International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
TC 91 Project files
 Project Reference |  Current Stage | Language | Frcst Date | CLC | Document Reference | Downloads |
|---|---|---|---|---|---|---|
PNW 52-605 Ed. 1.0Revision of IEC 410 | DEL
| E | 52/605 | |||
PNW 52-609 Ed. 1.0Amendment to IEC 249-1 (1982) - Sub-clause 3.8.1 | DEL
| E | 52/609 | |||
PNW 52-685 Ed. 1.0New specification IEC 2326-XX: Specification for appearance of
surfaces of flexible printed boards
| DEL
| E | 52/685 | |||
PNW 52-725 Ed. 1.0Specification for appearances of surfaces of flexible printed
boards
| DEL
| E | 52/725 | |||
PNW 52-727 Ed. 1.0Process assessment schedule for mass lamination panels | DEL
| E | 52/727 | |||
PNW 52-728 Ed. 1.0Technology approval schedule for printed boards | DEL
| E | 52/728 | |||
PNW 52-729 Ed. 1.0Base material for printed boards | DEL
| E | 52/729 | |||
PNW 52-730 Ed. 1.0Process assessment schedule for printed board design facilities | DEL
| E | 52/730 | |||
PNW 52-756 Ed. 1.0Generic computer aided manufacturing format (GenCAM) | DEL
| E | 52/756 | |||
PWI 52-807 Ed. 1.0IEC 61249-1: Materials for interconnecting structures - Part 1: Generic specification
| DEL
| E | 52/807 | |||
PNW 91-14-1 Ed. 1.0Revision of IEC 326-3 - New IEC 1188-2: Design and use requirements of printed boards and printed board assemblies - Part 2: Sectional design and use requirements - Engineering considerations. considerations | DEL
| E | 91/64 | |||
PNW 91-15-1 Ed. 1.0New Standard IEC 1193: Guidance on the use of IEC and ISO publications and quality assessment systems for printed boards and printed board assemblies | DEL
| E | 91/65 | |||
PNW 91-405 Ed. 1.0IEC 61249-1-1: Materials for printed boards and other interconnection structures - Part 1-1: Safety certification of base materials for rigid printed circuit boards | DEL
| E | 91/405 | |||
PNW 91-407 Ed. 1.0IEC 61188-5-7 Design and use of printed boards and printed board assemblies - Part 5-7: Sectional requirements attachment (land/joint) considerations - components with post mounting leads on two sides (dips) | DEL
| E | 91/407 | |||
PNW 91-432 Ed. 1.0IEC xxx-xx: Test methods for lead-free solders - Part 1: Measurement of melting temperature ranges | DEL
| E | 91/432 | |||
PNW 91-433 Ed. 1.0IEC xxx-xx: Test methods for lead-free solder - Part 2: Testing of mechanical characteristics | DEL
| E | 91/433 | |||
PNW 91-469 Ed. 1.0Specification for Flexible Optical Board using Glass Fibre and its test methods | DEL
| E | 91/469 | |||
PNW 91-470 Ed. 1.0Specification for rigid optical board using planar waveguide and its test methods | DEL
| E | 91/470 | |||
PNW 91-471 Ed. 1.0Specification for optical board connector type SF using glass fibre | DEL
| E | 91/471 | |||
PNW 91-476 Ed. 1.0Marking, Symbols and Labels for Identification of Lead-Free and Other Reportable Materials in Lead-Free Assemblies, Components and Devices | DEL
| E | 91/476 | |||
PNW 91-486 Ed. 1.0Detail Specification for Right-angled Optical Board Connector using Glass Fibers | DEL
| E | 91/486 | |||
PNW 91-563 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | DEL
| E | 91/563 | |||
PNW 91-592 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly | DEL
| E | 91/592 | |||
PNW 91-594 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly | DEL
| E | 91/594 | |||
PNW 91-595 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability for lead-free compatible assembly | DEL
| E | 91/595 | |||
PNW 91-596 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-36: Sectional specification set for reinforced based materials, clad and unclad - Epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly | DEL
| E | 91/596 | |||
PNW 91-597 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-37: Sectional specification set for reinforced based materials, clad and unclad - Multi-functional, non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly | DEL
| E | 91/597 | |||
PNW 91-598 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-38: Sectional specification set for reinforced based materials, clad and unclad - Non-halogenated epoxide woven glass fabric copper-clad sheet of defined flammability for lead-free assembly | DEL
| E | 91/598 | |||
PNW 91-902 Ed. 1.0Future IEC 61189-12: Test methods for electrical materials, interconnection structures and assemblies, Part-12 Erosion test method on the materials of solder bath or parts which contact with molten lead free solder. | DEL
| E | 91/902A | |||
PNW 91-1035 Ed. 1.0Future IEC 61189-3-720: Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-720: Electrochemical migration test method | PNW
| E | 91/1035 | |||
PNW 91-1054 Ed. 1.0Future IEC 61249-2-43: Materials for printed boards and other interconnecting structures - Part 2-43: Reinforced base materials clad and unclad - Non-halogen epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PNW
| E | 91/1054 | |||
PNW 91-1055 Ed. 1.0IEC 61249-44 Ed. 1: Materials for printed boards and other interconnecting structures - Part 2-44: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PNW
| E | 91/1055 | |||
PNW 91-1073 Ed. 1.0Measurement of Relative Permittivity and Loss Tangent for Copper Clad Laminate at Microwave Frequency Using Split Post Dielectric Resonator | PNW
| E | 91/1073 | |||
DEL 93-2 Ed. 1.0Library standard architecture (future IEC 62014-2) (TR) | DEL
| E | ||||
DEL 93-3 Ed. 1.0Test information flow through the product life cycle (TR) | DEL
| E | ||||
DEL 93-4 Ed. 1.0Models of integrated circuits for EMI behavioural simulation (future IEC 62014-3) | MERGED
| E | ||||
DEL 93-4 f1 Ed. 1.0Terminology and taxonomy for eletronic design automation | DEL
| E | ||||
DEL 93-5 Ed. 1.0Library utilities for VHDL (TR) | DEL
| E | ||||
PWI 93-7 Ed. 1.0Libraries of reusable parts for electrotechnical products | DEL
| E | 93/73 | |||
DEL 93-9 Ed. 1.0AI Estate - Overview and Architecture (Fast Track request expected from USNC) | DEL
| E | ||||
DEL 93-10 Ed. 1.0AI Estate - Data and Knowledge (Fast track request expected from USNC) | DEL
| E | ||||
DEL 93-11 Ed. 1.0AI Estate - Service specification (Fast track request expected from USNC) | DEL
| E | ||||
PNW 93-31 Ed. 1.0Electronic design automation - Verilog 1364 - The verilog hardware description language (HDL) reference manual | DEL
| E | 93/31 | |||
PNW 93-39 Ed. 1.0Libraries of reusable parts for electrotechnical products: Development of models for CAD tools | DEL
| E | 93/39 | |||
PNW 93-40 Ed. 1.0Libraries of reusable parts for electrotechnical products: Component information representation | DEL
| E | 93/40 | |||
PNW 93-41 Ed. 1.0Libraries of reusable parts for electrotechnical products:
Library organisation
| DEL
| E | 93/41 | |||
PNW 93-60 Ed. 1.0IBIS models and EMC simulation
| DEL
| E | 93/60 | |||
PNW 93-80 Ed. 1.0Electronic CAD to CAM exchange | DEL
| E | 93/80 | |||
PNW 93-127 Ed. 1.0Standard Hardware Description Language Based on the Verilog Hardware Description Language | DEL
| E | 93/127 | |||
PNW 93-128 Ed. 1.0Standard for Standard Delay Format (SDF) for the Electronic Design Process | DEL
| E | 93/128 | |||
DEL 93-204 Ed. 1.0Interoperability of Formats and Schemas used for Electronic Assembly Material Declaration | DEL
| E | 93/204 | |||
DEL 93-209 Ed. 1.0Generic Requirements for Electronics Manufacturing Supply Chain Communication - Product Data eXchange (PDX) | DEL
| E | 93/209 | |||
PNW 93-283 Ed. 1.0IEC 61692-2 Ed 1.0: Common rules for circulation of electronic catalogue data - Part 2: Common exchange rules and Interoperability system (IOS) | DEL
| E | 2010-12 | 93/283 | ||
DEL 60068-2-20 Ed. 5.0Systematic review of IEC 68-2-20 (1979) | DEL
| B | ||||
IEC 60068-2-20 Ed. 4.0Environmental testing. Part 2-20: Tests. Test T: Soldering | DELPUB
| B | ||||
IEC 60068-2-20 Ed. 5.0Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads | PPUB
| B | 2008-07 | yes | Webstore | |
IEC 60068-2-20 fF Ed. 5.0Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads | MERGED
| F | 2009-08 | |||
IEC 60068-2-20 am2 Ed. 4.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60068-2-21 Ed. 4.0Environmental testing. Part 2-21: Tests. Test U: Robustness of
terminations and integral mounting devices
| DELPUB
| B | ||||
IEC 60068-2-21 Ed. 5.0Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
| DELPUB
| B | yes | |||
IEC 60068-2-21 Ed. 6.0Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices | PPUB
| B | 2006-06 | yes | Webstore | |
IEC 60068-2-21 fC1 Ed. 6.0Corrigendum 1 - Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices | PPUB
| B | Webstore | |||
IEC 60068-2-21 fF Ed. 5.0Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices | MERGED
| B | ||||
IEC 60068-2-21 fF Ed. 6.0Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices | MERGED
| F | 2011-08 | |||
IEC 60068-2-21 am2 Ed. 4.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60068-2-21 am3 Ed. 4.0Amendment No. 3 | DELPUB
| B | 50(C.O.)243 | |||
IEC 60068-2-44 Ed. 1.0Environmental testing. Part 2-44: Tests. Guidance on Test T: Soldering | DELPUB
| B | ||||
IEC 60068-2-44 Ed. 2.0Environmental testing - Part 2-44: Tests - Guidance on test T: Soldering | PPUB
| B | yes | Webstore | ||
DEL 60068-2-54 Ed. 2.0Systematic review of IEC 68-2-54 (1985) | DEL
| B | ||||
IEC 60068-2-54 Ed. 1.0Environmental testing. Part 2-54: Tests. Test Ta: Soldering - Solderability testing by the wetting balance method | DELPUB
| B | ||||
IEC 60068-2-54 Ed. 2.0Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method | PPUB
| E | 2006-05 | yes | Webstore | |
