film
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  • WPUB
  • Publication withdrawn
B
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B
IEC 60249-2-9 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test)
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  • WPUB
  • Publication withdrawn
B
IEC 60249-2-9 f7 Ed. 1.0

Requirements for surface waviness - Revision of Specification 249-2-9
MERGED
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  • Merged project
E52/554
DELPUB
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DELPUB
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B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-10 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test)
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  • Publication withdrawn
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DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-11 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-2-11 Ed. 2.0

Introduction of a new subclause 6.6. to IEC 249-2-4, 249-2-5, 249-2-11 and 249-2-12 concerning the requirements for glass transition temperature and cure factor
MERGED
  • MERGED
  • Merged project
Byes
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-12 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards
WPUB
  • WPUB
  • Publication withdrawn
B
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-13 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade
WPUB
  • WPUB
  • Publication withdrawn
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-2-14 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality
WPUB
  • WPUB
  • Publication withdrawn
B
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-15 Ed. 1.0

Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability
WPUB
  • WPUB
  • Publication withdrawn
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-2-16 Ed. 1.0

Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
WPUB
  • WPUB
  • Publication withdrawn
B52(C.O.)356
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-17 Ed. 1.0

Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
WPUB
  • WPUB
  • Publication withdrawn
B52(C.O.)357
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-18 Ed. 1.0

Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test)
WPUB
  • WPUB
  • Publication withdrawn
B52(C.O.)358
DELPUB
  • DELPUB
  • Deleted Publication
B
DELPUB
  • DELPUB
  • Deleted Publication
B
WPUB
  • WPUB
  • Publication withdrawn
Byes
IEC 60249-2-19 Ed. 1.0

Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
WPUB
  • WPUB
  • Publication withdrawn
B52(C.O.)359
WPUB
  • WPUB
  • Publication withdrawn
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-3-1 Ed. 2.0

Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-3-1 Ed. 3.0

Systematic review of IEC 60249-3-1 (1981)
DEL
  • DEL
  • Deleted items
B
IEC 60249-3-3 Ed. 1.0

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60249-3-3 Ed. 2.0

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards (Revision of IEC 249-3-3)
DEL
  • DEL
  • Deleted items
E52(Sec.)356
IEC 60249-3A Ed. 2.0

Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials. Note: Still valid, will be renumbered as 249-3-2 when next revised
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60321 Ed. 1.0

Guidance for the design and use of components intended for mounting on boards with printed wiring and printed circuits
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60321 Ed. 2.0

Systematic review of IEC 321 (1970)
DEL
  • DEL
  • Deleted items
B
IEC 60321 am1 Ed. 1.0

Amendment No. 1
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60321-2 Ed. 1.0

Auxiliary printed board information. Part 2: Rework, repair, modifications
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60321-2 Ed. 2.0

Systematic review of IEC 321-2 (1987)
DEL
  • DEL
  • Deleted items
B
IEC 60321-3 Ed. 1.0

Auxiliary printed board information. Part 3: Guidelines for artwork
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60321-3 Ed. 2.0

Systematic review of IEC 321-3 (1990)
DEL
  • DEL
  • Deleted items
B
IEC 60326-1 Ed. 1.0

Printed boards. Part 1: General information for the specification writer
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60326-2 Ed. 3.0

Printed boards. Part 2: Test methods
WPUB
  • WPUB
  • Publication withdrawn
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-3 Ed. 2.0

Printed boards - Part 3: Design and use of printed boards
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-3 Ed. 3.0

Systematic review of IEC 326-3 (1991)
DEL
  • DEL
  • Deleted items
B
IEC 60326-4 Ed. 1.0

Printed boards. Part 4: Specification for single and double sided printed boards with plain holes
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-4 Ed. 2.0

Systematic review of IEC 326-4 (1980)
DEL
  • DEL
  • Deleted items
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-5 Ed. 1.0

Printed boards. Part 5: Specification for single and double sided printed boards with plated-through holes
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-5 Ed. 2.0

Systematic review of IEC 326-5 (1980)
DEL
  • DEL
  • Deleted items
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-6 Ed. 1.0

Printed boards. Part 6: Specification for multilayer printed boards
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60326-6 am2 Ed. 1.0

Amendment No. 2
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 60326-7 Ed. 1.0

Printed boards. Part 7: Specification for single and double sided flexible printed boards without through connections
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-7 Ed. 2.0

Systematic review of IEC 326-7 (1981)
DEL
  • DEL
  • Deleted items
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-8 Ed. 1.0

Printed boards. Part 8: Specification for single and double sided flexible printed boards with through connections
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-8 Ed. 2.0

Systematic review of IEC 326-8 (1981)
DEL
  • DEL
  • Deleted items
B
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-9 Ed. 1.0

Printed boards - Part 9: Specification for flexible multilayer printed boards with through connections
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-9 Ed. 2.0

Systematic review of IEC 326-9 (1991)
DEL
  • DEL
  • Deleted items
B
IEC 60326-10 Ed. 1.0

Printed boards - Part 10: Specification for flex-rigid double-sided printed boards with through connections
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-10 Ed. 2.0

Systematic review of IEC 326-10 (1991)
DEL
  • DEL
  • Deleted items
B
IEC 60326-11 Ed. 1.0

Printed boards - Part 11: Specification for flex-rigid multilayer printed boards with through connections
WPUB
  • WPUB
  • Publication withdrawn
B
IEC 60326-11 Ed. 2.0

Systematic review of IEC 326-11 (1991)
DEL
  • DEL
  • Deleted items
B
IEC 60326-12 Ed. 1.0

Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards)
WPUB
  • WPUB
  • Publication withdrawn
B52(C.O.)367
IEC 61182-1 Ed. 1.0

Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61182-2 Ed. 1.0

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
PPUB
  • PPUB
  • Publication issued
E2006-03noWebstore
IEC 61182-2-2 Ed. 1.0

Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description
PPUB
  • PPUB
  • Publication issued
B2012-05yesWebstore
IEC 61182-7 Ed. 1.0

Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form
PPUB
  • PPUB
  • Publication issued
ByesWebstore
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61182-10 Ed. 1.0

Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy
PPUB
  • PPUB
  • Publication issued
EWebstore
IEC/PAS 61182-12 Ed. 1.0

