International
Electrotechnical
Commission
International Standards and Conformity Assessment
for all electrical, electronic and related technologies
TC 91 |
Electronics assembly technology |
WG 1 Convenor & Members
Convenor | National Committee | |
|---|---|---|
Mr Walter Huck | DE | |
Member  |  National Committee |
|---|---|
| Mr Masashi Aoki | JP |
| Mr Dieter W. Bergman | US |
| Mr Hanseo Cho | KR |
| Mr Peter Grundy | GB |
| Mr SangWon Ha | KR |
| Mr Toshiro Hiramoto | JP |
| Mr Michael Krapp | DE |
| Mr Arkady M. Medvedev | RU |
| Mr Hiroshi Oshima | JP |
| Sechuel Park | KR |
| Mr Kimmo B. Saarinen | FI |
| Mr Koji Serizawa | JP |
| Mr Mandar Pramod sinnarkar | IN |
| Mr Douglas J Sober | US |
| Mr Masahiro Tambo | JP |
| Mr Michail P. Utkin | RU |
| Mr Joachim Von Der Ohe | DE |
| Mr Udo Welzel | DE |
| Mr Katsumi Yamamoto | JP |
| Mr Vladimir N. Zverev | RU |
Title & Task
WG 1
Requirements for electronic components
-Describe how the assembly process stresses the SMD's.
-Find a suitable classification for the SMD's to meet the
different process conditions.
-Find out and describe the tests, with which this
classification can be demonstrated.
Liaisons
Organizations | Liaison Member |
|---|---|
| Liaison D | |
| IPC | |
| JEITA | |
| JPCA | |