IEC 60068-2-58 Ed. 1.0Environmental testing. Part 2-58: Tests. Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD) | DELPUB
| B | ||||
IEC 60068-2-58 Ed. 2.0Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
| DELPUB
| E | yes | |||
IEC 60068-2-58 Ed. 3.0Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | PPUB
| B | yes | Webstore | ||
IEC 60068-2-58 Ed. 4.0ENVIRONMENTAL TESTING - Part 2-58: Tests - Test Td- Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)) | 3CD
| B | 2013-03 | yes | ||
IEC 60068-2-58 fF Ed. 3.0Environmental testing - Part 2-58: Tests - Test Td: Test methods
for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD) | MERGED
| B | ||||
IEC 60068-2-69 Ed. 1.0Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method | DELPUB
| B | 1995-12 | yes | ||
IEC 60068-2-69 Ed. 2.0Environmental testing - Part 2-69: Tests - Test Te: Solderability
testing of electronic components for surface mounting devices
(SMD) by the wetting balance method
| PPUB
| B | 2007-06 | yes | Webstore | |
IEC 60068-2-69 Ed. 3.0Environmental testing - Part 2-69: Tests - Test Te: Solderability testing of electronics components for surface mounting devices (SMD) by the wetting balance method
| AMW
| E | 2014-02 | yes | 91/1026 | |
IEC 60068-2-69 fF Ed. 2.0Environmental testing - Part 2-69: Tests - Test Te: Solderability
testing of electronic components for surface mounting devices
(SMD) by the wetting balance method
| MERGED
| B | 2008-04 | |||
DEL 60068-2-69 am1 Ed. 1.0Amendment 1 to IEC 60068-2-69
| DEL
| E | 50/380 | |||
IEC 60068-2-77 Ed. 1.0Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock
| PPUB
| B | yes | Webstore | ||
IEC 60068-2-77 fF Ed. 1.0Environmental testing - Part 2-77: Tests - Test 77: Body strength and impact shock | MERGED
| B | ||||
DEL 60068-2-80 Ed. 1.0Environmental testing - Part 2: Tests - Test Tf: Solderability testing of printed wiring boards by the globule wetting balance method
| DEL
| E | 50/381 | |||
IEC 60068-2-82 Ed. 1.0Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components | PPUB
| B | 2007-07 | yes | Webstore | |
IEC 60068-2-82 fC1 Ed. 1.0Corrigendum 1 - Environmental testing - Part 2-82: Tests - Test Tx: Whisker test methods for electronic and electric components
| PPUB
| B | Webstore | |||
IEC 60068-2-82 fF Ed. 1.0Environmental testing - Part 2-82: Tests - Test Tx: Whisker test
methods for electronic and electric components
| MERGED
| B | 2008-04 | |||
IEC 60068-2-83 Ed. 1.0Environmental testing - Part 2-83: Tests - Test Tf: Solderability testing of electronic components for surface mounting devices (SMD) by the wetting balance method using solder paste | PPUB
| B | 2011-09 | yes | Webstore | |
IEC/TR 60068-3-12 Ed. 1.0Environmental testing - Part 3-12: Supporting documentation and guidance - Method to evaluate a possible lead-free solder reflow temperature profile | PPUB
| E | 2007-04 | no | Webstore | |
IEC 60068-3-13 Ed. 1.0IEC 60068-3-13 Ed.1: Environmental testing - Part 3-13: Supporting documentation and guidance on test T: Soldering. | ACDV
| E | 2014-08 | yes | ||
IEC 60097 Ed. 4.0Grid systems for printed circuits
| PPUB
| B | Webstore | |||
IEC 60097 Ed. 5.0Systematic review of IEC 97 (1991)
| DEL
| B | ||||
IEC 60194 Ed. 3.0Terms and definitions for printed circuits | DELPUB
| B | ||||
IEC 60194 Ed. 4.0Printed board design, manufacture and assembly - Terms and definitions | DELPUB
| E | ||||
IEC 60194 Ed. 5.0Printed board design, manufacture and assembly - Terms and definitions | PPUB
| E | no | Webstore | ||
IEC 60194 Ed. 6.0Printed board design, manufacture and assembly - Terms and definitions | CCDV
| B | 2012-10 | no | ||
IEC 60194 f2 Ed. 4.0Terms and definitions for printed circuits and a proposal for a decimal classification code (DCC) for the categorization of the terms and definitions (Revision of IEC 194) | DEL
| E | ||||
IEC 60249-1 Ed. 2.0Base materials for printed circuits. Part 1: Test methods | WPUB
| B | ||||
IEC 60249-1 f1 Ed. 3.0Amendment to IEC 249-1 - Measurement method for glass transition temperature using differential scanning calorimetry (New Sub-clause 4.5) | DEL
| E | ||||
IEC 60249-1 f2 Ed. 3.0Amendment to IEC 249-1 - Measurement method of cure factor (New Sub-clause 4.6) | DEL
| E | ||||
IEC 60249-1 f3 Ed. 3.0Addition of a new Sub-clause 4.5.2 -Measurement method for glass transition temperature using thermomechanical analysis (TMA)- to IEC 249-1 | DEL
| E | ||||
IEC 60249-1 f4 Ed. 3.0Amendment to Sub-clause 2.2.1 and 2.2.2 of IEC 249-1 | DEL
| E | 52(Sec.)302 | |||
IEC 60249-1 am4 Ed. 2.0Amendment No. 4 | WPUB
| B | ||||
DEL 60249-2-1 f2 Ed. 2.0Requirements for pull-off strength - Revision of Specification 249-2-1 | DEL
| E | 52/553 | |||
IEC 60249-2-1 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality | WPUB
| B | ||||
IEC 60249-2-1 am2 Ed. 2.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-1 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-1 am4 Ed. 2.0Amendment 4
| WPUB
| B | yes | |||
IEC 60249-2-2 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 2: Phenolic cellulose paper copper-clad laminated sheet, economic quality | WPUB
| B | ||||
IEC 60249-2-2 f5 Ed. 2.0Requirements for pull-off strength - Revision of Specification 249-2-2 | MERGED
| E | 52/553 | |||
IEC 60249-2-2 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-2 am4 Ed. 2.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-2 am5 Ed. 2.0Amendment 5
| WPUB
| B | yes | |||
IEC 60249-2-3 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 3: Epoxide cellulose paper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | ||||
IEC 60249-2-3 f2 Ed. 2.0Requirements for pull-off strength - Revision of Specification 249-2-3 | MERGED
| E | 52/553 | |||
IEC 60249-2-3 am2 Ed. 2.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-3 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-3 am4 Ed. 2.0Amendment 4
| WPUB
| B | yes | |||
IEC 60249-2-4 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 4: Epoxide woven glass fabric copper-clad laminated sheet, general purpose grade | WPUB
| B | ||||
IEC 60249-2-4 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-4 am4 Ed. 2.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-4 am5 Ed. 2.0Amendment 5
| WPUB
| B | yes | |||
DEL 60249-2-5 f1 Ed. 2.0Requirements for pull-off strength - Revision of Specification 249-2-5 | DEL
| E | 52/553 | |||
DEL 60249-2-5 f2 Ed. 2.0Requirements for punching and machining properties of laminates - Revision of Specification 249-2-5 (Sub-clause 5.5) | DEL
| E | 52/552 | |||
IEC 60249-2-5 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 5: Epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | ||||
IEC 60249-2-5 Ed. 3.0Introduction of a new subclause 6.6 to IEC 249-2-4, 249-2-5,
249-2-11 and 249-2-12 concerning the requirements for glass
transition temperature and cure factor
| MERGED
| B | yes | |||
IEC 60249-2-5 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-5 am4 Ed. 2.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-5 am5 Ed. 2.0Amendment 5
| WPUB
| B | yes | |||
IEC 60249-2-6 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test) | WPUB
| B | ||||
IEC 60249-2-6 am2 Ed. 2.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-6 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-6 am4 Ed. 2.0Amendment 4
| WPUB
| B | yes | |||
DEL 60249-2-7 f11 Ed. 2.0Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7 | DEL
| E | 52/555 | |||
IEC 60249-2-7 Ed. 2.0Base materials for printed circuits. Part 2: Specifications. Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | ||||
IEC 60249-2-7 f5 Ed. 2.0Requirements for surface waviness - Revision of Specification 249-2-7 | MERGED
| E | 52/554 | |||
IEC 60249-2-7 am2 Ed. 2.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-7 am3 Ed. 2.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-7 am4 Ed. 2.0Amendment 4
| WPUB
| B | yes | |||
IEC 60249-2-8 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 8: Flexible copper-clad polyester (PETP) film | WPUB
| B | ||||
IEC 60249-2-8 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60249-2-9 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | ||||
IEC 60249-2-9 f7 Ed. 1.0Requirements for surface waviness - Revision of Specification 249-2-9 | MERGED
| E | 52/554 | |||
IEC 60249-2-9 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-9 am4 Ed. 1.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-9 am5 Ed. 1.0Amendment 5
| WPUB
| B | yes | |||
IEC 60249-2-10 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | ||||
IEC 60249-2-10 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-10 am4 Ed. 1.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-10 am5 Ed. 1.0Amendment 5
| WPUB
| B | yes | |||
IEC 60249-2-11 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade for use in the fabrication of multilayer printed boards | WPUB
| B | ||||
IEC 60249-2-11 Ed. 2.0Introduction of a new subclause 6.6. to IEC 249-2-4, 249-2-5,
249-2-11 and 249-2-12 concerning the requirements for glass
transition temperature and cure factor
| MERGED
| B | yes | |||
IEC 60249-2-11 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-11 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-11 am4 Ed. 1.0Amendment 4
| WPUB
| B | yes | |||
IEC 60249-2-12 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 12: Thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards | WPUB
| B | ||||
IEC 60249-2-12 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-12 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-12 am4 Ed. 1.0Amendment 4
