International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 47

Semiconductor devices

 
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TC 47 Project files (301)

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PNW 47-17-18 ED1

Semiconductor devices - SMD sequential stress testing

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EN U 47(DE)/799/NP
PNW 47-1409 ED1

Amendments to IEC 747-10 & IEC 748-11

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  • Deleted items
EN U 47/1409/NP
PNW 47-1411 ED1

Modification of the sealing test of IEC 749

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  • Deleted items
EN U 47/1411/NP
PNW 47-1473 ED1

Gate oxide breakdown tests

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  • Deleted items
EN U 47/1473/NP PDF file 68 kB
PNW 47-1725 ED1

IEC 60747-1, Ed.2: Semiconductor devices - Part 1: General

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  • Deleted items
EN U 47/1725A/NP PDF file 100 kB
PNW 47-1744 ED1

Complete update of IEC 60749. Addition of test methods (together with proposed number): IEC 60749-20-1, IEC 60749-35, IEC 60749-37, IEC 60749-38, IEC 60749-39 - (this NP is CANCELLED)

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EN U 47/1744/NP PDF file 71 kB
PNW 47-1772 ED1

IEC/PAS: Marking, Symbols, Labels for Identification of Lead (Pb) Free Assemblies, Components, and Devices (JESD-97)

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EN U 47/1772/NP PDF file 81 kB
PNW 47-1881 ED1

Audit for obsolescence management

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EN U 47/1881/NP PDF file 295 kB
PNW 47-1973 ED1

Transmission line pulse measurement of human body model parameters for electrostatic discharge protection design of semiconductor devices

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EN U 47/1973/NP PDF file 605 kB
PNW 47-2119 ED1

Copper Stress migration Test Method

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EN U 47/2119A/NP PDF file 948 kB
PNW 47-2243 ED1

Future IEC 62969-5 Ed.1: Semiconductor devices - Semiconductor interfaces for automotive vehicles - Part 5: Test/diagnosis method via vehicular network for automotive semiconductors

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EN U 47/2243/NP PDF file 777 kB
PNW 47-2291 ED1

Semiconductor devices - Reliability of automotive semiconductors - Part 1: Estimating aging level of automotive semiconductors

PRVN
  • PRVN
  • Preparation of RVN
EN U 47/2291/NP PDF file 690 kB
PNW 47-2301 ED1

Future IEC 62779-4 Ed.1: Semiconductor devices - Semiconductor interface for human body communication- Part 4: Semiconductor interface for capsule endoscopy using human body communication

PRVN
  • PRVN
  • Preparation of RVN
EN U 47/2301/NP PDF file 967 kB
IEC 60147-0 ED2

Systematic review of IEC 147-0 (1966)

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EN-FR U
IEC 60147-0:1966 ED1

Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 0: General and terminology

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EN-FR U
IEC 60147-1 ED3

Systematic review of IEC 147-1 (1972)

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EN-FR U
IEC 60147-1:1972 ED2

Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 1: Essential ratings and characteristics

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EN-FR U
IEC 60147-2 ED2

Systematic review of IEC 147-2 (1963)

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EN-FR U
IEC 60147-2:1963 ED1

Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-3 ED2

Systematic review of IEC 147-3 (1970)

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EN-FR U
IEC 60147-3:1970 ED1

Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 3: Reference methods of measurement

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  • Publication Withdrawn
EN-FR U
IEC 60147-4 ED2

Systematic review of IEC 147-4 (1976)

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EN-FR U
IEC 60147-4:1976 ED1

Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 4: Acceptance and reliability

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EN-FR U
IEC 60147-0B ED2

Systematic review of IEC 147-0B (1969)

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EN-FR U
IEC 60147-0B:1969 ED1

Supplement B - Essential ratings and characteristics et semiconductor devices and general principles of measuring methods - Part 0: General and terminology

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EN-FR U
IEC 60147-0C ED2

Systematic review of IEC 147-0C (1973)

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EN-FR U
IEC 60147-0C:1973 ED1

Supplement C - Essential ratings and characteristics et semiconductor devices and general principles of measuring methods - Part 0: General and terminology

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EN-FR U
IEC 60147-0F ED2

Systematic review of IEC 147-0F (1982)

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EN-FR U
IEC 60147-0F:1982 ED1