Generic requirements for printed board assembly products manufacturing description data and transfer methodology
PPUB
  • PPUB
  • Publication issued
E2014-08Webstore
DEL 61185 am2 f1 Ed. 1.0

Fiducial standard specification
DEL
  • DEL
  • Deleted items
E
IEC 61188-1-1 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61188-1-2 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61188-2 Ed. 1.0

Design and use of printed boards and printed board assemlies - Part 2: Guide to the use of printed wiring board substrate materials - Surface mount technology
DEL
  • DEL
  • Deleted items
Bno
IEC 61188-5 Ed. 1.0

IEC 1188-5 - Design of printed boards and printed boards assemblies - Part 5: Sectional design requirements - Attachment (land/joint) considerations (Revision of IEC 321)
DEL
  • DEL
  • Deleted items
E91(Sec.)59
IEC 61188-5-1 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61188-5-2 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
PPUB
  • PPUB
  • Publication issued
ByesWebstore
DEL 61188-5-3 Ed. 1.0

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (land/joint) considerations - Section 3: Components with Gull-wing leads on two sides
DEL
  • DEL
  • Deleted items
Eyes
IEC 61188-5-3 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
PPUB
  • PPUB
  • Publication issued
B2007-11yesWebstore
IEC 61188-5-3 fF Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
MERGED
  • MERGED
  • Merged project
F2009-08
DEL 61188-5-4 Ed. 1.0

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 4: Components with J leads on two sides
DEL
  • DEL
  • Deleted items
Eyes
IEC 61188-5-4 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
PPUB
  • PPUB
  • Publication issued
B2007-11yesWebstore
IEC 61188-5-4 fF Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
MERGED
  • MERGED
  • Merged project
F2009-10
DEL 61188-5-5 Ed. 1.0

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (land/joint) considerations - Section 5: Components with Gull-wing leads on four sides
DEL
  • DEL
  • Deleted items
Eyes
IEC 61188-5-5 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
PPUB
  • PPUB
  • Publication issued
B2007-11yesWebstore
IEC 61188-5-5 fF Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
MERGED
  • MERGED
  • Merged project
F2009-10
IEC 61188-5-6 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides
PPUB
  • PPUB
  • Publication issued
ByesWebstore
DEL 61188-5-7 Ed. 1.0

Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 7: Components with Post (DIP) mounting leads on two sides
DEL
  • DEL
  • Deleted items
Eyes
IEC 61188-5-8 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
PPUB
  • PPUB
  • Publication issued
B2007-11yesWebstore
IEC 61188-5-8 fF Ed. 1.0

Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA)
MERGED
  • MERGED
  • Merged project
F2010-01
IEC 61188-7 Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
PPUB
  • PPUB
  • Publication issued
B2009-06yesWebstore
IEC 61188-7 fC1 Ed. 1.0

Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
PPUB
  • PPUB
  • Publication issued
EWebstore
IEC 61188-7 fF Ed. 1.0

Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction
MERGED
  • MERGED
  • Merged project
F2009-11
IEC 61188-8-1 Ed. 1.0

Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description
DEL
  • DEL
  • Deleted items
E2010-12
IEC 61189-1 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61189-1 Ed. 1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61189-1 f2 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test N11: Pre-conditioning, 125°C
MERGED
  • MERGED
  • Merged project
Eyes
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61189-2 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
DELPUB
  • DELPUB
  • Deleted Publication
Byes
IEC 61189-2 Ed. 2.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
PPUB
  • PPUB
  • Publication issued
E2006-03yesWebstore
IEC 61189-2 f1 Ed. 1.0

Test Method for Halogen-free Copper-Clad Laminates
MERGED
  • MERGED
  • Merged project
E91/240
DELPUB
  • DELPUB
  • Deleted Publication
Eyes
IEC 61189-2 am1 f16 Ed. 1.0

Test mehods for materials for interconnection structures - Test E14: Arc resistance
MERGED
  • MERGED
  • Merged project
Eyes
IEC 61189-2 am1 f17 Ed. 1.0

Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA
MERGED
  • MERGED
  • Merged project
Eyes
IEC 61189-2 am1 f18 Ed. 1.0

Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards
MERGED
  • MERGED
  • Merged project
Eyes
MERGED 61189-2 am1 Ed. 1.0

Amendment No. 1 to IEC 1189-2 - Tests 2E04, 2E14, 2M25 and 2M27
MERGED
  • MERGED
  • Merged project
Byes
DEL 61189-2 am2 Ed. 1.0

Amendment 2 to IEC 1189-2: Test methods for electrical materials, interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
CAN
  • CAN
  • Draft cancelled
Eyes
IEC 61189-2-628 Ed. 1.0

IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull)
DEL
  • DEL
  • Deleted items
E2012-0391/805
IEC 61189-2-629 Ed. 1.0

Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application
DEL
  • DEL
  • Deleted items
E2015-0391/1000
IEC 61189-2-719 Ed. 1.0

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Test methods for printed board and assembly materials - Relative permittivity and loss tangent (500MHz to 10GHz)
ANW
  • ANW
  • Approved New Work
E2016-0891/1185
IEC 61189-2-719 f1 Ed. 1.0

Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)
DEL
  • DEL
  • Deleted items
E2012-0391/806
IEC 61189-2-720 Ed. 1.0

Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)
DEL
  • DEL
  • Deleted items
E2012-0391/807
IEC 61189-2-721 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-721: Test methods for materials for interconnection structures - Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator
ADIS
  • ADIS
  • Approved for FDIS circulation
B2015-05yes
IEC 61189-3 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
DELPUB
  • DELPUB
  • Deleted Publication
B1997-03yes
IEC 61189-3 Ed. 1.1

Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
DELPUB
  • DELPUB
  • Deleted Publication
B
IEC 61189-3 Ed. 2.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
PPUB
  • PPUB
  • Publication issued
B2007-10yesWebstore
IEC 61189-3 fF Ed. 2.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
MERGED
  • MERGED
  • Merged project
F2012-01
DREJ 61189-3 am1 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test E07: Controlled impedance testing by time domain reflectometry (TDR)
DREJ
  • DREJ
  • Draft rejected
Eyes
IEC 61189-3 am1 Ed. 1.0

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
DELPUB
  • DELPUB
  • Deleted Publication
B1999-07yes
IEC 61189-3 am1 f1 Ed. 1.0