| WPUB
| B | yes | |||
IEC 60249-2-13 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 13: Flexible copper-clad polyimide film, general purpose grade | WPUB
| B | ||||
IEC 60249-2-13 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60249-2-14 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 14: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test), economic quality | WPUB
| B | ||||
IEC 60249-2-14 am3 Ed. 1.0Amendment No. 3 | DELPUB
| B | ||||
IEC 60249-2-14 am4 Ed. 1.0Amendment No. 4 | DELPUB
| B | ||||
IEC 60249-2-14 am5 Ed. 1.0Amendment 5
| WPUB
| B | yes | |||
IEC 60249-2-15 Ed. 1.0Base materials for printed circuits. Part 2: Specifications. Specification No. 15: Flexible copper-clad polyimide film, of defined flammability | WPUB
| B | ||||
IEC 60249-2-15 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60249-2-16 Ed. 1.0Base materials for printed circuits - Part 2: Specifications - Specification No. 16: Polyimide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | 52(C.O.)356 | |||
IEC 60249-2-16 am1 Ed. 1.0Amendment No. 1 | DELPUB
| B | ||||
IEC 60249-2-16 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-16 am3 Ed. 1.0Amendment 3
| WPUB
| B | yes | |||
IEC 60249-2-17 Ed. 1.0Base materials for printed circuits - Part 2: Specifications - Specification No. 17: Thin polyimide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards | WPUB
| B | 52(C.O.)357 | |||
IEC 60249-2-17 am1 Ed. 1.0Amendment No. 1 | DELPUB
| B | ||||
IEC 60249-2-17 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-17 am3 Ed. 1.0Amendment 3
| WPUB
| B | yes | |||
IEC 60249-2-18 Ed. 1.0Base materials for printed circuits - Part 2: Specifications - Specification No. 18: Bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability (vertical burning test) | WPUB
| B | 52(C.O.)358 | |||
IEC 60249-2-18 am1 Ed. 1.0Amendment No. 1 | DELPUB
| B | ||||
IEC 60249-2-18 am2 Ed. 1.0Amendment No. 2 | DELPUB
| B | ||||
IEC 60249-2-18 am3 Ed. 1.0Amendment 3
| WPUB
| B | yes | |||
IEC 60249-2-19 Ed. 1.0Base materials for printed circuits - Part 2: Specifications - Specification No. 19: Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards | WPUB
| B | 52(C.O.)359 | |||
IEC 60249-2-19 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60249-2-19 am2 Ed. 1.0Amendment No. 2 | WPUB
| B | ||||
IEC 60249-3-1 Ed. 2.0Base materials for printed circuits. Part 3: Special materials used in connection with printed circuits. Specification No. 1: Prepreg for use as bonding sheet material in the fabrication of multilayer printed boards | WPUB
| B | ||||
IEC 60249-3-1 Ed. 3.0Systematic review of IEC 60249-3-1 (1981) | DEL
| B | ||||
IEC 60249-3-3 Ed. 1.0Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards | WPUB
| B | ||||
IEC 60249-3-3 Ed. 2.0Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards (Revision of IEC 249-3-3) | DEL
| E | 52(Sec.)356 | |||
IEC 60249-3A Ed. 2.0Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - First supplement: Specification No. 2: Specification for copper foil for use in the manufacture of copper-clad base materials. Note: Still valid, will be renumbered as 249-3-2 when next revised | DELPUB
| B | ||||
IEC 60321 Ed. 1.0Guidance for the design and use of components intended for mounting on boards with printed wiring and printed circuits | WPUB
| B | ||||
IEC 60321 Ed. 2.0Systematic review of IEC 321 (1970) | DEL
| B | ||||
IEC 60321 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60321-2 Ed. 1.0Auxiliary printed board information. Part 2: Rework, repair,
modifications
| WPUB
| B | ||||
IEC 60321-2 Ed. 2.0Systematic review of IEC 321-2 (1987)
| DEL
| B | ||||
IEC 60321-3 Ed. 1.0Auxiliary printed board information. Part 3: Guidelines for
artwork
| WPUB
| B | ||||
IEC 60321-3 Ed. 2.0Systematic review of IEC 321-3 (1990)
| DEL
| B | ||||
IEC 60326-1 Ed. 1.0Printed boards. Part 1: General information for the specification writer | DELPUB
| B | ||||
IEC 60326-2 Ed. 3.0Printed boards. Part 2: Test methods | WPUB
| B | ||||
IEC 60326-2 am1 Ed. 3.0Amendment No. 1 | WPUB
| B | ||||
IEC 60326-3 Ed. 2.0Printed boards - Part 3: Design and use of printed boards
| WPUB
| B | ||||
IEC 60326-3 Ed. 3.0Systematic review of IEC 326-3 (1991)
| DEL
| B | ||||
IEC 60326-4 Ed. 1.0Printed boards. Part 4: Specification for single and double
sided printed boards with plain holes
| WPUB
| B | ||||
IEC 60326-4 Ed. 2.0Systematic review of IEC 326-4 (1980)
| DEL
| B | ||||
IEC 60326-4 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60326-5 Ed. 1.0Printed boards. Part 5: Specification for single and double
sided printed boards with plated-through holes
| WPUB
| B | ||||
IEC 60326-5 Ed. 2.0Systematic review of IEC 326-5 (1980)
| DEL
| B | ||||
IEC 60326-5 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60326-6 Ed. 1.0Printed boards. Part 6: Specification for multilayer printed
boards
| DELPUB
| B | ||||
IEC 60326-6 am2 Ed. 1.0Amendment No. 2
| DELPUB
| B | ||||
IEC 60326-7 Ed. 1.0Printed boards. Part 7: Specification for single and double
sided flexible printed boards without through connections
| WPUB
| B | ||||
IEC 60326-7 Ed. 2.0Systematic review of IEC 326-7 (1981)
| DEL
| B | ||||
IEC 60326-7 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60326-8 Ed. 1.0Printed boards. Part 8: Specification for single and double
sided flexible printed boards with through connections
| WPUB
| B | ||||
IEC 60326-8 Ed. 2.0Systematic review of IEC 326-8 (1981)
| DEL
| B | ||||
IEC 60326-8 am1 Ed. 1.0Amendment No. 1 | WPUB
| B | ||||
IEC 60326-9 Ed. 1.0Printed boards - Part 9: Specification for flexible multilayer
printed boards with through connections
| WPUB
| B | ||||
IEC 60326-9 Ed. 2.0Systematic review of IEC 326-9 (1991)
| DEL
| B | ||||
IEC 60326-10 Ed. 1.0Printed boards - Part 10: Specification for flex-rigid
double-sided printed boards with through connections
| WPUB
| B | ||||
IEC 60326-10 Ed. 2.0Systematic review of IEC 326-10 (1991)
| DEL
| B | ||||
IEC 60326-11 Ed. 1.0Printed boards - Part 11: Specification for flex-rigid
multilayer printed boards with through connections
| WPUB
| B | ||||
IEC 60326-11 Ed. 2.0Systematic review of IEC 326-11 (1991)
| DEL
| B | ||||
IEC 60326-12 Ed. 1.0Printed boards - Part 12: Specification for mass lamination panels (semi-manufactured multilayer printed boards) | WPUB
| B | 52(C.O.)367 | |||
IEC 61182-1 Ed. 1.0Printed boards - Electronic data description and transfer - Part 1: Printed board description in digital form | PPUB
| B | Webstore | |||
IEC 61182-2 Ed. 1.0Printed board assembly products - Manufacturing description data and transfer methodology - Part 2: Generic requirements
| PPUB
| E | 2006-03 | no | Webstore | |
IEC 61182-2-2 Ed. 1.0Printed board assembly products - Manufacturing description data and transfer methodology - Part 2-2: Sectional requirements for implementation of printed board fabrication data description | PPUB
| B | 2012-05 | yes | Webstore | |
IEC 61182-7 Ed. 1.0Printed boards - Electronic data description and transfer - Part 7: Bare board electrical test information in digital form | PPUB
| B | yes | Webstore | ||
IEC 61182-7 fC1 Ed. 1.0Corrigendum 1 | PPUB
| B | Webstore | |||
IEC 61182-10 Ed. 1.0Printed boards - Electronic data description and transfer - Part 10: Electronic data hierarchy | PPUB
| E | Webstore | |||
DEL 61185 am2 f1 Ed. 1.0Fiducial standard specification
| DEL
| E | ||||
IEC 61188-1-1 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 1-1: Generic requirements - Flatness considerations for electronic assemblies
| PPUB
| B | yes | Webstore | ||
IEC 61188-1-2 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 1-2: Generic requirements - Controlled impedance | PPUB
| B | yes | Webstore | ||
IEC 61188-2 Ed. 1.0Design and use of printed boards and printed board assemlies -
Part 2: Guide to the use of printed wiring board substrate
materials - Surface mount technology
| DEL
| B | no | |||
IEC 61188-5 Ed. 1.0IEC 1188-5 - Design of printed boards and printed boards
assemblies - Part 5: Sectional design requirements - Attachment
(land/joint) considerations (Revision of IEC 321)
| DEL
| E | 91(Sec.)59 | |||
IEC 61188-5-1 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
| PPUB
| B | yes | Webstore | ||
IEC 61188-5-2 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components | PPUB
| B | yes | Webstore | ||
DEL 61188-5-3 Ed. 1.0Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (land/joint) considerations - Section 3: Components with Gull-wing leads on two sides | DEL
| E | yes | |||
IEC 61188-5-3 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
| PPUB
| B | 2007-11 | yes | Webstore | |
IEC 61188-5-3 fF Ed. 1.0Printed boards and printed board assemblies - Design and use -
Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides
| MERGED
| F | 2009-08 | |||
DEL 61188-5-4 Ed. 1.0Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 4: Components with J leads on two sides | DEL
| E | yes | |||
IEC 61188-5-4 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides | PPUB
| B | 2007-11 | yes | Webstore | |
IEC 61188-5-4 fF Ed. 1.0Printed boards and printed board assemblies - Design and use -
Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides
| MERGED
| F | 2009-10 | |||
DEL 61188-5-5 Ed. 1.0Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (land/joint) considerations - Section 5: Components with Gull-wing leads on four sides | DEL
| E | yes | |||
IEC 61188-5-5 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides | PPUB
| B | 2007-11 | yes | Webstore | |