Supplement F - Essential ratings and characteristics et semiconductor devices and general principles of measuring methods - Part 0: General and terminology

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EN-FR U
IEC 60147-1F ED3

Systematic review of IEC 147-1F (1973)

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EN-FR U
IEC 60147-1F:1973 ED2

Supplement F - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 1: Essential ratings and characteristics

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EN-FR U
IEC 60147-1G:1975 ED2

Supplement G - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 1: Essential ratings and characteristics

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EN-FR U
IEC 60147-1H ED3

Systematic review of IEC 147-1H (1975)

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EN-FR U
IEC 60147-1H:1981 ED2

Supplement H - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 1: Essential ratings and characteristics

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EN-FR U
IEC 60147-1J ED3

Systematic review of IEC 147-1J (1981)

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EN-FR U
IEC 60147-1J:1981 ED2

Supplement J - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 1: Essential ratings and characteristics

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EN-FR U
IEC 60147-2B ED2

Systematic review of IEC 147-2B (1970)

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EN-FR U
IEC 60147-2B:1970 ED1

Supplement B - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-2C ED2

Systematic review of IEC 147-2C (1970)

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EN-FR U
IEC 60147-2C:1970 ED1

Supplement C - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-2F ED2

Systematic review of IEC 147-2F (1974)

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EN-FR U
IEC 60147-2F:1974 ED1

Supplement F - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-2K ED2

Systematic review of IEC 147-2K (1978)

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EN-FR U
IEC 60147-2K:1978 ED1

Supplement K - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-2M ED2

Systematic review of IEC 147-2M (1980)

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EN-FR U
IEC 60147-2M:1980 ED1

Supplement M - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 2: General principles of measuring methods

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EN-FR U
IEC 60147-3A ED2

Systematic review of IEC 147-3A (1973)

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EN-FR U
IEC 60147-3A:1973 ED1

Supplement A - Essential ratings and characteristics of semiconductor devices and general principles of measuring methods - Part 3: Reference methods of measurement

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EN-FR U
IEC 60747-1:2010+AMD1:2010 CSV ED2.1

Semiconductor devices - Part 1: General

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EN-FR U Webstore
IEC 60747-1:2006 ED2

Semiconductor devices - Part 1: General

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EN-FR N Webstore
IEC 60747-1:2006/FRAG1 ED2

Revision of the term 'category of assessed quality'

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EN-FR U 47(SEC.)/1246/CDV
IEC 60747-1:2006/FRAG2 ED2

Revision of IEC 747-1 - Chapter V, Clauses 1 to 3

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EN U
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FR 2009-10 U
IEC 60747-1:2006/COR1:2008 ED2

Corrigendum 1 - Semiconductor devices - Part 1: General

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EN U Webstore
IEC 60747-1:2006/AMD1:2010 ED2

Amendment 1 - Semiconductor devices - Part 1: General

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EN-FR 2010-05 N Webstore
IEC 60747-1:1983 ED1

Semiconductor devices - Discrete devices - Part 1: General

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EN-FR U
IEC 60747-1:1983/AMD2:1993 ED1

Amendment 2 - Semiconductor devices - Discrete devices and integrated circuits - Part 1: General

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EN-FR U
IEC 60747-1:1983/AMD3:1996 ED1

Amendment 3 - Semiconductor devices - Discrete devices - Part 1: General

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EN-FR U
IEC 60747-1:1983/AMD4/FRAG2 ED1

Additional concepts for field-effect transistors in IEC 747-1

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EN U 47(SEC.)/1312/CD
IEC 60749/FRAG1 ED3

Second part of the complete update of IEC 60749

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EN Y 47/1436/CD PDF file 93 kB
IEC 60749/FRAG2 ED3

First part of the complete update of IEC 60749

MERGED
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  • Fragment merged
EN Y 47/1439/CD PDF file 1248 kB
IEC 60749:2002+AMD1:2000+AMD2:2001 CSV ED2.2

Semiconductor devices - Mechanical and climatic test methods

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EN-FR U
IEC 60749:1996 ED2

Semiconductor devices - Mechanical and climatic test methods

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EN-FR U 47/1394/FDIS
IEC 60749:1996/AMD1:2000 ED2

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods

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EN-FR Y 47/1477/FDIS PDF file 153 kB
IEC 60749:1996/AMD1:2000/FRAG1 ED2

Resistance to dissolution of metallization on SMD's

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EN U 47/1390/CD
IEC 60749:1996/AMD2:2001 ED2

Amendment 2 - Semiconductor devices - Mechanical and climatic test methods

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EN-FR Y 47/1574/FDIS PDF file 472 kB
PDF file 500 kB
IEC 60749:1984 ED1

Semiconductor devices - Mechanical and climatic test methods.

