International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 10 Convenor & Members

Convenor
National

Committee
Mr Kunio TAKAHARA
 JP
Member
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National

Committee
Mr Jung Soo ByunKR
Ms Qiaoer, Tracy CaiCN
Mr Samgo CaiCN
Mr yi caoCN
Mr Nae Eul ChoKR
Mr Ying GECN
Mr Sang-Won HaKR
Mr Chris HuntGB
Mr Kenichi IkedaJP
Mr Young-Min ImKR
Mr Gwang-Moo KimKR
Mr Hyun Ho KimKR
Mr Michael KrappDE
Mr Byeong-Il LeeKR
Mr Jin ho LeeKR
Ms KyoungHee LeeKR
Mr Sang Ho LeeKR
Mr Min-su LeeKR
Mr Arkady M. MedvedevRU
Mr Graham NaisbittGB
Mr Hidetaka OkamotoJP
Mr Hans Joachim RenkeDE
Mr Kris RobersonUS
Mr Andy SeoKR
Mr Mandar Pramod sinnarkarIN
Mr Douglas J SoberUS
Mr Takayuki SUZUKIJP
Mr Hiroki TamiyaJP
Mr Michail P. UtkinRU
Mr Hong-Bok WeKR
Mr Udo WelzelDE
Mr Hiroshi YAMAZAKIJP
Mr ChanWoo YANGKR

Title & Task

WG 10

Measuring and test methods for printed boards and printed board materials

 

Review the test methods of IEC 249-1 (Base materials), of IEC
326-2 (Printed boards) and those test methods of IEC 68-2 that
apply to base materials, printed boards and printed board
assemblies.

Analyse the effectiveness of the existing methods and identify
those methods which have hazardous materials or have
environmental impact.

To develop proposed revision of those methods that have been
identified as hazardous or having an environmental impact.

To recommend change or deletion of those methods identified in
the survey as no longer being effective.

To start work on new methods.

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Liaisons

Organizations
Liaison Member
Liaison D
IPC 
JEITA 
JPCA