IEC 61188-5-5 fF Ed. 1.0Printed boards and printed board assemblies - Design and use -
Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides
| MERGED
| F | 2009-10 | |||
IEC 61188-5-6 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations - Chip carriers with J-leads on four sides | PPUB
| B | yes | Webstore | ||
DEL 61188-5-7 Ed. 1.0Design and use of printed boards and printed board assemblies - Part 5: Sectional design and use requirements - Attachment (Land/joint) considerations - Section 7: Components with Post (DIP) mounting leads on two sides | DEL
| E | yes | |||
IEC 61188-5-8 Ed. 1.0Printed boards and printed board assemblies - Design and use -
Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) | PPUB
| B | 2007-11 | yes | Webstore | |
IEC 61188-5-8 fF Ed. 1.0Printed board and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) | MERGED
| F | 2010-01 | |||
IEC 61188-7 Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | PPUB
| B | 2009-06 | yes | Webstore | |
IEC 61188-7 fC1 Ed. 1.0Corrigendum 1 - Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | PPUB
| E | Webstore | |||
IEC 61188-7 fF Ed. 1.0Printed boards and printed board assemblies - Design and use - Part 7: Electronic component zero orientation for CAD library construction | MERGED
| F | 2009-11 | |||
IEC 61188-8-1 Ed. 1.0Component shape data specification for CAD library - Part 8-1 Generic Descriptions of the 2D and 3D description
| CDM
| E | 2010-12 | |||
IEC 61189-1 Ed. 1.0Test methods for electrical materials, interconnection
structures and assemblies - Part 1: General test methods and
methodology
| PPUB
| B | yes | Webstore | ||
IEC 61189-1 Ed. 1.1Test methods for electrical materials, interconnection structures and assemblies - Part 1: General test methods and methodology | PPUB
| B | Webstore | |||
IEC 61189-1 f2 Ed. 1.0Test methods for interconnection structures (printed boards) - Test N11: Pre-conditioning, 125°C | MERGED
| E | yes | |||
IEC 61189-1 am1 Ed. 1.0Amendment 1
| PPUB
| B | yes | Webstore | ||
IEC 61189-2 Ed. 1.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
| DELPUB
| B | yes | |||
IEC 61189-2 Ed. 2.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2: Test methods for materials for interconnection structures
| PPUB
| E | 2006-03 | yes | Webstore | |
IEC 61189-2 f1 Ed. 1.0Test Method for Halogen-free Copper-Clad Laminates | MERGED
| E | 91/240 | |||
IEC 61189-2 am1 Ed. 1.0Amendment 1
| DELPUB
| E | yes | |||
IEC 61189-2 am1 f16 Ed. 1.0Test mehods for materials for interconnection structures - Test E14: Arc resistance | MERGED
| E | yes | |||
IEC 61189-2 am1 f17 Ed. 1.0Test methods for materials for interconnection structures - Test M25: Time to delamination by TMA | MERGED
| E | yes | |||
IEC 61189-2 am1 f18 Ed. 1.0Test methods for materials for interconnection structures - Test M27: Resin flow properties of coverlay films, bonding films and adhesive cast films used in the fabrication of flexible printed wiring boards | MERGED
| E | yes | |||
MERGED 61189-2 am1 Ed. 1.0Amendment No. 1 to IEC 1189-2 - Tests 2E04, 2E14, 2M25 and 2M27 | MERGED
| B | yes | |||
DEL 61189-2 am2 Ed. 1.0Amendment 2 to IEC 1189-2: Test methods for electrical
materials, interconnection structures and assemblies - Part 2:
Test methods for materials for interconnection structures
| CAN
| E | yes | |||
IEC 61189-2-628 Ed. 1.0IEC 61189-2-628,Ed.1: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-628: Mechanical test methods for printed board and assembly materials - Glass transition temperature of base material by dynamic mechanical analysis(DMA; bend and pull) | DEL
| E | 2012-03 | 91/805 | ||
IEC 61189-2-629 Ed. 1.0Test method of adhesion between a dielectric and inkjet printed circuits to be used for printed elecronics sheet(board) application | ANW
| E | 2015-03 | 91/1000 | ||
IEC 61189-2-719 Ed. 1.0Future IEC 61189-2-719 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-719: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (500MHz to 10GHz)
| DEL
| E | 2012-03 | 91/806 | ||
IEC 61189-2-720 Ed. 1.0Future IEC 61189-2-720 Ed. 1.0: Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Electrical test methods for printed board and assembly materials - Relative permittivity and dissipation factor (1MHz)
| DEL
| E | 2012-03 | 91/807 | ||
IEC 61189-3 Ed. 1.0Test methods for electrical materials, interconnection structures
and assemblies - Part 3: Test methods for interconnection
structures (printed boards)
| DELPUB
| B | 1997-03 | yes | ||
IEC 61189-3 Ed. 1.1Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) | DELPUB
| B | ||||
IEC 61189-3 Ed. 2.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) | PPUB
| B | 2007-10 | yes | Webstore | |
IEC 61189-3 fF Ed. 2.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) | MERGED
| F | 2012-01 | |||
DREJ 61189-3 am1 Ed. 1.0Test methods for interconnection structures (printed boards) - Test E07: Controlled impedance testing by time domain reflectometry (TDR) | DREJ
| E | yes | |||
IEC 61189-3 am1 Ed. 1.0Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) | DELPUB
| B | 1999-07 | yes | ||
IEC 61189-3 am1 f1 Ed. 1.0Amendment No. 1 to IEC 1189-3 - Tests 3N01, 3N04 to 3N06, 3N08, 3X07 and 3X10 | MERGED
| B | yes | |||
IEC 61189-3 am1 f12 Ed. 1.0Test methods for interconnection structures (printed boards) - Test X07: Edge dip test for surface mount conductors and attachment lands | MERGED
| E | yes | |||
IEC 61189-3 am1 f13 Ed. 1.0Test methods for interconnection structures (printed boards) - Test X10: Rotary dip test for plated through holes, surface mount conductors and attachment lands | MERGED
| E | yes | |||
IEC 61189-3 am1 f6 Ed. 1.0Test methods for interconnection structures (printed boards) - Test N04: Thermal shock , dip soldering | MERGED
| E | ||||
IEC 61189-3 am1 f7 Ed. 1.0Test methods for interconnection structures (printed boards) - Test N05: Thermal shock, floating, solder bath 280°C | MERGED
| E | ||||
IEC 61189-3 am1 f8 Ed. 1.0Test methods for interconnection structures (printed boards) - Test N06: Damp heat, steady state | MERGED
| E | ||||
IEC 61189-3 am1 f9 Ed. 1.0Test methods for interconnection structures (printed boards) - Test N08: Thermal shock, immersion, fluidized sand bath | MERGED
| E | yes | |||
IEC 61189-3 am1 fF Ed. 1.0Amendment 1 - Test methods for electrical materials, interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards) | MERGED
| B | ||||
DEL 61189-3 am2 Ed. 1.0Amendment 2 to IEC 61189-3: Test methods for electrical
materials, interconnection structures and assemblies - Part 3:
Test methods for interconnection structures
| CAN
| E | yes | |||
IEC 61189-3 am2 f1 Ed. 1.0Test methods for interconnection structures (printed boards) - Test E08: PTH resistance change, thermal cycling | MERGED
| E | ||||
IEC 61189-3-719 Ed. 1.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Test 3E19: Monitoring of single plated-through hole (PTH) resistance change during thermal cycling | ANW
| E | 2014-06 | 91/1028 | ||
IEC 61189-3-913 Ed. 1.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) -Test methods for electronic circuit board for high-brightness LEDs | 1CD
| E | 2014-03 | |||
IEC/PAS 61189-3-913 Ed. 1.0Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-913: Test methods for interconnection structures (printed boards) - Electronic circuit board for high-brightness LEDs | PPUB
| E | 2010-12 | Webstore | ||
DEL 61189-4 f5 Ed. 1.0Test method of ultrasonic cleaning | DEL
| E | ||||
IEC 61189-5 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 5: Test methods for printed board assemblies | PPUB
| B | 2006-08 | yes | Webstore | |
IEC 61189-5 fF Ed. 1.0Test methods for electrical materials, interconnection structures
and assemblies - Part 5: Test methods for printed board assemblies
| MERGED
| B | 2008-05 | |||
IEC 61189-5-1 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 5-1: Test methods for printed board assemblies - Guidance | AMW
| E | 2014-09 | yes | 91/1021 | |
IEC 61189-5-2 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 5-2: Test methods for printed board assemblies - Soldering Flux
| 1CD
| E | 2014-09 | yes | ||
IEC 61189-5-3 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 5-3: Test methods for printed board assemblies - Soldering paste
| 1CD
| E | 2014-09 | yes | ||
IEC 61189-5-4 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 5-4: Test methods for printed board assemblies - Solder alloys and fluxed and non-fluxed solid wire
| 1CD
| E | 2014-09 | yes | ||
IEC 61189-5-5 Ed. 1.0General test method for measuring residues inducing Electrochemical Degradation Mechanism | AMW
| E | 2014-09 | yes | 91/1021 | |
IEC 61189-6 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 6: Test methods for materials used in manufacturing electronic assemblies
| PPUB
| B | 2006-08 | yes | Webstore | |
IEC 61189-6 fF Ed. 1.0Test methods for electrical materials, interconnection structures
and assemblies - Part 6: Test methods for materials used in
manufacturing electronic assemblies
| MERGED
| B | 2008-05 | |||
IEC 61189-11 Ed. 1.0Test methods for electrical materials, interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys | RDIS
| B | 2013-06 | yes | ||
IEC 61190-1-1 Ed. 1.0Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly
| PPUB
| B | yes | Webstore | ||
IEC 61190-1-2 Ed. 1.0Attachment materials for electronic assembly - Part 1-2: Requirements for solder pastes for high-quality interconnections in electronics assembly
| DELPUB
| B | 2002-04 | yes | ||