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EN-FR U
IEC 60749:1984/AMD1:1991 ED1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods.

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EN-FR U
IEC 60749:1984/AMD2:1993 ED1

Amendment 2 - Semiconductor devices - Mechanical and climatic test methods.

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EN-FR U
IEC 60749:1984/AMD4/FRAG1 ED1

Mechanical and climatic test methods - Test method: Internal moisture content

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EN-FR U
IEC 60749:1984/AMD4/FRAG4 ED1

Amendment to IEC 749 - Clause 1: Substrate bending test for SMD-Semiconductors

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EN U
IEC 60749:1984/AMD4/FRAG6 ED1

Amendments to IEC 749 - Inclusion of optoelectronic semi-conductor devices - Inclusion of LCD devices - Endurance tests

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EN-FR U 47(SEC.)/1276/CD
IEC 60749-1:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 1: General

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EN-FR Y Webstore
IEC 60749-1:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 1: General

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EN-FR U Webstore
IEC 60749-2:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

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EN-FR Y Webstore
IEC 60749-2:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 2: Low air pressure

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EN-FR U Webstore
IEC 60749-3 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

RFDIS
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  • FDIS received and registered
EN 2017-05 Y 47/2298/CDV
PDF file 154 kB
IEC 60749-3:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual inspection

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EN-FR Y Webstore
IEC 60749-3:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 3: External visual examination

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EN-FR U Webstore
IEC 60749-4 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp Heat, steady state, highly accelerated stress test (HAST)

RFDIS
  • RFDIS
  • FDIS received and registered
EN 2017-05 Y 47/2287/CDV
PDF file 240 kB
IEC 60749-4:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

PPUB
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EN-FR Y Webstore
IEC 60749-4:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

PPUB
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EN-FR U Webstore
IEC 60749-5 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

PRVC
  • PRVC
  • Preparation of RVC
EN 2017-09 Y 47/2311/CDV
PDF file 206 kB
IEC 60749-5:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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EN-FR Y Webstore
IEC 60749-6 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

RFDIS
  • RFDIS
  • FDIS received and registered
EN 2017-05 Y 47/2297/CDV
PDF file 181 kB
IEC 60749-6:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

PPUB
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EN-FR Y Webstore
IEC 60749-6:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

PPUB
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EN-FR U Webstore
IEC 60749-7:2011 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

PPUB
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EN-FR 2011-06 Y Webstore
IEC 60749-7:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

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EN-FR 2002-05 Y 47/1597/FDIS PDF file 160 kB
PDF file 166 kB
IEC 60749-7:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases

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EN-FR U
IEC 60749-8:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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EN-FR Y Webstore
IEC 60749-8:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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EN-FR U Webstore
IEC 60749-8:2002/COR2:2003 ED1

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing

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EN-FR U Webstore
IEC 60749-9 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

RFDIS
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  • FDIS received and registered
EN 2017-05 Y 47/2300/CDV
PDF file 180 kB
IEC 60749-9:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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EN-FR Y Webstore
IEC 60749-9:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking

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EN-FR U Webstore
IEC 60749-10:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

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EN-FR Y Webstore
IEC 60749-10:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock

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EN-FR U Webstore
IEC 60749-11:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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EN-FR Y Webstore
IEC 60749-11:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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EN-FR U Webstore
IEC 60749-11:2002/COR2:2003 ED1

Corrigendum 2 - Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method

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EN-FR U Webstore
IEC 60749-12:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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EN-FR Y Webstore
IEC 60749-12:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency

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EN-FR U Webstore
IEC 60749-13:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

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EN-FR Y Webstore
IEC 60749-13:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere

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EN-FR U Webstore
IEC 60749-14:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 14: Robustness of terminations (lead integrity)

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EN-FR Y Webstore
IEC 60749-15:2010 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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EN-FR 2010-11 Y Webstore
IEC 60749-15:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices

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EN-FR 2003-03 Y 47/1663/FDIS PDF file 130 kB
PDF file 108 kB
IEC 60749-16:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 16: Particle impact noise detection (PIND)

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EN-FR Y Webstore
IEC 60749-17:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 17: Neutron irradiation

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EN-FR Y Webstore
IEC 60749-18:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 18: Ionizing radiation (total dose)

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EN-FR Y Webstore
IEC 60749-19:2010+AMD1:2010 CSV ED1.1

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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EN-FR U Webstore
IEC 60749-19:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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EN-FR Y Webstore
IEC 60749-19:2003/AMD1:2010 ED1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 19: Die shear strength

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EN-FR 2010-08 Y Webstore
IEC 60749-20:2008 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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EN-FR 2008-12 Y Webstore
IEC 60749-20:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

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EN-FR 2002-09 Y 47/1638/FDIS PDF file 644 kB
PDF file 688 kB
IEC 60749-20:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic-encapsulated SMDs to the combined effect of moisture and soldering heat

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EN-FR U
IEC 60749-20-1:2009 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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EN-FR 2009-04 Y Webstore
IEC 60749-21:2011 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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EN-FR 2011-04 Y Webstore
IEC 60749-21:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

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EN-FR 2004-03 Y 47/1741/FDIS PDF file 392 kB
IEC 60749-21:2004/FRAGF ED1

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability

MERGED
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EN-FR U
IEC 60749-22:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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EN-FR Y Webstore
IEC 60749-22:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 22: Bond strength

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EN-FR U Webstore
IEC 60749-23:2011+AMD1:2011 CSV ED1.1

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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EN-FR U Webstore
IEC 60749-23:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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EN-FR Y Webstore
IEC 60749-23:2004/AMD1:2011 ED1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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  • Publication issued
EN-FR 2011-02 Y Webstore
IEC 60749-24:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

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EN-FR Y Webstore
IEC 60749-24:2004/FRAGF ED1

Semiconductor devices - Mechanical and climatic test methods - Part 24: Accelerated moisture resistance - Unbiased HAST

MERGED
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  • Publication merged with EN version
EN-FR U
IEC 60749-25:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

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EN-FR Y Webstore
IEC 60749-26 ED4

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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IEC 60749-26:2013 ED3

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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IEC 60749-26:2006 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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IEC 60749-26:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

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IEC 60749-27:2006 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

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IEC 60749-27:2006/AMD1:2012 ED2

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

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IEC 60749-27:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine model (MM)

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IEC 60749-28 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

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IEC 60749-28/FRAG1 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM)

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IEC 60749-29:2011 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

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IEC 60749-29:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

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IEC 60749-30:2011+AMD1:2011 CSV ED1.1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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IEC 60749-30:2005 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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IEC 60749-30:2005/AMD1:2011 ED1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 30: Preconditioning of non-hermetic surface mount devices prior to reliability testing

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IEC 60749-31:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

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IEC 60749-31:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 31: Flammability of plastic-encapsulated devices (internally induced)

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IEC 60749-32:2010+AMD1:2010 CSV ED1.1

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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IEC 60749-32:2002 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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IEC 60749-32:2002/COR1:2003 ED1

Corrigendum 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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IEC 60749-32:2002/AMD1:2010 ED1

Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 32: Flammability of plastic-encapsulated devices (externally induced)

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IEC 60749-33:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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IEC 60749-33:2004/FRAGF ED1

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave

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IEC 60749-34:2010 ED2

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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IEC 60749-34:2004 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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IEC 60749-34:2004/FRAGF ED1

Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

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IEC 60749-35:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 35: Acoustic microscopy for plastic encapsulated electronic components

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IEC 60749-36:2003 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 36: Acceleration, steady state

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IEC 60749-37:2008 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer

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EN-FR 2008-02 Y Webstore
IEC 60749-38:2008 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 38: Soft error test method for semiconductor devices with memory

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IEC 60749-39:2006 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 39: Measurement of moisture diffusivity and water solubility in organic materials used for semiconductor components

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IEC 60749-40:2011 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 40: Board level drop test method using a strain gauge

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IEC 60749-41 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 41: Reliability testing methods of non-volatile memory devices

