WG 2

Requirements for electronics assemblies

To establish international acceptance for standards and
guidelines in surface mounted assembly technology. The
standards and guidelines are to be developed through a
systematic review of existing standards or working through
member country standards organizations to refine or create new
standards related to surface mounted technology.

Areas of immediate work will include evaluating standards or
quidelines for the following:

1. Assembly process definitions (methods and options)

2. Solder material, fluxes and cleaning standards

3. Solder joint and workmanship standards (NTL-STD-SOLD)

4. Substrate material selection and specification

5. Requirements for writing specifications for SMT

6. In process test and measurement methods

7. Assembly equipment capability evaluation guidelines.