IEC 61190-1-2 Ed. 2.0Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly
| PPUB
| B | 2007-06 | yes | Webstore | |
IEC 61190-1-2 fF Ed. 2.0Attachment materials for electronic assembly - Part 1-2:
Requirements for soldering pastes for high-quality interconnects
in electronics assembly
| MERGED
| B | 2008-05 | |||
IEC 61190-1-2 am1 Ed. 2.0Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high - quality interconnects in electronics assembly | CCDV
| B | 2013-09 | yes | ||
IEC 61190-1-3 Ed. 1.0Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | DELPUB
| B | 2002-04 | yes | ||
IEC 61190-1-3 Ed. 2.0Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications
| PPUB
| B | 2007-06 | yes | Webstore | |
IEC 61190-1-3 Ed. 2.1Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | PPUB
| B | Webstore | |||
IEC 61190-1-3 fF Ed. 2.0Attachment materials for electronic assembly - Part 1-3:
Requirements for electronic grade solder alloys and fluxed and
non-fluxed solid solders for electronic soldering applications
| MERGED
| B | 2008-05 | |||
IEC 61190-1-3 am1 Ed. 2.0Amendment 1 - Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications | PPUB
| B | 2010-06 | yes | Webstore | |
IEC 61190-1-6 Ed. 1.0Attachment materials for electronic assembly - Part-1-6: Requirements for electronic grade lead free solder alloys and fluxed and non-fluxed lead free solid solder for electronic soldering applications | CAN
| E | 2007-04 | 91/378 | ||
IEC 61190-1-7 Ed. 1.0Attachment materials for electronic assembly - Part-1-7: Requirements for lead free solder pastes for high quality interconnections in electronics assembly | CAN
| E | 2007-04 | 91/379 | ||
IEC 61191-1 Ed. 1.0Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies
| PPUB
| B | yes | Webstore | ||
IEC 61191-1 Ed. 2.0Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies | RDIS
| B | 2013-07 | yes | ||
IEC 61191-2 Ed. 1.0Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies
| PPUB
| B | yes | Webstore | ||
IEC 61191-2 Ed. 2.0Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies | RDIS
| B | 2013-07 | yes | ||
IEC 61191-3 Ed. 1.0Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
| PPUB
| B | yes | Webstore | ||
IEC 61191-3 Ed. 2.0Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies
| AMW
| E | 2015-06 | yes | 91/1074 | |
IEC 61191-4 Ed. 1.0Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies
| PPUB
| B | yes | Webstore | ||
IEC 61191-4 Ed. 2.0Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies | AMW
| E | 2015-06 | yes | 91/1075 | |
IEC 61191-6 Ed. 1.0Printed board assemblies - Part 6: Evaluation criteria for voids in soldered joints of BGA and LGA and measurement method | PPUB
| B | 2010-02 | yes | Webstore | |
IEC 61192-1 Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 1: General | PPUB
| B | yes | Webstore | ||
IEC 61192-2 Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 2: Surface-mount assemblies | PPUB
| B | yes | Webstore | ||
IEC 61192-3 Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 3: Through-hole mount assemblies | PPUB
| B | yes | Webstore | ||
IEC 61192-4 Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 4: Terminal assemblies | PPUB
| B | yes | Webstore | ||
IEC 61192-5 Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic assemblies | PPUB
| B | 2007-07 | yes | Webstore | |
IEC 61192-5 fF Ed. 1.0Workmanship requirements for soldered electronic assemblies - Part 5: Rework, modification and repair of soldered electronic
assemblies
| MERGED
| B | 2008-05 | |||
IEC 61192-6 Ed. 1.0Product performance requirements - Part 6: Guide to the rework of unassembled boards | DEL
| E | 91/245 | |||
DEL 61193-1 Ed. 1.0Guidance on the use of IEC/ISO publications and quality assessment systems - Part 1: Guide to the use of the IECQ system for quality assessment fot printed boards and printed board assemblies | CAN
| E | yes | |||
IEC 61193-1 Ed. 1.0Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies
| PPUB
| B | yes | Webstore | ||
MERGED
| F | |||||
CAN 61193-2 Ed. 1.0Guidance on the use of IEC/ISO publications and quality assessment systems - Part 2: Guide to the implementation of ISO 9000 quality standards within the IECQ system for printed boards and printed board assemblies | CAN
| B | yes | |||
DEL 61193-2 Ed. 1.0Quality Assessment Systems - Part 2: Guide to the selection and use of sampling plans for end-product and in-process auditing | DEL
| E | 91/307 | |||
IEC 61193-2 Ed. 1.0Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages | PPUB
| E | 2007-09 | yes | Webstore | |
IEC 61193-3 Ed. 1.0Quality assessment systems - Part 3: Selection and use of sampling plans for printed board and laminate end-product and in-process auditing | PPUB
| B | 2013-02 | yes | Webstore | |
IEC 61249-2 Ed. 1.0Generic specification for reinforced base materials, clad and unclad | CAN
| E | 52/514 | |||
IEC 61249-2-1 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-1: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-1 f1 Ed. 1.0Requirements for punching and machining properties of laminates - Revision of Specification 249-2-1 to (Sub-clause 5.5) | DEL
| E | 52/552 | |||
IEC 61249-2-1 f3 Ed. 1.0Requirements for pull-off strength - Revision of Specification 249-2-1 | DEL
| E | 52/553 | |||
IEC 61249-2-2 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-2: Reinforced base materials, clad and unclad - Phenolic cellulose paper reinforced laminated sheets, high electrical grade, copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-2 f1 Ed. 1.0Requirements for pull-off strength - Revision of Specification 249-2-2 | DEL
| E | 52/553 | |||
IEC 61249-2-2 f2 Ed. 1.0Requirements for punching and machining properties of laminates - Revision of Specification 249-2-2 (Sub-clause 5.5) | DEL
| E | 52/552 | |||
IEC 61249-2-4 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-4: Reinforced base materials, clad and unclad - Polyester non-woven/woven fibreglass laminated sheet of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-5 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-5: Reinforced base materials, clad and unclad - Brominated epoxide cellulose paper reinforced core/woven E-glass reinforced surfaces laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-6 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-6: Reinforced base materials, clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-7 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-7 f12 Ed. 1.0Requirements for punching and machining properties of laminates - Revision of Specification 249-2-7 (Sub-clause 5.5) | DEL
| E | 52/552 | |||
IEC 61249-2-7 f13 Ed. 1.0Requirements for surface waviness - Revision of Specification 249-2-7 | DEL
| E | 52/554 | |||
IEC 61249-2-7 f14 Ed. 1.0Laminate construction - Revision of IEC 249-2-7 | DEL
| E | 52(DE)209 | |||
IEC 61249-2-7 f4 Ed. 1.0Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7 | DEL
| E | 52/555 | |||
IEC 61249-2-7 f6 Ed. 1.0Requirements for surface waviness - Revision of Specification 249-2-7 | DEL
| E | 52/554 | |||
IEC 61249-2-7 f7 Ed. 1.0Requirements for glass transition temperature and cure factor - Revision of Specification 249-2-7 | DEL
| E | 52/555 | |||
IEC 61249-2-7 f8 Ed. 1.0Requirements for surface waviness - Amendment to Specification 249-2-7 | DEL
| E | 52/554 | |||
IEC 61249-2-7 f9 Ed. 1.0Requirements for glass transition temperature and cure factor - Amendment to Specification 249-2-7 | DEL
| E | 52/555 | |||
IEC 61249-2-8 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-8: Reinforced base materials clad and unclad - Modified brominated epoxide woven fibreglass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-9 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-9: Reinforced base materials, clad and unclad - Bismaleimide/triazine modified epoxide or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | 2002-12 | yes | Webstore | |
IEC 61249-2-9 f5 Ed. 1.0Requirements for surface waviness - Revision of Specification 249-2-9 | DEL
| E | 52/554 | |||
IEC 61249-2-9 f6 Ed. 1.0Requirements for pull-off strength - Revision of Specification 249-2-9 | DEL
| E | 52/553 | |||
IEC 61249-2-10 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-10: Reinforced base materials clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-11 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-11: Reinforced base materials, clad and unclad - Polyimide, brominated epoxide modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-11 f2 Ed. 1.0Requirements for surface waviness - Amendment to Specification 249-2-11 | DEL
| E | 52/554 | |||
IEC 61249-2-12 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad
| PPUB
| B | yes | Webstore | ||
IEC 61249-2-12 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-12: Sectional specification set for reinforced base materials, clad and unclad - Epoxide non-woven aramid laminate of defined flammability, copper-clad | PPUB
| B | Webstore | |||
IEC 61249-2-13 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad
| PPUB
| B | yes | Webstore | ||
IEC 61249-2-13 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-13: Sectional specification set for reinforced base materials, clad and unclad - Cyanate ester non-woven aramid laminate of defined flammability, copper-clad | PPUB
| B | Webstore | |||