Amendment No. 1 to IEC 1189-3 - Tests 3N01, 3N04 to 3N06, 3N08, 3X07 and 3X10
MERGED
  • MERGED
  • Merged project
Byes
IEC 61189-3 am1 f12 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands
MERGED
  • MERGED
  • Merged project
Eyes
IEC 61189-3 am1 f13 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands
MERGED
  • MERGED
  • Merged project
Eyes
IEC 61189-3 am1 f6 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test N04: Thermal shock , dip soldering
MERGED
  • MERGED
  • Merged project
E
IEC 61189-3 am1 f7 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C
MERGED
  • MERGED
  • Merged project
E
IEC 61189-3 am1 f8 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test N06: Damp heat, steady state
MERGED
  • MERGED
  • Merged project
E
IEC 61189-3 am1 f9 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test N08: Thermal shock, immersion, fluidized sand bath
MERGED
  • MERGED
  • Merged project
Eyes
IEC 61189-3 am1 fF Ed. 1.0

Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)
MERGED
  • MERGED
  • Merged project
B
DEL 61189-3 am2 Ed. 1.0

Amendment 2 to IEC 61189-3: Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures
CAN
  • CAN
  • Draft cancelled
Eyes
IEC 61189-3 am2 f1 Ed. 1.0

Test methods for interconnection structures (printed boards) - Test E08: PTH resistance change, thermal cycling
MERGED
  • MERGED
  • Merged project
E
IEC 61189-3-719 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during thermal cycling
CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote
B2015-10yes
IEC 61189-3-913 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test method for thermal conductivity of electronic circuit board for high-brightness LEDs
3CD
  • 3CD
  • 3rd Committee Draft
E2015-10
IEC/PAS 61189-3-913 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs
PPUB
  • PPUB
  • Publication issued
E2010-12Webstore
DEL 61189-4 f5 Ed. 1.0

Test method of ultrasonic cleaning
DEL
  • DEL
  • Deleted items
E
IEC 61189-5 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
PPUB
  • PPUB
  • Publication issued
B2006-08yesWebstore
IEC 61189-5 fF Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61189-5-1 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5-1 : Test methods for printed board assemblies and materials used in manufacturing electronic assemblies - Guidance Documents and Handbooks
1CD
  • 1CD
  • 1st Committee Draft
E2017-12yes
IEC 61189-5-2 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies: Soldering flux
RDIS
  • RDIS
  • Text for FDIS received and registered
B2015-02yes
IEC 61189-5-3 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies: Soldering paste
RDIS
  • RDIS
  • Text for FDIS received and registered
B2015-02yes
IEC 61189-5-4 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies: Solder alloys and fluxed and non-fluxed solid wire
RDIS
  • RDIS
  • Text for FDIS received and registered
B2015-02yes
IEC 61189-5-5 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 5-5: Test methods for printed board assemblies - Surface insulation resistance (SIR)
AMW
  • AMW
  • Approved Maintenance Work
E2017-12yes91/1021
IEC 61189-6 Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
PPUB
  • PPUB
  • Publication issued
B2006-08yesWebstore
IEC 61189-6 fF Ed. 1.0

Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61189-11 Ed. 1.0

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys
PPUB
  • PPUB
  • Publication issued
B2013-05yesWebstore
IEC 61190-1-1 Ed. 1.0

Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61190-1-2 Ed. 1.0

Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
DELPUB
  • DELPUB
  • Deleted Publication
B2002-04yes
IEC 61190-1-2 Ed. 2.0

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
DELPUB
  • DELPUB
  • Deleted Publication
B2007-04yes
IEC 61190-1-2 Ed. 3.0

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
PPUB
  • PPUB
  • Publication issued
B2014-03yesWebstore
IEC 61190-1-2 fF Ed. 2.0

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61190-1-3 Ed. 1.0

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
DELPUB
  • DELPUB
  • Deleted Publication
B2002-04yes
IEC 61190-1-3 Ed. 2.0

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
PPUB
  • PPUB
  • Publication issued
B2007-06yesWebstore
IEC 61190-1-3 Ed. 2.1

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61190-1-3 fF Ed. 2.0

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61190-1-3 am1 Ed. 2.0

Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
PPUB
  • PPUB
  • Publication issued
B2010-06yesWebstore
IEC 61190-1-6 Ed. 1.0

Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications
CAN
  • CAN
  • Draft cancelled
E2007-0491/378
IEC 61190-1-7 Ed. 1.0

Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly
CAN
  • CAN
  • Draft cancelled
E2007-0491/379
IEC 61191-1 Ed. 1.0

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
DELPUB
  • DELPUB
  • Deleted Publication
B1998-09yes
IEC 61191-1 Ed. 2.0

Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
PPUB
  • PPUB
  • Publication issued
B2013-05yesWebstore
IEC 61191-2 Ed. 1.0

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
DELPUB
  • DELPUB
  • Deleted Publication
B1998-09yes
IEC 61191-2 Ed. 2.0

Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
PPUB
  • PPUB
  • Publication issued
B2013-06yesWebstore
IEC 61191-3 Ed. 1.0

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61191-3 Ed. 2.0

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
AMW
  • AMW
  • Approved Maintenance Work
E2015-06yes91/1074
IEC 61191-4 Ed. 1.0

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61191-4 Ed. 2.0

Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
AMW
  • AMW
  • Approved Maintenance Work
E2015-06yes91/1075
IEC 61191-6 Ed. 1.0

Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method
PPUB
  • PPUB
  • Publication issued
B2010-02yesWebstore
IEC 61192-1 Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 1: General
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61192-2 Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61192-3 Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61192-4 Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61192-5 Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
PPUB
  • PPUB
  • Publication issued
B2007-07yesWebstore
IEC 61192-5 fF Ed. 1.0

Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61192-6 Ed. 1.0

Product performance requirements - Part 6: Guide to the rework of unassembled boards
DEL
  • DEL
  • Deleted items
E91/245
DEL 61193-1 Ed. 1.0

Guidance on the use of IEC/ISO publications and quality assessment systems - Part 1: Guide to the use of the IECQ system for quality assessment fot printed boards and printed board assemblies
CAN
  • CAN
  • Draft cancelled
Eyes
IEC 61193-1 Ed. 1.0

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
MERGED
  • MERGED
  • Merged project
F
CAN 61193-2 Ed. 1.0