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IEC 60749-42:2014 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage

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IEC 60749-43 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 43: Guidelines for IC reliability qualification plans

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IEC 60749-44:2016 ED1

Semiconductor devices - Mechanical and climatic test methods - Part 44: Neutron beam irradiated single event effect (SEE) test method for semiconductor devices

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EN-FR 2016-08 Y Webstore
IEC 61189-4 ED1

Moisture sensitivity assessment standard for surface mounted integrated circuits - Part of IEC 1189-4: Test methods for electronic component assembling characteristics

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IEC 61929/FRAG2 ED1

Wire ball shear test

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EN U 47A/409/NP
IEC 61932 ED1

Simulation of mounting of surface mounted devices

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EN U 47A/411/NP
IEC 62047 ED1

Measurement and measurement devices for microelectromechanical devices

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EN U 47/1407/NP PDF file 185 kB
IEC PAS 62050:2004 ED1

Board level drop test method of components for handheld electronic products

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IEC 62113 ED1

NP-CDV: Semiconductors Product - discontinuance notification for semiconductors

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PDF file 35 kB
IEC 62113 ED1

NP-CDV: Semiconductors Product - discontinuance notification for semiconductors

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IEC 62161 ED1

Test method A101-B - Steady state, Temperature humidity bias life test

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IEC PAS 62161:2000 ED1

Steady state temperature humidity bias life test

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IEC 62162 ED1

Test method C101 - Field-induced charged-device model test, Method for electrostatic discharge withstand thresholds of microelectronic components

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IEC PAS 62162:2000 ED1

Field-induced charged-device model test method for electrostatic discharge withstand thresholds of microelectronic components

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IEC 62163 ED1

JESD22-B - Test method B101 - External visual

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IEC PAS 62163:2000 ED1

External visual test method

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IEC PAS 62164:2000 ED1

Guidelines for GAAs MMIC and FET life testing

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IEC 62164 ED1

Guidelines for GaAs MMIC and FET life testing

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IEC PAS 62165:2000 ED1

Guidelines for the measurement of thermal resistance of GaAs FETs

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IEC 62165 ED1

Guidelines for the measurement of thermal resistance of GaAs FETs

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IEC 62166 ED1

Guidelines for user notification of product/process changes by semiconductor suppliers

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IEC PAS 62166:2000 ED1

Guidelines for user notification of product/process changes by semiconductor suppliers

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IEC 62167 ED1

Product discontinuance

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IEC PAS 62167:2000 ED1

Product discontinuance

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IEC PAS 62168:2000 ED1

Symbols and labels for moisture-sensitive devices

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IEC 62168 ED1

Symbol and labels for moisture-sensitive devices

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IEC PAS 62169:2000 ED1

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices

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IEC 62169 ED1

Standard for handling, packing, shipping and use of moisture/reflow sensitive surface mount devices

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IEC 62170 ED1

Bond wire modeling standard

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IEC PAS 62170:2000 ED1

Bond wire modeling standard

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IEC PAS 62171:2000 ED1

Guidelines for particle impact noise detection (PIND) testing, operator training and certification

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IEC 62171 ED1

Guidelines for particle impact noise detection (PIND) testing, operator training and certification

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IEC 62172 ED1

JESD22-A102-B - Accelerated moisture resistance - Unbiased autoclave

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IEC PAS 62172:2000 ED1

Accelerated moisture resistance - Unbiased autoclave

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IEC 62173 ED1

EIA/JESD22-B102C - Solderability test method

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IEC PAS 62173:2000 ED1

Solderability test method

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IEC PAS 62174:2000 ED1

Resistance to soldering temperature for through-hole mounted devices

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IEC 62174 ED1

Resistance to soldering temperature for through-hole mounted devices

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IEC 62175 ED1

EIA/JESD22-B107-A - Marking Permanency

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IEC PAS 62175:2000 ED1

Marking permanency test method

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IEC 62176 ED1

Wire bond shear test method

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IEC PAS 62176 ED1

Wire bond shear test method

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EN U 47/1449/PAS PDF file 159 kB
IEC PAS 62177:2000 ED1

Highly-accelerated temperature and humidity stress test (HAST)

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IEC 62177 ED1

JESD22-A110-B - Highly-accelerated temperature and humidity stress test (HAST)