IEC 61249-2-18 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-18: Reinforced base materials, clad and unclad - Polyester non-woven fibreglass reinforced laminated sheet of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-19 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-19: Reinforced base materials, clad and unclad - Epoxide cross-plied linear fibreglass-reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-21 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-21: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-22 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-22: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-23 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-23: Reinforced base materials, clad and unclad - Non-halogenated phenolic cellulose paper reinforced laminated sheets, economic grade, copper clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-26 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-26: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminated sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | yes | Webstore | ||
IEC 61249-2-27 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-27: Reinforced base materials clad and unclad - Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad | PPUB
| B | 2012-11 | yes | Webstore | |
IEC 61249-2-30 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-30: Reinforced base materials clad and unclad - Non-halogenated epoxide modified cyanate ester woven glass laminate of defined flammability (vertical burning test), copper-clad
| PPUB
| B | 2012-11 | yes | Webstore | |
IEC 61249-2-31 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials, clad and unclad -
Halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
| PPUB
| B | 2009-02 | yes | Webstore | |
IEC 61249-2-32 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials, clad and unclad - Halogenated modified or unmodified resin system, woven E-glass
laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
| PPUB
| B | 2009-02 | yes | Webstore | |
IEC 61249-2-33 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 4,1 at 1 GHz) and flammability (vertical burning test), copper-clad
| PPUB
| B | 2009-02 | yes | Webstore | |
IEC 61249-2-34 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials, clad and unclad - Non-halogenated modified or unmodified resin system, woven E-glass laminate sheets of defined relative permittivity (equal to or less than 3,7 at 1 GHz) and flammability (vertical burning test), copper-clad
| PPUB
| B | 2009-02 | yes | Webstore | |
IEC 61249-2-35 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2008-12 | yes | Webstore | |
IEC 61249-2-36 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials, clad and unclad - Epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2008-12 | yes | Webstore | |
IEC 61249-2-37 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2008-12 | yes | Webstore | |
IEC 61249-2-38 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2008-12 | yes | Webstore | |
IEC 61249-2-39 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-39: Reinforced base materials clad and unclad - High performance epoxide and non-epoxide, woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
| PPUB
| B | 2012-11 | yes | Webstore | |
IEC 61249-2-40 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-40: Reinforced base materials, clad and unclad - High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2012-11 | yes | Webstore | |
IEC 61249-2-41 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-41: Reinforced base materials clad and unclad - Brominated epoxide cellulose paper/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly | PPUB
| B | 2010-04 | yes | Webstore | |
IEC 61249-2-42 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 2-42: Reinforced base materials clad and unclad - Brominated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
| PPUB
| B | 2010-04 | yes | Webstore | |
IEC 61249-2-50 Ed. 3.0Bow and twist requirements - Amendment to IEC 249-2-1 to 7, 9, 10, 14, 16, 18 | MERGED
| E | yes | |||
IEC/PAS 61249-3-1 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-1: Copper-clad laminates for flexible boards (adhesive and non-adhesive types) | PPUB
| E | 2007-05 | Webstore | ||
IEC/TS 61249-3-1 Ed. 1.0Materials for printed boards and other interconnecting structures - Copper-Clad Laminates for Flexible Boards (Adhesive and Non-adhesive types) | PWI
| E | 2011-01 | yes | ||
IEC 61249-3-3 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film
| PPUB
| B | yes | Webstore | ||
IEC 61249-3-3 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-3: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyester film | PPUB
| B | Webstore | |||
IEC 61249-3-4 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film | PPUB
| B | yes | Webstore | ||
IEC 61249-3-4 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-4: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Adhesive coated flexible polyimide film
| PPUB
| B | Webstore | |||
IEC 61249-3-5 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films | PPUB
| B | yes | Webstore | ||
IEC 61249-3-5 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 3-5: Sectional specification set for unreinforced base materials, clad and unclad (intended for flexible printed boards) - Transfer adhesive films | PPUB
| B | Webstore | |||
IEC 61249-4 Ed. 1.0Sectional specification set for prepreg materials, B-stage, unclad (for use as bonding sheets) | DEL
| E | 52/516 | |||
DEL 61249-4-1 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Section 1: Epoxide woven E-glass prepreg of defined flammability (vertical burning test) | DEL
| B | yes | |||
IEC 61249-4-1 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability | PPUB
| B | 2008-02 | yes | Webstore | |
IEC 61249-4-1 f2 Ed. 1.0Selection of prepregs for multilayer board construction - Revision of Specification 249-4-1 | DEL
| E | 52/556 | |||
IEC 61249-4-1 f3 Ed. 1.0Selection of prepregs for multilayer board construction - Revision of Specifiction 249-4-1 (or 326-3) | DEL
| E | 52/556 | |||
IEC 61249-4-1 f4 Ed. 1.0Requirements for melting viscosity - Revision to Specification 249-4-1 | DEL
| E | 52/557 | |||
IEC 61249-4-1 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-1: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woen E-glass prepreg of defined flammability | MERGED
| F | 2009-08 | |||
IEC 61249-4-2 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-2: Sectional specification set for prepreg materials, unclad - Multifunctional epoxide woven E-glass prepreg of defined flammability | PPUB
| E | yes | Webstore | ||
IEC 61249-4-5 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-5: Sectional specification set for prepreg materials, unclad - Polyimide, modified or unmodified, woven E-glass prepreg of defined flammability | PPUB
| E | yes | Webstore | ||
IEC 61249-4-11 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-11: Sectional specification set for prepreg materials, unclad - Non-halogenated epoxide, woven E-glass prepreg of defined flammability | PPUB
| B | yes | Webstore | ||
IEC 61249-4-12 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-12: Sectional specification set for prepreg materials, unclad - Non-halogenated multifunctional epoxide woven E-glass prepreg of defined flammability | PPUB
| B | yes | Webstore | ||
IEC 61249-4-14 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | PPUB
| B | 2009-06 | yes | Webstore | |
IEC 61249-4-14 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | MERGED
| F | 2009-10 | |||
IEC 61249-4-15 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
| PPUB
| B | 2009-06 | yes | Webstore | |
IEC 61249-4-15 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | MERGED
| F | 2009-10 | |||
IEC 61249-4-16 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials,
unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
| PPUB
| B | 2009-06 | yes | Webstore | |
IEC 61249-4-16 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | MERGED
| F | 2009-10 | |||
IEC 61249-4-17 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | PPUB
| B | 2009-06 | yes | Webstore | |
IEC 61249-4-17 fF Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | MERGED
| F | 2009-10 | |||
IEC 61249-4-18 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-18: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | ADIS
| B | 2013-09 | yes | ||
IEC 61249-4-19 Ed. 1.0Materials for printed boards and other interconnecting structures - Part 4-19: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly | ADIS
| B | 2013-09 | yes | ||
IEC 61249-5-1 Ed. 1.0Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with and without coatings - Section 1: Copper foils (for the manufacture of copper-clad base materials) | PPUB
| B | yes | Webstore | ||
IEC 61249-5-4 Ed. 1.0Materials for interconnection structures - Part 5: Sectional specification set for conductive foils and films with or without coatings - Section 4: Conductive inks | PPUB
| B | yes | Webstore | ||
DEL 61249-6-3 Ed. 1.0IEC 1249-6-3: Material for interconnection structures - Part 6: Sectional specification set for reinforcement materials - Section 3: Woven E-glass | DEL
| E | yes | 52/558 | ||
IEC 61249-6-3 Ed. 1.0Materials for printed boards and other interconnection structures - Part 6-3: Reinforcements - Woven fiberglass fabrics | PWI
| E | 2008-01 | yes | ||
IEC/PAS 61249-6-3 Ed. 1.0Specification for finished fabric woven from "E" glass for printed boards | PPUB
| E | 2011-07 | Webstore | ||
IEC 61249-7-1 Ed. 1.0Materials for interconnection structures - Part 7: Sectional specification set for restraining core materials - Section 1: Copper/invar/copper | PPUB