Guidance on the use of IEC/ISO publications and quality assessment systems - Part 2: Guide to the implementation of ISO 9000 quality standards within the IECQ system for printed boards and printed board assemblies
CAN
  • CAN
  • Draft cancelled
Byes
DEL 61193-2 Ed. 1.0

Quality Assessment Systems - Part 2: Guide to the selection and use of sampling plans for end-product and in-process auditing
DEL
  • DEL
  • Deleted items
E91/307
IEC 61193-2 Ed. 1.0

Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
PPUB
  • PPUB
  • Publication issued
E2007-09yesWebstore
IEC 61193-3 Ed. 1.0

Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing
PPUB
  • PPUB
  • Publication issued
B2013-02yesWebstore
IEC 61249-2 Ed. 1.0

Generic specification for reinforced base materials, clad and unclad
CAN
  • CAN
  • Draft cancelled
E52/514
IEC 61249-2-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-1 f1 Ed. 1.0

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-1 to (Sub-clause 5.5)
DEL
  • DEL
  • Deleted items
E52/552
IEC 61249-2-1 f3 Ed. 1.0

Requirements for pull-off strength - Revision of Specification 249-2-1
DEL
  • DEL
  • Deleted items
E52/553
IEC 61249-2-2 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-2 f1 Ed. 1.0

Requirements for pull-off strength - Revision of Specification 249-2-2
DEL
  • DEL
  • Deleted items
E52/553
IEC 61249-2-2 f2 Ed. 1.0

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-2 (Sub-clause 5.5)
DEL
  • DEL
  • Deleted items
E52/552
IEC 61249-2-4 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-5 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-6 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-7 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-7 f12 Ed. 1.0

Requirements for punching and machining properties of laminates - Revision of Specification 249-2-7 (Sub-clause 5.5)
DEL
  • DEL
  • Deleted items
E52/552
IEC 61249-2-7 f13 Ed. 1.0

Requirements for surface waviness - Revision of Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/554
IEC 61249-2-7 f14 Ed. 1.0

Laminate construction - Revision of IEC 249-2-7
DEL
  • DEL
  • Deleted items
E52(DE)209
IEC 61249-2-7 f4 Ed. 1.0

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/555
IEC 61249-2-7 f6 Ed. 1.0

Requirements for surface waviness - Revision of Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/554
IEC 61249-2-7 f7 Ed. 1.0

Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/555
IEC 61249-2-7 f8 Ed. 1.0

Requirements for surface waviness - Amendment to Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/554
IEC 61249-2-7 f9 Ed. 1.0

Requirements for glass transition temperature and cure factor - Amendment to Specification 249-2-7
DEL
  • DEL
  • Deleted items
E52/555
IEC 61249-2-8 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-9 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2002-12yesWebstore
IEC 61249-2-9 f5 Ed. 1.0

Requirements for surface waviness - Revision of Specification 249-2-9
DEL
  • DEL
  • Deleted items
E52/554
IEC 61249-2-9 f6 Ed. 1.0

Requirements for pull-off strength - Revision of Specification 249-2-9
DEL
  • DEL
  • Deleted items
E52/553
IEC 61249-2-10 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-11 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-11 f2 Ed. 1.0

Requirements for surface waviness - Amendment to Specification 249-2-11
DEL
  • DEL
  • Deleted items
E52/554
IEC 61249-2-12 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-12 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61249-2-13 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-13 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61249-2-18 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-19 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-21 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-22 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-23 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-26 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-2-27 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2012-11yesWebstore
IEC 61249-2-30 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2012-11yesWebstore
IEC 61249-2-31 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2009-02yesWebstore
IEC 61249-2-32 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2009-02yesWebstore
IEC 61249-2-33 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2009-02yesWebstore
IEC 61249-2-34 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
PPUB
  • PPUB
  • Publication issued
B2009-02yesWebstore
IEC 61249-2-35 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2008-12yesWebstore
IEC 61249-2-36 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2008-12yesWebstore
IEC 61249-2-37 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2008-12yesWebstore
IEC 61249-2-38 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2008-12yesWebstore
IEC 61249-2-39 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2012-11yesWebstore
IEC 61249-2-40 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2012-11yesWebstore
IEC 61249-2-41 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2010-04yesWebstore
IEC 61249-2-42 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2010-04yesWebstore
IEC 61249-2-43 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote
B2015-07yes
IEC 61249-2-44 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
CCDV
  • CCDV
  • Draft circulated as Committee Draft with Vote
B2015-07yes
IEC 61249-2-50 Ed. 3.0

Bow and twist requirements - Amendment to IEC 249-2-1 to 7, 9, 10, 14, 16, 18
MERGED
  • MERGED
  • Merged project
Eyes
IEC/PAS 61249-3-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
PPUB
  • PPUB
  • Publication issued
E2007-05Webstore
IEC/TS 61249-3-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types)
DEL
  • DEL
  • Deleted items
E2011-01yes
IEC 61249-3-3 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-3-3 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61249-3-4 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-3-4 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61249-3-5 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-3-5 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films
PPUB
  • PPUB
  • Publication issued
BWebstore
IEC 61249-4 Ed. 1.0

Sectional specification set for prepreg materials, B-stage, unclad (for use as bonding sheets)
DEL
  • DEL
  • Deleted items
E52/516
DEL 61249-4-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Section 1: Epoxide woven E-glass prepreg of defined flammability (vertical burning test)
DEL
  • DEL
  • Deleted items
Byes
IEC 61249-4-1 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability
PPUB
  • PPUB
  • Publication issued
B2008-02yesWebstore
IEC 61249-4-1 f2 Ed. 1.0

Selection of prepregs for multilayer board construction - Revision of Specification 249-4-1
DEL
  • DEL
  • Deleted items
E52/556
IEC 61249-4-1 f3 Ed. 1.0

Selection of prepregs for multilayer board construction - Revision of Specifiction 249-4-1 (or 326-3)
DEL
  • DEL
  • Deleted items
E52/556
IEC 61249-4-1 f4 Ed. 1.0

