International Standards and Conformity Assessment for all electrical, electronic and related technologies

TC 91

Electronics assembly technology

 
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WG 3 Convenor & Members

Convenor
National

Committee
Mr Hisao Kasuga
 JP
Member
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National

Committee
Mr Masashi AokiJP
Mr Hideyuki ArakaneJP
Mr Uwe BlosfeldDE
Mr Lutz BruderreckDE
Mr Jung Soo ByunKR
Mr Sangsuk ChaKR
Mr Nae Eul ChoKR
Mr Sergey V. DzyubanenkoRU
Mr Koichi HagioJP
Mr Toshiro HiramotoJP
Mr Walter HuckDE
Mr Chris HuntGB
Mr Young-Min ImKR
Mr Tsuyoshi InageJP
Mr Vladimir D. IvinRU
Mr Ki-do JeonKR
Mr Yoshiharu KariyaJP
Mr Hyun Ho KimKR
Mr Jin ho LeeKR
Mr Mitsuhiro MatsumuraJP
Mr Arkady M. MedvedevRU
Mr Greg MunieUS
Mr Graham NaisbittGB
Mr Anton NisanRU
Mr Hiroshi NishikawaJP
Mr Masahide OkamotoJP
Mr Hiroshi OshimaJP
Sechuel ParkKR
Mr Kris RobersonUS
Mr Kimmo B. SaarinenFI
Mr Ichizo SakamotoJP
Mr Matthias SchmidtDE
Mr Koji SerizawaJP
Mr Mandar Pramod sinnarkarIN
Mr Masaki SuwaJP
Mr Masahiro TamboJP
Mr Stephen TisdaleUS
Mr Sadayuki TomaJP
Mr Michail P. UtkinRU
Mr Alexei G. VoltchkovRU
Mr Joachim Von Der OheDE
Mr Vesa VuorinenFI
Mr Udo WelzelDE
Mr Katsumi YamamotoJP
Mr Tsuyoshi YAMAMOTOJP
Mr Anton M. ZagrebinRU

Title & Task

WG 3

Measuring and test methods for electronics assemblies

 

Development of measuring and test methods specific to surface
mounting technology and not covered by other technical
committees of the IEC.

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Liaisons

Organizations
Liaison Member
Liaison D
IPC 
JEITA 
JPCA