| B | yes | Webstore | ||
IEC 61249-8-7 Ed. 1.0Materials for interconnection structures - Part 8: Sectional specification set for non-conductive films and coatings - Section 7: Marking legend inks | PPUB
| B | yes | Webstore | ||
IEC 61249-8-8 Ed. 1.0Materials for interconnection structures - Part 8: Sectional
specification set for non-conductive films and coatings - Section
8: Temporary polymer coatings
| PPUB
| B | yes | Webstore | ||
IEC 61445 Ed. 1.0Digital Test Interchange Format (DTIF) | PPUB
| E | 2012-05 | no | Webstore | |
IEC 61523-1 Ed. 1.0Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems
| DELPUB
| E | 2001-10 | yes | ||
IEC 61523-1 Ed. 2.0Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems | PPUB
| E | 2012-07 | no | Webstore | |
IEC 61523-2 Ed. 1.0Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries | WPUB
| E | 2002-05 | yes | ||
IEC 61523-3 Ed. 1.0Delay and power calculation standards - Part 3: Standard Delay Format (SDF) for the electronic design process
| PPUB
| E | Webstore | |||
IEC 61671 Ed. 1.0Automatic Test Markup Language (ATML) for Exchanging Automatic Test Equipment and Test Information via XML
| PPUB
| E | 2012-06 | no | Webstore | |
IEC 61690-1 Ed. 1.0Electronic design interchange format (EDIF) - Part 1: Version 3 0 0
| PPUB
| E | yes | Webstore | ||
IEC 61690-2 Ed. 1.0Electronic design interchange format (EDIF) - Part 2: Version 4 0 0
| PPUB
| E | yes | Webstore | ||
IEC 61691-1 Ed. 1.0Design automation - Part 1: VHDL language reference manual | WPUB
| E | yes | |||
IEC 61691-1 Ed. 2.0Electronic design automation - Part 1: VHSIC Hardware description language VHDL 1076a
| DEL
| E | 93/22 | |||
IEC 61691-1-1 Ed. 1.0Behavioural languages - Part 1-1: VHDL language reference manual | DELPUB
| E | 2004-06 | 93/193 | ||
IEC 61691-1-1 Ed. 2.0Behavioural languages - Part 1-1: VHDL Language Reference Manual | PPUB
| E | no | Webstore | ||
IEC 61691-2 Ed. 1.0Behavioural languages - Part 2: VHDL multilogic system for model interoperability | WPUB
| E | 1996-12 | yes | ||
IEC 61691-3-1 Ed. 1.0Electronic design automation - Part 3-1: Extensions to and supplementary packages for the VHSIC Hardware Description Language VHDL 1076-1993 - Analog description in VHDL (P1076.1)
| DEL
| E | 93/23 | |||
IEC 61691-3-2 Ed. 1.0Behavioural languages - Part 3-2: Mathematical operation in VHDL | WPUB
| E | 2001-06 | yes | ||
IEC 61691-3-3 Ed. 1.0Behavioural languages - Part 3-3: Synthesis in VHDL | WPUB
| E | 2001-06 | yes | ||
IEC 61691-4 Ed. 1.0Behavioural languages - Part 4: Verilog® hardware description language | WPUB
| E | 2004-06 | 93/192 | ||
DEL/TR 61691-5 Ed. 1.0Electronic desing automation - Part 5: Library utilities for VHDL
| DEL
| E | 93/23 | |||
IEC 61691-5 Ed. 1.0Behavioural languages - Part 5: VITAL ASIC (application specific integrated circuit) modeling specification | WPUB
| E | 93/194 | |||
IEC 61691-6 Ed. 1.0Behavioural languages - Part 6: VHDL Analog and Mixed-Signal Extensions | PPUB
| E | 2009-11 | no | Webstore | |
IEC 61691-6-1 Ed. 1.0Standard VHDL analog and mixed-signal extensions - Packages for multiple energy domain support (IEEE 1076.1.1-2004) | CAN
| E | 2009-09 | no | 93/278 | |
IEC 61691-7 Ed. 1.0Behavioural languages - Part 7: SystemC R Language Reference Manual | PPUB
| E | 2009-11 | no | Webstore | |
IEC 61692-1 Ed. 1.0Common rules for circulation of electronic catalogue data - Part 1: Extended mapping rules and methods | DEL
| E | 1995-12 | 93/282 | ||
IEC 61693-1 Ed. 1.0Guidelines for test, validation, conformance and qualification for standards | DEL
| E | 93(US)2 | |||
IEC 61760-1 Ed. 1.0Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
| DELPUB
| B | yes | |||
IEC 61760-1 Ed. 2.0Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs) | PPUB
| E | 2006-05 | yes | Webstore | |
IEC 61760-2 Ed. 1.0Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide | DELPUB
| B | 1998-03 | yes | ||
IEC 61760-2 Ed. 2.0Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide | PPUB
| B | 2007-03 | yes | Webstore | |
IEC 61760-2 fF Ed. 2.0Surface mounting technology - Part 2: Transportation and storage
conditions of surface mounting devices (SMD) - Application guide
| MERGED
| B | 2008-05 | |||
IEC 61760-3 Ed. 1.0Surface mounting technology - Part 3: Standard method for the specification of components for through hole reflow (THR) soldering | PPUB
| B | 2010-03 | yes | Webstore | |
IEC 61760-4 Ed. 1.0Classification, packaging, labelling and handling of moisture sensitive devices | ACDV
| E | 2014-06 | yes | ||
IEC 61761 Ed. 1.0Generic specification - Capability approval for surface mount technologies
| DEL
| E | ||||
IEC 61768 Ed. 1.0Solderability tests for component leads, terminations, lugs,
terminals and wires
| DEL
| E | 91(Sec.)10 | |||
DEL 61907 Ed. 1.0Technical Report on SystemVerilog | DEL
| E | 93/163 | |||
IEC/TR 61908 Ed. 1.0The technology roadmap for industry data dictionary structure, utilization and implementation | PPUB
| E | no | Webstore | ||
DEL 61910 Ed. 1.0Interoperability Verilog and VHDL (Technical report) | DEL
| E | 93/167 | |||
IEC 61926-1 Ed. 1.0Design automation - Part 1: Standard test language for all systems - Common abbreviated test language for all systems (C/ATLAS)
| PPUB
| E | yes | Webstore | ||
IEC/TR 61926-1-1 Ed. 1.0Design automation - Part 1-1: Harmonization of ATLAS test languages | PPUB
| E | Webstore | |||
IEC 61926-2 Ed. 1.0IEC 61926-2 Standard Test Languages; Part 2; Test Language for All Systems Requirements | CAN
| E | 93/166 | |||
IEC 62014-1 Ed. 1.0Electronic design automation libraries - Part 1: Input/output buffer information specifications (IBIS version 3.2) | PPUB
| E | yes | Webstore | ||
IEC/TR 62014-3 Ed. 1.0Electronic design automation libraries - Part 3: Models of integrated circuits for EMI behavioural simulation | PPUB
| E | no | Webstore | ||
IEC/TR 62014-4 Ed. 1.0Cookbook for integrated Circuit model IECM described in IEC 62014-3 | CAN
| E | no | 93/155 | ||
IEC 62015-1 Ed. 1.0Design automation - Chip Hierarchical Design Systems Technical
Data (CHDStd)
| DEL
| E | 93/49 | |||
IEC 62015-2 Ed. 1.0Advanced intermediate representation with extensibility/common environment (AIRE/CE) | DEL
| E | 93/72 | |||
IEC 62016 Ed. 1.0Core model of the electronics domain
| PPUB
| E | yes | Webstore | ||
IEC/TR 62017-1 Ed. 1.0Documentation on design automation subjects - Part 1: EDA industry standards roadmap
| WPUB
| E | 2002-04 | |||
IEC/TR 62017-2 Ed. 1.0Documentation on design automation subjects - Part 2: EIAJ-EDA
Technology Roadmap toward 2002 | WPUB
| E | 2001-02 | 93/115 | ||
IEC 62050 Ed. 1.0VHDL Register Transfer Level (RTL) synthesis
| WPUB
| E | no | |||
IEC 62084 Ed. 1.0Implementation of flip chip and chip scale technology | DEL
| E | 91/139 | |||
IEC/PAS 62084 Ed. 1.0Implementation of flip chip and chip scale technology | WPUB
| E | 91/139 | |||
IEC 62085 Ed. 1.0Implementation of ball grid array and other high density technology | DEL
| E | 91/140 | |||
IEC/PAS 62085 Ed. 1.0Implementation of ball grid array and other high density technology | WPUB
| E | 91/140 | |||
IEC 62090 Ed. 1.0Product package labels for electronic components using bar code and two-dimensional symbologies | PPUB
| B | yes | Webstore | ||
IEC 62119 Ed. 1.0Generic requirements for implementation of product manufacturing description data and transfer methodology | DEL
| E | 52/827 | |||
IEC/PAS 62119 Ed. 1.0Generic requirements for implementation of product manufacturing description data and transfer methodology | WPUB
| E | 52/827 | |||
IEC 62123 Ed. 1.0Performance guide Manual for single and double-sided flexible printed wiring boards | DEL
| E | 52/809 | |||
IEC/PAS 62123 Ed. 1.0Performance guide Manual for single- and double-sided flexible printed wiring boards | WPUB
| E | 52/809 | |||
IEC 62137 Ed. 1.0Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN | PPUB
| B | yes | Webstore | ||
IEC 62137 fC1 Ed. 1.0Corrigendum 1 - Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN | PPUB
| E | Webstore | |||
IEC 62137 ff Ed. 1.0Environmental and endurance testing - Test methods for
surface-mount boards of area array type packages FBGA, BGA, FLGA,
LGA, SON and QFN
| MERGED
| B | ||||
IEC 62137-1-1 Ed. 1.0Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-1: Pull strength test | PPUB
| B | 2007-08 | yes | Webstore | |
IEC 62137-1-1 fF Ed. 1.0Surface mounting technology - Environmental and endurance test
methods for surface mount solder joint - Part 1-1: Pull strength
test
| MERGED
| B | 2008-05 | |||
IEC 62137-1-2 Ed. 1.0Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-2: Shear strength test | PPUB
| B | 2007-08 | yes | Webstore | |
IEC 62137-1-2 fF Ed. 1.0Surface mounting technology - Environmental and endurance test
methods for surface mount solder joint - Part 1-2: Shear strength
test
| MERGED
| B | 2008-05 | |||
IEC 62137-1-3 Ed. 1.0Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-3: Cyclic drop test | PPUB
| B | 2008-12 | yes | Webstore | |
IEC 62137-1-4 Ed. 1.0Surface mounting technology - Environmental and endurance test methods for surface mount solder joint - Part 1-4: Cyclic bending test | PPUB
| B | 2009-01 | yes | Webstore | |
IEC 62137-1-5 Ed. 1.0Surface mounting technology - Environmental and endurance test methods for surface mount solder joints - Part 1-5: Mechanical shear fatigue test | PPUB
| B | 2009-02 | yes | Webstore | |
IEC 62137-3 Ed. 1.0Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints | PPUB
| B | 2011-10 | yes | Webstore | |