Requirements for melting viscosity - Revision to Specification 249-4-1
DEL
  • DEL
  • Deleted items
E52/557
IEC 61249-4-1 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woen E-glass prepreg of defined flammability
MERGED
  • MERGED
  • Merged project
F2009-08
IEC 61249-4-2 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability
PPUB
  • PPUB
  • Publication issued
EyesWebstore
IEC 61249-4-5 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability
PPUB
  • PPUB
  • Publication issued
EyesWebstore
IEC 61249-4-11 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-4-12 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-4-14 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2009-06yesWebstore
IEC 61249-4-14 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
MERGED
  • MERGED
  • Merged project
F2009-10
IEC 61249-4-15 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2009-06yesWebstore
IEC 61249-4-15 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
MERGED
  • MERGED
  • Merged project
F2009-10
IEC 61249-4-16 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2009-06yesWebstore
IEC 61249-4-16 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
MERGED
  • MERGED
  • Merged project
F2009-10
IEC 61249-4-17 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2009-06yesWebstore
IEC 61249-4-17 fF Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
MERGED
  • MERGED
  • Merged project
F2009-10
IEC 61249-4-18 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2013-10yesWebstore
IEC 61249-4-19 Ed. 1.0

Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
PPUB
  • PPUB
  • Publication issued
B2013-10yesWebstore
IEC 61249-5-1 Ed. 1.0

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials)
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-5-4 Ed. 1.0

Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks
PPUB
  • PPUB
  • Publication issued
ByesWebstore
DEL 61249-6-3 Ed. 1.0

IEC 1249-6-3: Material for interconnection structures - Part 6: Sectional specification set for reinforcement materials - Section 3: Woven E-glass
DEL
  • DEL
  • Deleted items
Eyes52/558
IEC 61249-6-3 Ed. 1.0

Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics
PWI
  • PWI
  • Potential new work item
E2008-01yes
IEC/PAS 61249-6-3 Ed. 1.0

Specification for finished fabric woven from "E" glass for printed boards
PPUB
  • PPUB
  • Publication issued
E2011-07Webstore
IEC 61249-7-1 Ed. 1.0

Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC/PAS 61249-8-1 Ed. 1.0

Qualification and performance of electrical insulating compound for printed wiring assemblies
PPUB
  • PPUB
  • Publication issued
E2014-09Webstore
IEC/PAS 61249-8-5 Ed. 1.0

Qualification and performance specification of permanent solder mask and flexible cover materials
PPUB
  • PPUB
  • Publication issued
E2014-09Webstore
IEC 61249-8-7 Ed. 1.0

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61249-8-8 Ed. 1.0

Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 8: Temporary polymer coatings
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 61445 Ed. 1.0

Digital Test Interchange Format (DTIF)
PPUB
  • PPUB
  • Publication issued
E2012-05noWebstore
IEC 61523-1 Ed. 1.0

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems
DELPUB
  • DELPUB
  • Deleted Publication
E2001-10yes
IEC 61523-1 Ed. 2.0

Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems
PPUB
  • PPUB
  • Publication issued
E2012-07noWebstore
IEC 61523-2 Ed. 1.0

Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries
WPUB
  • WPUB
  • Publication withdrawn
E2002-05yes
IEC 61523-3 Ed. 1.0

Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process
PPUB
  • PPUB
  • Publication issued
EWebstore
IEC 61671 Ed. 1.0

Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML
PPUB
  • PPUB
  • Publication issued
E2012-06noWebstore
IEC 61690-1 Ed. 1.0

Electronic design interchange format (EDIF) - Part 1: Version 3 0 0
PPUB
  • PPUB
  • Publication issued
EyesWebstore
MERGED
  • MERGED
  • Merged project
F2014-02
IEC 61690-2 Ed. 1.0

Electronic design interchange format (EDIF) - Part 2: Version 4 0 0
PPUB
  • PPUB
  • Publication issued
ByesWebstore
MERGED
  • MERGED
  • Merged project
F2014-02
IEC 61691-1 Ed. 1.0

Design automation - Part 1: VHDL language reference manual
WPUB
  • WPUB
  • Publication withdrawn
Eyes
IEC 61691-1 Ed. 2.0

Electronic design automation - Part 1: VHSIC Hardware description language VHDL 1076a
DEL
  • DEL
  • Deleted items
E93/22
IEC 61691-1-1 Ed. 1.0

Behavioural languages - Part 1-1: VHDL language reference manual
DELPUB
  • DELPUB
  • Deleted Publication
E2004-0693/193
IEC 61691-1-1 Ed. 2.0

Behavioural languages - Part 1-1: VHDL Language Reference Manual
PPUB
  • PPUB
  • Publication issued
EnoWebstore
IEC 61691-2 Ed. 1.0

Behavioural languages - Part 2: VHDL multilogic system for model interoperability
WPUB
  • WPUB
  • Publication withdrawn
E1996-12yes
IEC 61691-3-1 Ed. 1.0

Electronic design automation - Part 3-1: Extensions to and supplementary packages for the VHSIC Hardware Description Language VHDL 1076-1993 - Analog description in VHDL (P1076.1)
DEL
  • DEL
  • Deleted items
E93/23
IEC 61691-3-2 Ed. 1.0

Behavioural languages - Part 3-2: Mathematical operation in VHDL
WPUB
  • WPUB
  • Publication withdrawn
E2001-06yes
IEC 61691-3-3 Ed. 1.0

Behavioural languages - Part 3-3: Synthesis in VHDL
WPUB
  • WPUB
  • Publication withdrawn
E2001-06yes
IEC 61691-4 Ed. 1.0

Behavioural languages - Part 4: Verilog® hardware description language
WPUB
  • WPUB
  • Publication withdrawn
E2004-0693/192
DEL/TR 61691-5 Ed. 1.0

Electronic desing automation - Part 5: Library utilities for VHDL
DEL
  • DEL
  • Deleted items
E93/23
IEC 61691-5 Ed. 1.0

Behavioural languages - Part 5: VITAL ASIC (application specific integrated circuit) modeling specification
WPUB
  • WPUB
  • Publication withdrawn
E93/194
IEC 61691-6 Ed. 1.0

Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions
PPUB
  • PPUB
  • Publication issued
E2009-11noWebstore
IEC 61691-6-1 Ed. 1.0

Standard VHDL analog and mixed-signal extensions - Packages for multiple energy domain support (IEEE 1076.1.1-2004)
CAN
  • CAN
  • Draft cancelled
E2009-09no93/278
IEC 61691-7 Ed. 1.0