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IEC 62178 ED1

Temperature cycling

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IEC PAS 62178:2000 ED1

Temperature cycling

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IEC 62179 ED1

Electrostatic discharge (ESD) Sensitivity testing human body model (HBM)

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IEC PAS 62179:2000 ED1

Electrostatic discharge (ESD) sensitivity testing human body model (HBM)

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IEC 62180 ED1

Electrostatic discharge (ESD) Sensitivity testing machine model (MM)

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IEC PAS 62180:2000 ED1

Electrostatic discharge (ESD) sensitivity testing machine model (MM)

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EN U 47/1453/PAS PDF file 200 kB
IEC 62181 ED1

IC latch-up test

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IEC PAS 62181:2000 ED1

IC latch-up test

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IEC PAS 62182:2000 ED1

Preconditioning of nonhermetic surface mount devices prior to reliability testing

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IEC 62182 ED1

Preconditioning of non-hermetic surface mount devices prior to reliability testing

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IEC 62183 ED1

JESD22-A107-A - Salt atmosphere

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IEC PAS 62183:2000 ED1

øSalt atmosphere Salt atmosphere

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IEC 62184 ED1

Lead integrity

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IEC PAS 62184:2000 ED1

Lead integrity test method

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IEC 62185 ED1

JESD22-A106-A - Test method A106-A - Thermal shock

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IEC PAS 62185:2000 ED1

Thermal shock test method

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IEC 62186 ED1

JESD22-B104-A - Test method B104-A - Mechanical shock

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IEC PAS 62186:2000 ED1

Mechanical shock test method

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IEC PAS 62187:2000 ED1

Variable frequency vibration test method

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IEC 62187 ED1

JESD22-B103-A - Test Method B103-A - A vibration, variable frequency

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IEC 62189 ED1

JESD22-A108-A: Bias Life

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IEC 62190 ED1

Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices

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IEC PAS 62190:2000 ED1

Moisture/reflow sensivity classification for nonhermetic solid state surface mount devices

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IEC PAS 62191:2000 ED1

Acoustic microscopy for nonhermetic encapsulated electronic components

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IEC 62191 ED1

Acoustic Microscopy for Nonhermetic Encapsulated Electronic Components

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IEC 62201 ED1

A Procedure for Executing SWEAT

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IEC PAS 62201:2000 ED1

A procedure for executing SWEAT

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IEC 62202 ED1

Failure Mechanisms and Models for Silicon Semiconductor Devices

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IEC PAS 62202:2000 ED1

Failure mechanisms and models for silicon semiconductor devices

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IEC PAS 62203:2000 ED1

Guide for the standard probe pad sizes and layouts for wafer-level electrical testing

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IEC 62203 ED1

Guide for Standard Probe Pad Sizes and Layouts for Wafer-Level Electrical Testing

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IEC PAS 62204:2000 ED1

Standard method for measuring and using the temperature coefficient of resistance to determine the temperature of a metallization line

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IEC 62204 ED1

Standard Method for Measuring and Using the Temperature Coefficient of Resistance to Determine the Temperature of a Metallization Line

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IEC 62205 ED1

High Temperature Storage Life

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IEC PAS 62205:2000 ED1

High temperature storage life

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IEC 62206 ED1

EIA/JESD22-A105-B - Test Method A105-B - Power and Temperature Cycling

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IEC PAS 62206:2000 ED1

Power and temperature cycling

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IEC 62207 ED1

Hermeticity

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IEC 62228 ED1

Hot carrier test on MOS transistors

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IEC 62229 ED1

Triangular voltage sweep test procedure

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IEC 62258-1:2009 ED2

Semiconductor die products - Part 1: Procurement and use

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IEC 62258-1:2005 ED1

Semiconductor die products - Part 1: Requirements for procurement and use

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IEC 62258-2:2011 ED2

Semiconductor die products - Part 2: Exchange data formats

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IEC 62258-2:2005 ED1

Semiconductor die products - Part 2: Exchange data formats

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IEC TR 62258-3:2010 ED2

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

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IEC TR 62258-3:2005 ED1

Semiconductor die products - Part 3: Recommendations for good practice in handling, packing and storage

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IEC TR 62258-4:2012 ED2

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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IEC TR 62258-4:2007 ED1