IEC/PAS 62137-3 Ed. 1.0Electronics assembly technology - Selection guidance of environmental and endurance test methods for solder joints | DELPUB
| E | 2009-04 | 91/784 | ||
IEC 62137-4 Ed. 1.0Review report on IEC 62137-4 Ed.1: Electronics assembly technology - Part 4: Environmental and endurance test methods for solder joint of area array type package surface mount devices | 1CD
| E | 2014-09 | yes | ||
IEC 62142 Ed. 1.0Verilog (R) register transfer level synthesis | WPUB
| E | no | 93/213 | ||
IEC 62158 Ed. 1.0Printed board manufacturers' qualification profile (MQP) | DEL
| E | 52/841 | |||
IEC/PAS 62158 Ed. 1.0Printed Board Manufacturers' Qualification Profile (MQP) | WPUB
| E | 52/841 | |||
IEC 62159 Ed. 1.0Electronic assembly manufacturers' qualification profile (AQP) | DEL
| E | 52/842 | |||
IEC/PAS 62159 Ed. 1.0Electronic Assembly Manufacturers' Qualification Profile (AQP) | WPUB
| E | 52/842 | |||
IEC 62160 Ed. 1.0Laminator qualification profile | DEL
| E | 52/843 | |||
IEC/PAS 62160 Ed. 1.0Laminator Qualification Profile | WPUB
| E | 52/843 | |||
IEC 62212 Ed. 1.0IPC-4130 - Specification and characterization methods for nonwoven "E" glass mat | DEL
| E | 52/870 | |||
IEC/PAS 62212 Ed. 1.0Specification and characterization methods for nonwoven "E" glass mat | WPUB
| E | 52/870 | |||
IEC 62213 Ed. 1.0IPC-4411 - Specification and characterization methods for nonwoven para-aramid reinforcement | DEL
| E | 52/871 | |||
IEC/PAS 62213 Ed. 1.0Specification and characterization methods for nonwoven para-aramid reinforcement | WPUB
| E | 52/871 | |||
IEC 62214 Ed. 1.0IPC-6011 - Generic performance specification for printed boards | DEL
| E | 52/872 | |||
IEC/PAS 62214 Ed. 1.0Generic performance specification for printed boards | WPUB
| E | 52/872 | |||
IEC 62218 Ed. 1.0Surface Insulation Resistance (SIR) - Test method for Assembled Printed Wiring Boards (PWB) - Test 5E02 | DEL
| E | ||||
IEC 62243 Ed. 1.0Artificial intelligence exchange and service tie to all test environments (Al-ESTATE) | DELPUB
| E | 2005-05 | no | 93/214 | |
IEC 62243 Ed. 2.0Artificial Intelligence Exchange and Service Tie to All Test Environments (AI-ESTATE)
| PPUB
| E | 2012-05 | no | Webstore | |
IEC/TR 62248 Ed. 1.0Approaches to conformance and certification testing for automation standards | WPUB
| E | 2002-12 | no | ||
IEC 62249 Ed. 1.0Qualification and performance specification for flexible printed boards (IPC-6013 with Amendment 1) | DEL
| E | 91/209 | |||
IEC/PAS 62249 Ed. 1.0Qualification and performance specification for flexible printed boards | WPUB
| E | 91/209 | |||
IEC 62250 Ed. 1.0Qualification and performance specification for rigid printed boards (IPC-6012A with Amendment 1) | DEL
| E | 91/210 | |||
IEC/PAS 62250 Ed. 1.0Qualification and performance specification for rigid printed boards (IPC 6012A with Amendment 1) | WPUB
| E | 91/210 | |||
IEC 62265 Ed. 1.0Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells and blocks | WPUB
| E | no | 93/215 | ||
IEC 62293 Ed. 1.0Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) | DEL
| E | 91/248 | |||
IEC/PAS 62293 Ed. 1.0Qualification and performance specification for high density interconnect (HDI) layers or boards (IPC 6016) | WPUB
| E | 91/248 | |||
IEC 62326-1 Ed. 1.0Printed boards - Part 1: Generic specification
| DELPUB
| B | yes | |||
IEC 62326-1 Ed. 2.0Printed boards - Part 1: Generic specification
| PPUB
| B | yes | Webstore | ||
IEC 62326-2 Ed. 1.0Printed boards - Part 2: Rigid single and double-sided printed
boards without interlayer connections - Sectional specification
| DEL
| E | yes | |||
IEC 62326-2 f1 Ed. 1.0Additions to IEC 326-2: Ionic surface contamination test | DEL
| E | 52(Sec.)329 | |||
IEC 62326-2 f2 Ed. 1.0Solderability test for printed boards - Updating 4 tests already existing in IEC 326-2 | DEL
| E | 52(US)127 | |||
IEC 62326-2 f3 Ed. 1.0Addition to IEC 326-2 - Test 14b: Solderability, wetting balance method | DEL
| E | 52(Sec.)310 | |||
IEC 62326-2-1 Ed. 1.0Printed boards - Part 2: Rigid single and double-sided printed boards without interlayer connections - Section 1: Capability detail specification - Performance level A, B and C | DEL
| E | yes | 52/675 | ||
DEL 62326-3 Ed. 1.0Printed boards - Part 3: Rigid single and double-sided printed
boards with interlayer connections - Sectional specification
| DEL
| E | yes | |||
IEC 62326-3 Ed. 1.0Printed Boards - Part 3: Safety certification of rigid printed circuit boards for electronic assemblies (performance for capability approval) | DEL
| E | 2006-09 | yes | ||
DEL 62326-3-1 Ed. 1.0Printed boards - Part 3: Rigid single and double-sided printed boards with interlayer connections - Section 1: Capability detail specification - Performance level A, B and C | DEL
| E | yes | 52/677 | ||
IEC 62326-4 Ed. 1.0Printed boards - Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional specification
| PPUB
| B | yes | Webstore | ||
IEC 62326-4-1 Ed. 1.0Printed boards - Part 4: Rigid multilayer printed boards with
interlayer connections - Sectional specification - Section 1:
Capability detail specification: Performance levels A, B and C
| PPUB
| B | yes | Webstore | ||
IEC 62326-7 Ed. 1.0Sectional specification for IECQ | DEL
| E | ||||
IEC/PAS 62326-7-1 Ed. 1.0Performance guide for single- and double-sided flexible printed wiring boards | PPUB
| E | 2007-05 | Webstore | ||
IEC/TS 62326-7-1 Ed. 1.0Printed boards - Part 7-1: Performance guide for single-and double-sided flexible printed boards | PWI
| E | 2011-01 | yes | ||
IEC 62326-8 Ed. 1.0Sectional specification for IECQ | DEL
| E | ||||
IEC 62326-14 Ed. 1.0IEC 62326-14: Printed boards - Device Embedded Substrate - Terminology / Reliability / Design Guide | DEL
| E | 2012-12 | 91/894A | ||
IEC/PAS 62326-14 Ed. 1.0Printed boards - Part 14: Device embedded substrate - Terminology / reliability / design guide
| PPUB
| E | 2010-07 | Webstore | ||
IEC 62326-15 Ed. 1.0Printed boards - Device Embedded Substrate - General electrical test guide for device embedded substrate with active devices,passive components (Capacitor, Resistor, Inductor, etc), Integrated passive device (IPD), and discrete packages. | 2CD
| E | 2013-12 | |||
IEC/TS 62326-16 Ed. 1.0Printed boards - Part 16: Device Embedded Substrate Technology - Generics | 1CD
| E | 2015-03 | |||
IEC/TS 62326-17 Ed. 1.0Printed boards - Part 17: Device embedded substrates - TEG (test element group) | 1CD
| E | 2015-03 | |||
IEC 62326-18 Ed. 1.0Printed boards - Part 18: Standard on Device Embedded Substrate - Test methods | 1CD
| E | 2015-03 | |||
IEC/TS 62326-19 Ed. 1.0Printed boards - Part 19: Device Embedded Substrate - Design Guide | 1CD
| E | 2015-03 | |||
IEC 62326-20 Ed. 1.0IEC 62326-20 Ed.1: Electronic circuit board for high-brightness LEDs
| 1CD
| E | 2014-03 | |||
IEC/PAS 62326-20 Ed. 1.0Printed boards - Part 20: Electronic circuit board for high-brightness LEDs | PPUB
| E | 2010-12 | Webstore | ||
DEL 62362 Ed. 1.0A standard for an Advanced Library Format (ALF) describing Integrated Circuit (IC) technology, cells, and blocks | DEL
| E | 93/162 | |||
DEL 62399 Ed. 1.0Test Plan for Validation of ALF using XML | DEL
| E | 93/169 | |||
IEC 62421 Ed. 1.0Electronics assembly technology - Electronic modules | PPUB
| E | 2007-09 | yes | Webstore | |
IEC 62468 Ed. 1.0The marking for presence and absence of the specified chemical substance in materials, components and mounted boards used in electrical and electronic equipment | CAN
| E | 2008-02 | yes | ||
IEC 62525 Ed. 1.0Standard Test Interface Language (STIL) for Digital Test Vector Data
| PPUB
| E | 2007-09 | Webstore | ||
IEC 62526 Ed. 1.0Standard for Extensions to Standard Test Interface Language (STIL) for Semiconductor Design Environments
| PPUB
| E | 2007-09 | Webstore | ||
IEC 62527 Ed. 1.0Standard for Extensions to Standard Test Interface Language (STIL) for DC Level Specification
| PPUB
| E | 2007-09 | Webstore | ||
IEC 62528 Ed. 1.0Standard Testability Method for Embedded Core-based Integrated Circuits
| PPUB
| E | 2007-09 | Webstore | ||
IEC 62529 Ed. 1.0Standard for Signal and Test Definition
| DELPUB
| E | 2007-10 | 93/251 | ||
IEC 62529 Ed. 2.0Standard for Signal and Test Definition
| PPUB
| E | 2012-06 | no | Webstore | |
IEC 62530 Ed. 1.0Standard for SystemVerilog - Unified Hardware Design, Specification, and Verification Language
| DELPUB
| E | 2007-10 | 93/252 | ||
IEC 62530 Ed. 2.0SystemVerilog - Unified Hardware Design, Specification, and Verification Language | PPUB
| E | no | Webstore | ||
IEC 62531 Ed. 1.0Standard for Property Specification Language (PSL)
| DELPUB
| E | 2007-10 | 93/253 | ||
IEC 62531 Ed. 2.0Property Specification Language (PSL)
| PPUB
| E | 2012-05 | no | Webstore | |
IEC 62588 Ed. 1.0Marking and labeling of components, PCBs and PCBAs to identify lead (Pb), lead-free (Pb-free) and other attributes | CCDV
| B | 2014-03 | yes | ||
IEC/PAS 62588 Ed. 1.0Marking and labeling of components, PCBs and PCBAs to identify lead(Pb), Pb-free and other attributes | PPUB
| E | 2009-02 | Webstore | ||
IEC 62699 Ed. 1.0Mapping rules and exchange methods for hetrogeneous parts libraries | ACDV
| B | 2014-03 | no | ||
IEC 62739-1 Ed. 1.0Test method for erosion of wave soldering equipment using molten lead-free solder alloy - Part 1: Erosion test method for metal materials without surface processing | RDIS
| B | 2013-08 | yes | ||
IEC/TR 62856 Ed. 1.0Documentation on design automation subjects - The Bird's-eye View of Design Languages (BVDL) | CDTR
| B | 91/1085 |
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