International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 6 Convenor & Members

Convenor
National

Committee
Mr Hisao Kasuga
 JP
Mr Hajime TOMOKAGE
 JP
Member
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National

Committee
Mr Masashi AokiJP
Mr Jasbir BathUS
Mr Norbert BauerDE
Mr Dieter W. BergmanUS
Mr Jung Soo ByunKR
Mr Nae Eul ChoKR
Mr Walter HuckDE
Mr Chris HuntGB
Mr Young-Min ImKR
Mr Hyun Ho KimKR
Ms KyoungHee LeeKR
Mr Jin ho LeeKR
Mr Luciano MantovaniIT
Mr Hironori OtaJP
Mr Kimmo B. SaarinenFI
Mr Gabriele SalaIT
Mr Andy SeoKR
Mr Mandar Pramod sinnarkarIN
Mr Thomas StoekDE
Mr Kunio TAKAHARAJP
Mr Masahiro TamboJP
Mr Michail P. UtkinRU
Mr Jürgen WolfDE
Mr Hiroshi YAMAZAKIJP
Mr ChanWoo YANGKR
Mr Kishio YOKOUCHIJP

Title & Task

WG 6

Printed boards - Device Embedded Substrate - Terminology / Reliability /Design Guide

 

To prepare guidelines for new type of Printed boards - Device Embedded Substrate. Development of this document may include various viewpoints such as test method, selecting materials so on in addition to Terminology / Reliability /Design Guide. The contribution of this guideline document is expected to be convenient both for suppliers and buyers all who are interested in this market.