Semiconductor die products - Part 4: Questionnaire for die users and suppliers

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ZIP file 348 kB
IEC 62258-5:2006 ED1

Semiconductor die products - Part 5: Requirements for information concerning electrical simulation

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IEC 62258-6:2006 ED1

Semiconductor die products - Part 6: Requirements for information concerning thermal simulation

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IEC TR 62258-7:2007 ED1

Semiconductor die products - Part 7: XML schema for data exchange

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EN 2007-11 Y Webstore
IEC TR 62258-8:2008 ED1

Semiconductor die products - Part 8: EXPRESS model schema for data exchange

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EN 2008-05 Y Webstore
IEC PAS 62307:2002 ED1

Test method for the measurement of moisture diffusivity and water solubility in organic materials used in integrated circuits

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IEC PAS 62336:2002 ED1

Accelerated Moisture Resistance - Unbiased HAST

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IEC 62336 ED1

IEC/PAS 62336, Ed.1: (JESD22- A118) - Accelerated Moisture Resistance - Unbiased HAST

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  • DEL
  • Deleted items
EN U 47/1635/PAS PDF file 123 kB
IEC 62373:2006 ED1

Bias-temperature stability test for metal-oxide, semiconductor, field-effect transistors (MOSFET)

PPUB
  • PPUB
  • Publication issued
EN-FR 2006-09 Y Webstore
IEC 62374:2007 ED1

Semiconductor devices - Time dependent dielectric breakdown (TDDB) test for gate dielectric films

PPUB
  • PPUB
  • Publication issued
EN-FR 2007-01 Y Webstore
IEC 62374-1:2010 ED1

Semiconductor devices - Part 1: Time-dependent dielectric breakdown (TDDB) test for inter-metal layers

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-10 Y Webstore
IEC 62415:2010 ED1

Semiconductor devices - Constant current electromigration test

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-06 Y Webstore
IEC 62416:2010 ED1

Semiconductor devices - Hot carrier test on MOS transistors

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-04 Y Webstore
IEC 62417:2010 ED1

Semiconductor devices - Mobile ion tests for metal-oxide semiconductor field effect transistors (MOSFETs)

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-04 Y Webstore
IEC 62418:2010 ED1

Semiconductor devices - Metallization stress void test

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-05 Y Webstore
IEC PAS 62435:2005 ED1

Electronic components - Long-duration storage of electronic components - Guidance for implementation

PPUB
  • PPUB
  • Publication issued
EN U Webstore
IEC 62435/FRAG1 ED1

Electronic Components - Long duration storage of electronic components guide for implementation

MERGED
  • MERGED
  • Fragment merged
EN 2008-12 U 47/1792/NP PDF file 364 kB
IEC 62435-1 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 1: General

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN-FR 2017-02 Y 47/2326/FDIS PDF file 317 kB
PDF file 347 kB
IEC 62435-2 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 2 - Deterioration Mechanisms

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN-FR 2017-02 Y 47/2327/FDIS PDF file 267 kB
PDF file 310 kB
IEC 62435-4 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 4: Storage

CD
  • CD
  • Draft circulated as CD
EN U 47/2324/CD PDF file 240 kB
IEC 62435-5 ED1

Electronic components - Long-term storage of electronic semiconductor devices - Part 5 - Die & Wafer Devices

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN-FR 2017-02 Y 47/2328/FDIS PDF file 265 kB
PDF file 292 kB
IEC 62483:2013 ED1

Environmental acceptance requirements for tin whisker susceptibility of tin and tin alloy surface finishes on semiconductor devices

PPUB
  • PPUB
  • Publication issued
EN-FR 2013-10 N Webstore
IEC PAS 62483:2006 ED1

Test method for measuring whisker growth on tin and tin alloy surface finishes

DELPUB
  • DELPUB
  • Publication Deleted
EN 2006-09 U 47/1842/NP PDF file 1872 kB
IEC 62615:2010 ED1

Electrostatic discharge sensitivity testing - Transmission line pulse (TLP) - Component level

PPUB
  • PPUB
  • Publication issued
EN-FR 2010-06 N Webstore
IEC 62779-1:2016 ED1

Semiconductor devices - Semiconductor interface for human body communication - Part 1: General requirements

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-02 Y Webstore
IEC 62779-2:2016 ED1