Behavioural languages - Part 7: SystemC R Language Reference Manual
PPUB
  • PPUB
  • Publication issued
E2009-11noWebstore
IEC 61692-1 Ed. 1.0

Common rules for circulation of electronic catalogue data - Part 1: Extended mapping rules and methods
DEL
  • DEL
  • Deleted items
E1995-1293/282
IEC 61693-1 Ed. 1.0

Guidelines for test, validation, conformance and qualification for standards
DEL
  • DEL
  • Deleted items
E93(US)2
IEC 61760-1 Ed. 1.0

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
DELPUB
  • DELPUB
  • Deleted Publication
Byes
IEC 61760-1 Ed. 2.0

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
PPUB
  • PPUB
  • Publication issued
B2006-05yesWebstore
IEC 61760-1 fF Ed. 2.0

Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
MERGED
  • MERGED
  • Merged project
F2013-09
IEC 61760-2 Ed. 1.0

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
DELPUB
  • DELPUB
  • Deleted Publication
B1998-03yes
IEC 61760-2 Ed. 2.0

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
PPUB
  • PPUB
  • Publication issued
B2007-03yesWebstore
IEC 61760-2 fF Ed. 2.0

Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 61760-3 Ed. 1.0

Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering
PPUB
  • PPUB
  • Publication issued
B2010-03yesWebstore
IEC 61760-4 Ed. 1.0

Surface mounting technology - Part 4: Standard method for classification, packaging, labelling and handling of moisture sensitive devices
ADIS
  • ADIS
  • Approved for FDIS circulation
B2015-04yes
IEC 61761 Ed. 1.0

Generic specification - Capability approval for surface mount technologies
DEL
  • DEL
  • Deleted items
E
IEC 61768 Ed. 1.0

Solderability tests for component leads, terminations, lugs, terminals and wires
DEL
  • DEL
  • Deleted items
E91(Sec.)10
DEL 61907 Ed. 1.0

Technical Report on SystemVerilog
DEL
  • DEL
  • Deleted items
E93/163
IEC/TR 61908 Ed. 1.0

The technology roadmap for industry data dictionary structure, utilization and implementation
PPUB
  • PPUB
  • Publication issued
EnoWebstore
DEL 61910 Ed. 1.0

Interoperability Verilog and VHDL (Technical report)
DEL
  • DEL
  • Deleted items
E93/167
IEC 61926-1 Ed. 1.0

Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)
PPUB
  • PPUB
  • Publication issued
EyesWebstore
IEC/TR 61926-1-1 Ed. 1.0

Design automation - Part 1-1: Harmonization of ATLAS test languages
PPUB
  • PPUB
  • Publication issued
EWebstore
IEC 61926-2 Ed. 1.0

IEC 61926-2 Standard Test Languages; Part 2; Test Language for All Systems Requirements
CAN
  • CAN
  • Draft cancelled
E93/166
IEC 62014-1 Ed. 1.0

Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2)
PPUB
  • PPUB
  • Publication issued
EyesWebstore
IEC/TR 62014-3 Ed. 1.0

Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation
PPUB
  • PPUB
  • Publication issued
EnoWebstore
IEC/TR 62014-4 Ed. 1.0

Cookbook for integrated Circuit model IECM described in IEC 62014-3
CAN
  • CAN
  • Draft cancelled
Eno93/155
IEC 62015-1 Ed. 1.0

Design automation - Chip Hierarchical Design Systems Technical Data (CHDStd)
DEL
  • DEL
  • Deleted items
E93/49
IEC 62015-2 Ed. 1.0

Advanced intermediate representation with extensibility/common environment (AIRE/CE)
DEL
  • DEL
  • Deleted items
E93/72
IEC 62016 Ed. 1.0

Core model of the electronics domain
WPUB
  • WPUB
  • Publication withdrawn
E1997-12yes
IEC/TR 62017-1 Ed. 1.0

Documentation on design automation subjects - Part 1: EDA industry standards roadmap
WPUB
  • WPUB
  • Publication withdrawn
E2002-04
IEC/TR 62017-2 Ed. 1.0

Documentation on design automation subjects - Part 2: EIAJ-EDA Technology Roadmap toward 2002
WPUB
  • WPUB
  • Publication withdrawn
E2001-0293/115
IEC 62050 Ed. 1.0

VHDL Register Transfer Level (RTL) synthesis
WPUB
  • WPUB
  • Publication withdrawn
Eno
IEC 62084 Ed. 1.0

Implementation of flip chip and chip scale technology
DEL
  • DEL
  • Deleted items
E91/139
IEC/PAS 62084 Ed. 1.0

Implementation of flip chip and chip scale technology
WPUB
  • WPUB
  • Publication withdrawn
E91/139
IEC 62085 Ed. 1.0

Implementation of ball grid array and other high density technology
DEL
  • DEL
  • Deleted items
E91/140
IEC/PAS 62085 Ed. 1.0

Implementation of ball grid array and other high density technology
WPUB
  • WPUB
  • Publication withdrawn
E91/140
IEC 62090 Ed. 1.0

Product package labels for electronic components using bar code and two-dimensional symbologies
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 62119 Ed. 1.0

Generic requirements for implementation of product manufacturing description data and transfer methodology
DEL
  • DEL
  • Deleted items
E52/827
IEC/PAS 62119 Ed. 1.0

Generic requirements for implementation of product manufacturing description data and transfer methodology
WPUB
  • WPUB
  • Publication withdrawn
E52/827
IEC 62123 Ed. 1.0

Performance guide Manual for single and double-sided flexible printed wiring boards
DEL
  • DEL
  • Deleted items
E52/809
IEC/PAS 62123 Ed. 1.0

Performance guide Manual for single- and double-sided flexible printed wiring boards
WPUB
  • WPUB
  • Publication withdrawn
E52/809
IEC 62137 Ed. 1.0

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 62137 fC1 Ed. 1.0

Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
PPUB
  • PPUB
  • Publication issued
EWebstore
IEC 62137 ff Ed. 1.0

Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
MERGED
  • MERGED
  • Merged project
B
IEC 62137-1-1 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
PPUB
  • PPUB
  • Publication issued
B2007-08yesWebstore
IEC 62137-1-1 fF Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 62137-1-2 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
PPUB
  • PPUB
  • Publication issued
B2007-08yesWebstore
IEC 62137-1-2 fF Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test
MERGED
  • MERGED
  • Merged project
B2008-05
IEC 62137-1-3 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test
PPUB
  • PPUB
  • Publication issued
B2008-12yesWebstore
IEC 62137-1-4 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test
PPUB
  • PPUB
  • Publication issued
B2009-01yesWebstore
IEC 62137-1-5 Ed. 1.0

Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test
PPUB
  • PPUB
  • Publication issued
B2009-02yesWebstore
IEC 62137-3 Ed. 1.0

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
PPUB
  • PPUB
  • Publication issued
B2011-10yesWebstore
IEC/PAS 62137-3 Ed. 1.0

Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints
DELPUB
  • DELPUB
  • Deleted Publication
E2009-0491/784
IEC 62137-4 Ed. 1.0

Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices
BPUB
  • BPUB
  • Publication being printed
B2014-10yes
IEC 62142 Ed. 1.0

Verilog (R) register transfer level synthesis
WPUB
  • WPUB
  • Publication withdrawn
Eno93/213
IEC 62158 Ed. 1.0

Printed board manufacturers' qualification profile (MQP)
DEL
  • DEL
  • Deleted items
E52/841
IEC/PAS 62158 Ed. 1.0

Printed Board Manufacturers' Qualification Profile (MQP)
WPUB
  • WPUB
  • Publication withdrawn
E52/841
IEC 62159 Ed. 1.0

Electronic assembly manufacturers' qualification profile (AQP)
DEL
  • DEL
  • Deleted items
E52/842
IEC/PAS 62159 Ed. 1.0

Electronic Assembly Manufacturers' Qualification Profile (AQP)
WPUB
  • WPUB
  • Publication withdrawn
E52/842
IEC 62160 Ed. 1.0

Laminator qualification profile
DEL
  • DEL
  • Deleted items
E52/843
IEC/PAS 62160 Ed. 1.0

Laminator Qualification Profile
WPUB
  • WPUB
  • Publication withdrawn
E52/843
IEC 62212 Ed. 1.0

IPC-4130 - Specification and characterization methods for nonwoven "E" glass mat
DEL
  • DEL
  • Deleted items
E52/870
IEC/PAS 62212 Ed. 1.0

Specification and characterization methods for nonwoven "E" glass mat
WPUB
  • WPUB
  • Publication withdrawn
E52/870
IEC 62213 Ed. 1.0

IPC-4411 - Specification and characterization methods for nonwoven para-aramid reinforcement
DEL
  • DEL
  • Deleted items
E52/871
IEC/PAS 62213 Ed. 1.0

Specification and characterization methods for nonwoven para-aramid reinforcement
WPUB
  • WPUB
  • Publication withdrawn
E52/871
IEC 62214 Ed. 1.0

IPC-6011 - Generic performance specification for printed boards
DEL
  • DEL
  • Deleted items
E52/872
IEC/PAS 62214 Ed. 1.0

Generic performance specification for printed boards
WPUB
  • WPUB
  • Publication withdrawn
E52/872
IEC 62218 Ed. 1.0

Surface Insulation Resistance (SIR) - Test method for Assembled Printed Wiring Boards (PWB) - Test 5E02
DEL
  • DEL
  • Deleted items
E
IEC 62243 Ed. 1.0

Artificial intelligence exchange and service tie to all test environments (Al-ESTATE)
DELPUB
  • DELPUB
  • Deleted Publication
E2005-05no93/214
IEC 62243 Ed. 2.0

Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
PPUB
  • PPUB
  • Publication issued
E2012-05noWebstore
IEC/TR 62248 Ed. 1.0

Approaches to conformance and certification testing for automation standards
WPUB
  • WPUB
  • Publication withdrawn
E2002-12no
IEC 62249 Ed. 1.0

Qualification and performance specification for flexible printed boards (IPC-6013 with Amendment 1)
DEL
  • DEL
  • Deleted items
E91/209
IEC/PAS 62249 Ed. 1.0

Qualification and performance specification for flexible printed boards
WPUB
  • WPUB
  • Publication withdrawn
E91/209
IEC 62250 Ed. 1.0

Qualification and performance specification for rigid printed boards (IPC-6012A with Amendment 1)
DEL
  • DEL
  • Deleted items
E91/210
IEC/PAS 62250 Ed. 1.0

Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1)
WPUB
  • WPUB
  • Publication withdrawn
E91/210
IEC 62265 Ed. 1.0

Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells and blocks
WPUB
  • WPUB
  • Publication withdrawn
Eno93/215
IEC 62293 Ed. 1.0

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
DEL
  • DEL
  • Deleted items
E91/248
IEC/PAS 62293 Ed. 1.0

Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016)
WPUB
  • WPUB
  • Publication withdrawn
E91/248
IEC 62326-1 Ed. 1.0

Printed boards - Part 1: Generic specification
DELPUB
  • DELPUB
  • Deleted Publication
Byes
IEC 62326-1 Ed. 2.0

Printed boards - Part 1: Generic specification
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 62326-2 Ed. 1.0

Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections - Sectional specification
DEL
  • DEL
  • Deleted items
Eyes
IEC 62326-2 f1 Ed. 1.0

Additions to IEC 326-2: Ionic surface contamination test
DEL
  • DEL
  • Deleted items
E52(Sec.)329
IEC 62326-2 f2 Ed. 1.0

Solderability test for printed boards - Updating 4 tests already existing in IEC 326-2
DEL
  • DEL
  • Deleted items
E52(US)127
IEC 62326-2 f3 Ed. 1.0

Addition to IEC 326-2 - Test 14b: Solderability, wetting balance method
DEL
  • DEL
  • Deleted items
E52(Sec.)310
IEC 62326-2-1 Ed. 1.0

Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections - Section 1: Capability detail specification - Performance level A, B and C
DEL
  • DEL
  • Deleted items
Eyes52/675
DEL 62326-3 Ed. 1.0

Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Sectional specification
DEL
  • DEL
  • Deleted items
Eyes
IEC 62326-3 Ed. 1.0

Printed Boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (performance for capability approval)
DEL
  • DEL
  • Deleted items
E2006-09yes
DEL 62326-3-1 Ed. 1.0

Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C
DEL
  • DEL
  • Deleted items
Eyes52/677
IEC 62326-4 Ed. 1.0