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-02 Y Webstore
IEC 62779-3:2016 ED1

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions

PPUB
  • PPUB
  • Publication issued
EN-FR 2016-04 Y Webstore
IEC 62830-1 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 1: Vibration based piezoelectric energy harvesting

RFDIS
  • RFDIS
  • FDIS received and registered
EN-FR 2017-05 Y 47/2214/CDV
PDF file 482 kB
PDF file 529 kB
IEC 62830-2 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 2: Thermo power based thermoelectric energy harvesting

CFDIS
  • CFDIS
  • Draft circulated as FDIS
EN-FR 2017-02 Y 47/2329/FDIS PDF file 469 kB
PDF file 468 kB
IEC 62830-3 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 3: Vibration based electromagnetic energy harvesting

RFDIS
  • RFDIS
  • FDIS received and registered
EN-FR 2017-05 Y 47/2232/CDV
PDF file 1231 kB
PDF file 1435 kB
IEC 62830-4 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 4: Test and evaluation methods for flexible piezoelectric energy harvesting devices

CD
  • CD
  • Draft circulated as CD
EN 2018-09 U 47/2338/CD PDF file 1079 kB
IEC 62830-5 ED1

Semiconductor devices - Semiconductor devices for energy harvesting and generation - Part 5: Test method for measuring generated power from flexible thermoelectric devices

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2234/NP PDF file 850 kB
IEC 62880-1 ED1

Semiconductor devices - Stress Migration Test Standard - Part 1: Copper Stress Migration Test Standard

PRVC
  • PRVC
  • Preparation of RVC
EN 2017-07 Y 47/2296/CDV
PDF file 992 kB
IEC 62951-1 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 1: Bending test method for conductive thin films on flexible substrates

PRVC
  • PRVC
  • Preparation of RVC
EN-FR 2017-05 Y 47/2256/CDV
PDF file 591 kB
PDF file 713 kB
IEC 62951-2 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 2: Acceleration test for electron mobility, sub-threshold swing, and threshold voltage of flexible devices

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2235/NP PDF file 408 kB
IEC 62951-3 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 3: Evaluation of thin film transistor characteristics (?, SS, Vth) on flexible substrates under bulging

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2236/NP PDF file 843 kB
IEC 62951-4 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 4: Fatigue evaluation for films and substrates for flexible semiconductor devices

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2237/NP PDF file 460 kB
IEC 62951-5 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 5: Test method for thermal characteristics of flexible materials and devices

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2238/NP PDF file 3393 kB
IEC 62951-6 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 6: Test method for sheet resistance of flexible conducting films

ACD
  • ACD
  • Approved for CD
EN 2018-09 U 47/2239/NP PDF file 528 kB
IEC 62951-7 ED1

Semiconductor devices - Flexible and stretchable semiconductor devices - Part 7: Test method for characterizing the barrier performance of thin film encapsulation for flexible organic semiconductor

ACD
  • ACD
  • Approved for CD
EN 2019-07 U 47/2284/NP PDF file 583 kB
IEC 62969-1 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 1: General requirements of power interface for automotive vehicle sensors

CCDV
  • CCDV
  • Draft circulated as CDV
EN 2017-12 Y 47/2319/CDV
PDF file 500 kB
IEC 62969-2 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 2: Efficiency evaluation methods of wireless power transmission using resonance for automotive vehicles sensors

CCDV
  • CCDV
  • Draft circulated as CDV
EN 2017-12 Y 47/2321/CDV
PDF file 458 kB
IEC 62969-3 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 3: Shock driven piezoelectric energy harvesting for automotive vehicle sensors

ACDV
  • ACDV
  • Approved for CDV
EN 2017-08 U 47/2274/CD PDF file 1593 kB
IEC 62969-4 ED1

Semiconductor devices - Semiconductor interface for automotive vehicles - Part 4: Evaluation method of data interface for automotive vehicle sensors

PCC
  • PCC
  • Preparation of CC
EN 2017-08 U 47/2275/CD PDF file 348 kB
IEC 63068-1 ED1

Semiconductor devices - Non-destructive recognition criteria of defects in silicon carbide homoepitaxial wafer for power devices - Part 1: Classification of defects

CD
  • CD
  • Draft circulated as CD
EN 2019-07 U 47/2334/CD PDF file 1866 kB