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 62326-4-1 Ed. 1.0

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability detail specification: Performance levels A, B and C
PPUB
  • PPUB
  • Publication issued
ByesWebstore
IEC 62326-7 Ed. 1.0

Sectional specification for IECQ
DEL
  • DEL
  • Deleted items
E
IEC/PAS 62326-7-1 Ed. 1.0

Performance guide for single- and double-sided flexible printed wiring boards
PPUB
  • PPUB
  • Publication issued
E2007-05Webstore
IEC/TS 62326-7-1 Ed. 1.0

Printed boards - Part 7-1: Performance guide for single-and double-sided flexible printed boards
DEL
  • DEL
  • Deleted items
E2011-01yes
IEC 62326-8 Ed. 1.0

Sectional specification for IECQ
DEL
  • DEL
  • Deleted items
E
IEC 62326-14 Ed. 1.0

IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide
DEL
  • DEL
  • Deleted items
E2012-1291/894A
IEC/PAS 62326-14 Ed. 1.0

Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
PPUB
  • PPUB
  • Publication issued
E2010-07Webstore
IEC 62326-20 Ed. 1.0

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
3CD
  • 3CD
  • 3rd Committee Draft
E2015-10
IEC/PAS 62326-20 Ed. 1.0

Printed boards - Part 20: Electronic circuit board for high-brightness LEDs
PPUB
  • PPUB
  • Publication issued
E2010-12Webstore
DEL 62362 Ed. 1.0

A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells, and blocks
DEL
  • DEL
  • Deleted items
E93/162
DEL 62399 Ed. 1.0

Test Plan for Validation of ALF using XML
DEL
  • DEL
  • Deleted items
E93/169
IEC 62421 Ed. 1.0

Electronics assembly technology - Electronic modules
PPUB
  • PPUB
  • Publication issued
B2007-09yesWebstore
IEC 62421 fF Ed. 1.0

Electronics assembly technology - Electronic modules
MERGED
  • MERGED
  • Merged project
F2013-12
IEC 62468 Ed. 1.0

The marking for presence and absence of the specified chemical substance in materials, components and mounted boards used in electrical and electronic equipment
CAN
  • CAN
  • Draft cancelled
E2008-02yes
IEC 62525 Ed. 1.0

Standard Test Interface Language (STIL) for Digital Test Vector Data
PPUB
  • PPUB
  • Publication issued
E2007-09Webstore
IEC 62526 Ed. 1.0

Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
PPUB
  • PPUB
  • Publication issued
E2007-09Webstore
IEC 62527 Ed. 1.0

Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification
PPUB
  • PPUB
  • Publication issued
E2007-09Webstore
IEC 62528 Ed. 1.0

Standard Testability Method for Embedded Core-based Integrated Circuits
PPUB
  • PPUB
  • Publication issued
E2007-09Webstore
IEC 62529 Ed. 1.0

Standard for Signal and Test Definition
DELPUB
  • DELPUB
  • Deleted Publication
E2007-1093/251
IEC 62529 Ed. 2.0

Standard for Signal and Test Definition
PPUB
  • PPUB
  • Publication issued
E2012-06noWebstore
IEC 62530 Ed. 1.0

Standard for SystemVerilog - Unified Hardware Design, Specification, and Verification Language
DELPUB
  • DELPUB
  • Deleted Publication
E2007-1093/252
IEC 62530 Ed. 2.0

SystemVerilog - Unified Hardware Design, Specification, and Verification Language
PPUB
  • PPUB
  • Publication issued
EnoWebstore
IEC 62531 Ed. 1.0

Standard for Property Specification Language (PSL)
DELPUB
  • DELPUB
  • Deleted Publication
E2007-1093/253
IEC 62531 Ed. 2.0

Property Specification Language (PSL)
PPUB
  • PPUB
  • Publication issued
E2012-05noWebstore
IEC 62588 Ed. 1.0

Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes
DEL
  • DEL
  • Deleted items
B2013-11yes
IEC/PAS 62588 Ed. 1.0

Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes
PPUB
  • PPUB
  • Publication issued
E2009-02Webstore
IEC 62699 Ed. 1.0

Mapping rules and exchange methods for heterogeneous parts libraries
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
B2014-12no
IEC/TR 62699-1 Ed. 1.0

Mapping rules and exchanges methods for heterogeneous electronic parts libraries - Building an integrated search system
APUB
  • APUB
  • Draft approved for publication
B2015-03no91/1187
IEC 62739-1 Ed. 1.0

Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing
PPUB
  • PPUB
  • Publication issued
B2013-06yesWebstore
IEC 62739-2 Ed. 1.0

Test method for erosion of wave soldering equipment using molten lead free solder alloy - Part 2: Erosion test method for metal materials with surface processing
ANW
  • ANW
  • Approved New Work
E2016-0691/1139
IEC/TR 62856 Ed. 1.0

Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL)
PPUB
  • PPUB
  • Publication issued
B2013-08noWebstore
IEC/TR 62866 Ed. 1.0

Electrochemical migration in printed wiring boards and assemblies - Mechanisms and testing
PPUB
  • PPUB
  • Publication issued
B2014-05noWebstore
IEC 62878-1 Ed. 1.0

Device embedded substrate - Part 1: Generic specification
DEL
  • DEL
  • Deleted items
E
IEC 62878-1-1 Ed. 1.0

Device embedded substrate - Part 1-1: Generic specification - Test method
ADIS
  • ADIS
  • Approved for FDIS circulation
B2014-11yes
IEC/TS 62878-2-1 Ed. 1.0

Device embedded substrate - Part 2-1: Guidelines - General description of technology
APUB
  • APUB
  • Draft approved for publication
B2015-03no
IEC/TR 62878-2-2 Ed. 1.0

Device embedded substrate - Part 2-2: Guidelines - Electrical testing
ACDV
  • ACDV
  • Draft approved for Committee Draft with Vote
E2015-02no
IEC/TS 62878-2-3 Ed. 1.0

Device embedded substrate - Part 2-3: Guidelines - Design Guide
APUB
  • APUB
  • Draft approved for publication
B2015-03no
IEC/TS 62878-2-4 Ed. 1.0

Device embedded substrate - Part 2-4: Guidelines - Test element groups (TEG)
APUB
  • APUB
  • Draft approved for publication
B2015-03no